• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.21-21
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• 1996

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.05a
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• pp.48-49
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• 1994

• Journal of Powder Materials
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• v.15 no.5
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• pp.345-351
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• 2008

The effects of the dopant (Mn) ratio on the microstructure and thermoelectric properties of $FeSi_2$ alloy were studied in this research. The alloy was fabricated by a combination process of ball milling and high pressure pressing. Structural behavior of the sintered bulks were systematically investigated by XRD, SEM, and optical microscopy. With increasing dopan (Mn) ratio, the density and ${\varepsilon}-FeSi$ phase of the sintered bulks increased and maximum density of 94% was obtained in the 0.07% Mn-doped alloy. The sintered bulks showed fine microstructure of ${\alpha}-Fe_{2}Si_{5}$, ${\varepsilon}-FeSi$ and ${\beta}-FeSi_2$ phase. The semiconducting phase of ${\beta}-FeSi_2$ was transformed from ${\alpha}-Fe_{2}Si_{5}+{\varepsilon}-FeSi$ phase by annealing.

• Korean Journal of Materials Research
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• v.27 no.8
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• pp.438-444
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• 2017

In this work, the effects of hydrogen reduction on the microstructure and thermoelectric properties of $(GeTe)_{0.85}(AgSbTe_2)_{0.15}$ (TAGS-85) were studied by a combination of gas atomization and spark plasma sintering. The crystal structure and microstructure of TAGS-85 were characterized by X-ray diffraction(XRD) and scanning electron microscopy (SEM). The oxygen content of both powders and bulk samples were found to decrease with increasing reduction temperature. The grain size gradually increased with increasing reduction temperature due to adhesion of fine grains in a temperature range of 350 to $450^{\circ}C$. The electrical resistivity was found to increase with reduction temperature due to a decrease in carrier concentration. The Seebeck coefficient decreased with increasing reduction temperature and was in good agreement with the carrier concentration and carrier mobility. The maximum power factor, $3.3{\times}10^{-3}W/mK^2$, was measured for the non-reduction bulk TAGS-85 at $450^{\circ}C$.

• Korean Journal of Materials Research
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• v.16 no.9
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• pp.529-532
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• 2006

Sn-filled $Co_8Sb_{24}$ skutterudites were synthesized by the encapsulated induction melting process. Single ${\delta}-phase$ was successfully obtained by subsequent annealing and confirmed by X-ray diffraction analysis. Temperature dependences of Seebeck coefficient, electrical resistivity and thermal conductivity were examined from 300 K to 700 K. The positive Seebeck coefficient confirmed the p-type conductivity of the Sn-filled $Co_8Sb_{24}$. Electrical resistivity increased with increasing temperature, which shows that the Sn-filled $Co_8Sb_{24}$ skutterudite is a highly degenerate semiconductor. Thermal conductivity was reduced by Sn-filling because the filler atoms acted as phonon scattering centers in the skutterudite lattice. Thermoelectric figure of merit was enhanced by Sn filling and its optimum filling content was considered to be $z{\leq}0.5$ in the $Sn_zCo_8Sb_{24}$ system.

• Korean Journal of Metals and Materials
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• v.50 no.11
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• pp.839-845
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• 2012

The effect of an AlN additive on the thermoelectric properties of SiC ceramics was studied. Porous SiC ceramics with 48-54% relative density were fabricated by sintering the pressed ${\alpha}-SiC$ powder compacts with AlN at $2100-2200^{\circ}C$ for 3 h in an Ar atmosphere. In the undoped specimens, the Seebeck coefficients were positive (p-type semiconducting) possibly due to a dominant effect of the acceptor impurities (Al, Fe) contained in the starting powder. With AlN addition, the reverse phase transformation of 6H-SiC to 4H-SiC was observed during the sintering process. The electrical conductivity of the AlN doped specimen was larger than that of the undoped specimen under the same conditions, which might be due to a reverse phase trans-formation. The Seebeck coefficient of the AlN doped specimen was also larger than that of the undoped specimen. The density of specimen and the amount of addition had significant effects on the thermoelectric properties.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.49-54
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• 2010

