• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.17-22
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• 2005

The residual birefringence in molded plastic parts can be divided into two kinds of residual birefringence, i.e., the flow induced residual birefringence produced in flowing stages and the thermally induced residual birefringence produced in cooling stage. In this paper, the effect of new injection-press molding process with normal injection mold, i.e. I) injection-compression mode, ii) injection-press mode, on the distribution of birefringence was studied. It was found that the values of the birefringence was reduced at i) low clamping force and ii) longer mold opening length by injection-press molding.

• Polymer(Korea)
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• v.24 no.3
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• pp.342-349
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• 2000

Hollow fiber membranes were prepared via thermally-induced phase separation process followed by stretching process from isotactic polypropylene and soybean oil system. Various operating parameters were examined in terms of their effects on the structure variation and performances of the membrane, and were optimized. Melt viscosity of the melt sample had influence on the formation of the microfibrils, and addition of nucleating agent increased the nucleation density to enhance the interspherulitic pore formation by stretching. Annealing the membrane at its stretched state relaxed the stress induced by stretching and helped the membrane maintain the stretched structure without shrinking. Solid-liquid Phase separation is more prevalent when the nucleating agent was added, and coagulation bath temperature determined the nucleation density, which affected the pore formation by stretching. In the absence of nucleating agent, nucleation was not effective and liquid-liquid phase separation governed the structure formation, which showed the opposite trend to that of the case with nucleating agent.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.4
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• pp.108-117
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• 1997

A continuum analysis has been performed for the application to the thermo-elasto-plastic behavior in a discontinuous metal matrix composite. an FEM (Finite Element Method) analysis was implemented to obtain the internal field quantities of composite as well as overall composite behavior and an experiment was demonstrated to compare with the numerical simulation . As the procedure, a reasonably optimized FE mesh generation, the appropriate imposition of boundary condition , and the relevant post processing such as elastoplastic thermomchanical analysis were taken into account. For the numerical illustration, an aligned axisymmetric single fiber model with temperature dependent material properties and precipitation hardening effect has been employed to assess field quantities. It was found that the residual stresses are induced substantially by the temperature drop during the thermal treatment and that the FEM results of the vertically and horizontally constrained model give a good agreement with experimental data.with non-woven carbon mat is about 24% higher than that of composite materials without non-woven carbon mat. Transverse tensile strength and torughness also increase by inserting non-woven carbon mat between layers.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.46-51
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• 2011

TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.4
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• pp.609-620
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• 1992

A numerical solution of temperature and thermally induced stress in a wafer during rapid thermal processing (R.T.P) is obtained, and an analysis of onset and propagation of slip is performed and compared with experiment. In order to calculate temperature distribution of a wafer in R.T.P system, heat conduction equation that incorporated with radiative and convective heat transfer model is solved, and the solution of the equation is calculated numerically using alternating direction implicit (A.D.I) method. In dealing with radiative heat transfer, a partially transparent body that absorbs the radiation energy is assumed and this transparent body undergoes multiple internal reflections and absorptions. Two dimensional (assuming plane stress) thermoelastic constitutive equation is used to calculate thermal stress induced in a wafer and finite element method is employed to solve the equation numerically. The stress resolved in the slip directions on the slip planes of silicon is compared with the yield stress of silicon in order to predict the slip. The result of the analysis shows that the wafer temperature at which slip occurs is affected by the heating rate of the R.T.P system. It is observed that once slip occurs in the wafer, the slip grows.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.95-95
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• 2009

Single-crystalline Bi nanowires have motivated many researchers to investigate novel quasi-one-dimensional phenomena such as the wire-boundary scattering effect and quantum confinement effects due to their electron effective mass (~0.001 me). Single crystalline Bi nanowires were found to grow on as-sputtered films after thermal annealing at $270^{\circ}C$. This was facilitated by relaxation of stress between the film and the thermally oxidized Si substrate that originated from a mismatch of the thermal expansion. However, the method is known to produce relatively lower density of nanowires than that of other nanowire growth methods for device applications. In order to increase density of nanowire, we propose a method for enhancing compressive stress which is a driving force for nanowire growth. In this work, we report that the compressive stress can be controlled by modifying a substrate structure. A combination of photolithography and a reactive ion etching technique was used to fabricate patterns on a Si substrate. It was found that the nanowire density of a Bi film grown on $100{\mu}m{\times}100{\mu}m$ pattern Si substrate increased over seven times higher than that of a Bi sample grown on a normal substrate. Our results show that density of nanowire can be enhanced by sidewall effect in optimized proper pattern sizes for the Bi nanowire growth.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.2
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• pp.520-528
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• 1996

