• Macromolecular Research
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• v.15 no.4
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• pp.363-369
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• 2007

Novel biodegradable elastic hydrogels, based on hydrophilic and hydrophobic polymer blocks, were synthesized via the radical crosslinking reaction of diacrylates of poly(ethylene glycol) (PEG) and poly(${\varepsilon}-caprolactone$) (PCL). PEG and PCL diols were diacrylated with acryloyl chloride in the presence of triethylamine, with the reaction confirmed by FT-IR and $^1H-NMR$ measurements. The diacrylate polymers were used as building-blocks for the syntheses of a series of hydro gels, with different block compositions, by simply varying the feed ratios and molecular weights of the block components. The swelling ratio of the hydrogels was controlled by the balance between the hydrophilic and hydrophobic polymer blocks. Usually, the swelling ratio increases with increasing PEG content and decreasing block length within the network structure. The hydrogels exhibited negative thermo-sensitive swelling behavior due to the coexistence of hydrophilic and hydrophobic polymer components in their network structure, and such thermo-responsive swelling/deswelling behavior could be repeated using a temperature cycle, without any significant change in the swelling ratio. In vitro degradation tests showed that degradation occurred over a 3 to 8 month period. Due to their biodegradability, biocompatibility, elasticity and functionality, these hydrogels could be utilized in various biomedical applications, such as tissue engineering and drug delivery systems.

• Steel and Composite Structures
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• v.34 no.4
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• pp.511-524
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• 2020

In this research, a simple four-variable trigonometric integral shear deformation model is proposed for the static behavior of advanced functionally graded (AFG) ceramic-metal plates supported by a two-parameter elastic foundation and subjected to a nonlinear hygro-thermo-mechanical load. The elastic properties, including both the thermal expansion and moisture coefficients of the plate, are also supposed to be varied within thickness direction by following a power law distribution in terms of volume fractions of the components of the material. The interest of the current theory is seen in its kinematics that use only four independent unknowns, while first-order plate theory and other higher-order plate theories require at least five unknowns. The "in-plane displacement field" of the proposed theory utilizes cosine functions in terms of thickness coordinates to calculate out-of-plane shear deformations. The vertical displacement includes flexural and shear components. The elastic foundation is introduced in mathematical modeling as a two-parameter Winkler-Pasternak foundation. The virtual displacement principle is applied to obtain the basic equations and a Navier solution technique is used to determine an analytical solution. The numerical results predicted by the proposed formulation are compared with results already published in the literature to demonstrate the accuracy and efficiency of the proposed theory. The influences of "moisture concentration", temperature, stiffness of foundation, shear deformation, geometric ratios and volume fraction variation on the mechanical behavior of AFG plates are examined and discussed in detail.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.17-25
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• 2006

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $moir\'{e}$ interferometry. $Moir\'{e}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for both single and double-sided package assemblies are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one because of its symmetric structure. The largest effective strain occurred at the solder ball located on the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one by 50%.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.7
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• pp.653-660
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• 2009

A helicopter rotor brake system stops or reduces the speed of the rotor by transforming the kinetic energy into the heat energy. The frictionally generated heat has a considerable effect on the frictional property of material itself and causes the change of the friction coefficient which may affect the breaking time significantly. In this paper, to take into account the effect of change of friction coefficient according to temperature on braking time, thermo-mechanically coupled analysis is carried out by commercial software ABAQUS. Further, simple theoretical equation is derived considering thermo-mechanical behaviors. The predicted braking times both from theoretical and numerical methods are compared and validity of proposed theoretical equation is investigated.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.554-557
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• 2008

In this study, two types of central flow distributor designs are presented and compared to obtain the optimal compact design which has the least flow resistance and the uniform flow distribution in a vehicular fuel cell stack. For effective and reliable prediction on the thermo-flow characteristics of the reactants flow over the entire fuel cell stack domain, open channel flow in the bipolar plates of the power generating cells were simulated by applying a simplified flow resistance model with an empirical porous concept. A number of case studies were performed to figure out an optimal configuration of a central flow distributor device in terms of the time-dependent thermo-flow behavior and load-dependent flow distribution. The results showed that the stable and load-independent thermo-flow uniformity is very design specific, which is closely associated with the design of central manifolding devices in order to achieve the enhanced volumetric power density and the reliable long-lasting operating of fuel cells.

• Journal of Microbiology and Biotechnology
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• v.11 no.6
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• pp.922-927
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• 2001

In an effort to regulate the mammalian cell behavior in entrapment with a gel, we have functionalized hydrogels with the putative cell-binding (-Arg-Gly-Asp-)(RGD) domain. An adhesion molecule of Gly-Arg-Gly-Asp-Ser (GRGDS) peptides, a cell recognition ligand, was induced into thermo-reversible hydrogels, composed of N-isopropylacrylamide with small amounts of acrylic acid (typically 2-5 $mol\%$ in feed), as a biomimetic extracellular matrix (ECM). The GRGDS containing a p(NiPAAm-co-AAc) copolymer gel was studied in vitro for its ability to promote the spreading and viability of cells by introducing a GRGDS sequence. Hydrogel with no adhesion molecule was a poor ECM for adhesion, permiting spreading of only $3\%$ of the seeded cells for 36h. By immobilizing the peptide linkage into the hydrogel, the conjugation of RGD promoted $50\%$ of proliferation for 36h. However, the GREDS sequence, nonadhesive peptide linkage, conjugated hydrogel showed only $5\%$ of the seeded cell for the same time period. In addition, with the serum-free medium, only GRGDS peptides conjugated to hydrogel was able to promotecell spreading, while there was no cell proliferation in the hydrogel without GRGDS. Thus, the GRGDS peptide-conjugated thermo-reversible hydrogel specifically mediated the cell spreading. This result suggests that utilization of peptide sequences conjugating with the cell-adhesive motifs can enhance the degree of cell surface interaction and influence the long-term formation of ECM in vitro.

• Macromolecular Research
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• v.10 no.2
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• pp.115-121
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• 2002

Synthesis of polymers with controlled thermosensitive properties was carried out by conventional radical copolymerization of N-isopropylacrylamide (NIPAAm) with N-vinylpyrrolidone (NVP) taken as a hydrophilic comonomer. Lower activity of NVP rather than NIPAAm was revealed by gravimetric and $^1$H NMR analysis. Thermosensitive properties of the copolymers were investigated. It was found that aqueous solutions of the copolymers undergo thermo-induced phase transition and become opaque, precipitate or gel with heating. After formation of the gels their significant contraction was observed at storage. Swelling degree and amount of expelled water were measured in dependence on the copolymer composition, temperature and ionic strength of environment medium and concentration of the solution. It was determined that in collapsed state gels exhibit quite high water content. According to physico-chemical properties of the copolymers observed they could be suitable for biomedical application as an injectable implant material.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.