The n-type $Bi_2(Te,Se)_3$ powders were fabricated by melting/grinding method and were hot-pressed in order to compare thermoelectric properties of the hot-pressed specimens with those of the $Bi_2(Te,Se)_3$ ingot. Effects of mechanical milling treatment of the $Bi_2(Te,Se)_3$ powders on thermoelectric characteristics of a hot-pressed specimen were also examined. The hot-pressed $Bi_2(Te,Se)_3$ exhibited power factors of $27.3{\sim}32.3{\times}10^{-4}W/m-K^2$ which were superior to $24.2{\times}10^{-4}W/m-K^2$ of the ingot. The $Bi_2(Te,Se)_3$, hot-pressed after mechanical milling treatment of the powders, possessed a non-dimensional figure-of-merit of 1.02 at $100^{\circ}C$ and exhibited extrinsic-intrinsic transition at $130^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.340-344
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• 2011

Thermoelectric bismuth telluride ($Bi_2Te_3$) films were deposited on $4^{\circ}$ off oriented (001) GaAs substrates using a modified metal organic chemical vapor deposition (MOCVD) system. The effects of substrate temperature on surface morphologies, crystallinity, electrical properties and thermoelctric properties were investigated. Two dimensional growth mode (2D) was observed at substrate temperature lower than $400^{\circ}C$. However, three dimensional growth mode (3D) was observed at substrate temperature higher than $400^{\circ}C$. Change of growth mechanism from 2D to 3D was confirmed with environmental scanning electron microscope (E-SEM) and X-ray diffraction analysis. Seebeck coefficients of all samples have negative values. This result indicates that $Bi_2Te_3$ films grown by modified MOCVD are n-type. The maximum value of Seebeck coefficient was -225 ${\mu}V/K$ and the power factor was $1.86{\times}10^{-3}\;W/mK^2$ at the substrate temperature of $400^{\circ}C$. $Bi_2Te_3$ films deposited using modified MOCVD can be used to fabricate high-performance thermoelectric devices.

• Journal of Environmental Health Sciences
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• v.33 no.2 s.95
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• pp.83-91
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• 2007

This study investigated the health effects of offensive odor in residents living near the petrochemical industry complex area(PICA) and the thermoelectric power plant(TPP) by using questionnaire. Residents who felt the offensive odor were 58.3% at PICA, 50.9% at TPP and 24.4% at classical fishing and agrarian villages (CFAV)(p=0.000). People who answered that the offensive odor was sever at CFAV were 95.2% only on summer, but at PICA and TPP, were 44.1% and 57.3% on Spring, 62.4% and 68.8% on Summer, 22.0% and 31.7% on Autumn, and 21.7% and 25.7% on Winter, respectively. Average days that the odor occurred were 4.4 days/month at CFAV, but 12.0 and 9.5 days/month at PICA and TPP, respectively. People who experienced the sleep disturbance were 28.0% and 27.1% at PICA and TPP, respectively. The most frequently subjective symptoms were headache(0.953), frequently sneezing(0.825), itchy eyes(0.766), and stimulating eyes(0.709) at PICA, and headache(1.082), itchy eyes(0.931), itchy skin(0.826), and frequent sneezing(0.674) at TPP, respectively. At PICA and TPP, the occurrence rates of diseases in respondents' families were 15.4% and 15.6% for asthma, 12.4% and 9.2% for respiratory diseases, 27.8% and 31.2% for skin diseases, and 9.1% and 6.9% for nervous diseases, respectively. In conclusion, many residents who living near the PICA and TPP experienced the offensive odor during four seasons, especially high on summer, the most frequently subjective symptoms such as headache, itchy and stimulating eyes, frequently sneezing, and some diseases among their families such as asthma, respiratory diseases, skin diseases, and nervous diseases.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.26-26
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• 2005