Four point bending tests of the brazed joint composed of sintered silicon nitride and 0.2% carbon steel with Cusil ABA filler which were fabricated at 86$0^{\circ}C$ were performed at temperatures, 25, 100, 200, 300, 400, 50$0^{\circ}C$ From the experiments, the maximum bending strength was measured at 30$0^{\circ}C$ From the 3D FE analysis of the residual stress of the brazed joint, it was revealed that the thermally induced residual stresses were minimized when the environmental temperature was 35$0^{\circ}C$ Considering the degradation of the filler material at high temperatures, it was calculated that the maximum bending strength of the brazed joint occured just below the temperature of the minimum thermal residual stress and the thermal residual stress was the dominative parameter of the brazed joint.

• Tunnel and Underground Space
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• v.32 no.6
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• pp.568-585
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• 2022

In the present study, we proposed a numerical method for simulating thermally induced fracture slip using a grain-based distinct element model (GBDEM). As a part of DECOVALEX-2023, the thermo-mechanical loading test on a saw-cut rock fracture conducted at the Korea Institute of Civil Engineering and Building Technology was simulated. In the numerical model, the rock sample including a saw-cut fracture was represented as a group of random Voronoi polyhedra. Then, the coupled thermo-mechanical behavior of grains and their interfaces was calculated using 3DEC. The key concerns focused on the temperature evolution, thermally induced principal stress increment, and fracture normal and shear displacements under thermo-mechanical loading. The comparisons between laboratory experimental results and the numerical results revealed that the numerical model reasonably captured the heat transfer and heat loss characteristics of the rock specimen, the horizontal stress increment due to constrained displacement, and the progressive shear failure of the fracture. However, the onset of the fracture slip and the magnitudes of stress increment and fracture displacement showed discrepancies between the numerical and experimental results. We expect the numerical model to be enhanced by continuing collaboration and interaction with other research teams of DECOVALEX-2023 Task G and validated in further study.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.327.1-327.1
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• 2016

모바일 기기의 폭발적 증가세로 인해 플래시 메모리의 수요가 증가하고 있다. 낸드 플래시 메모리는 적은 전력 소모량과 높은 전기적 효율 때문에 많은 많은 연구가 이루어지고 있다. 반면에 stress-induced leakage current, positive-charge-assisted tunneling, thermally-assisted tunneling 등의 문제로 신뢰성이 저하되는 문제가 발생한다. 프로그램/이레이즈 동작이 반복되면 소자에서 발생하는 에러의 발생비율이 늘어나 신뢰성이 저하되게 된다. 비록 신뢰성 저하 메커니즘에 대한 연구가 많이 이루어졌으나, 워드라인 스트레스에 의한 프로그램 특성 저하에 대한 구체적인 연구가 진행되지 않았다. 본 연구에서는 플래시 메모리의 워드라인 스트레스로 인한 전기적 특성 감소 현상을 보기 위해, 플로팅 게이트의 두께를 변화시키면서, electron density와 depletion region 의 변화를 관찰하였다. 낸드 플래시 메모리의 전기적 특성을 멀티 오리엔테이션 모델을 포함한 3차원 TCAD 시뮬레이션을 이용하여 계산하였다. 프로그램/이레이즈 동작이 증가함에 따라, 플로팅 게이트에 공핍영역이 생기고, 블로킹 옥사이드와 게이트 사이에 의도하지 않은 트랩이 생기게 된다. 이로 인해 프로그램/이레이즈 동작이 증가함에 따라, 플로팅 게이트의 electron density가 감소하는 경향을 보았다. 이 연구 결과는 낸드 플래시 메모리 소자에서 신뢰성을 향상시키고 프로그램 특성을 증진시키는데 도움이 된다.

• Journal of the Korean Society of Safety
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• v.30 no.4
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• pp.8-13
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• 2015

The magnetic shape memory alloys have recently received a lot of attention due to the considerable progress achieved in understanding the particular importance and the development of the factors. Among these alloys, the ferromagnetic Co-Ni- alloys have been concerned specially because of the thermoelastic character of the fcc (g) - bct (a) martensitic transformation which exhibits under the action of the temperature (shape memory effect), the stress (superelasticity) and the magnetic field (magnetoelasticity). The morphological, the crystallographical, and the thermal characteristics of thermally induced martensite in Co-35.3Ni-11.3Al(wt.%) and Co-28.1Ni-47.4Fe-3.3Ti (wt.%) alloy have been investigated by the scanning electron microscope (SEM), the X-ray Diffraction (XRD), and the differential scanning calorimeter (DSC).