• Title/Summary/Keyword: Thermal-shock

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Thermal Shock Resistance of $Al_2$TiO$_5$ Ceramics Prepared from Electrofused Powders (전기용융 분말로부터 합성된 $Al_2$TiO$_5$ Ceramics의 열충격 저항성)

  • ;Constantin Zografou
    • Journal of the Korean Ceramic Society
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    • v.35 no.10
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    • pp.1061-1069
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    • 1998
  • The thermal instability of Al2TiO5 Ceramics was contrlled by solid solution with MgO SiO2 and ZrO2 through electrofusion in an arc furnace. The thermal expansion properties of Al2TiO5 composites show the hysteresis due to the strong anisotropy of The crystal axes of these material. These phenomena are ex-plained by the opening and closing of microcracks. The difference in microcracking temperatures e.g 587.6(ATG2), 405.9(ATG3) and 519.7$^{\circ}C$(ATG4) is caused by the difference in grain size and stabilizer type. The thermal shock behaviour under cyclic conditions between 750-1400-75$0^{\circ}C$ show no change in mi-crostructure and phase assemblage for all three stabilized specimens. After the thermal loading test at 110$0^{\circ}C$ for 100hrs. ATG1 and ATG2 materials decomposes completely to its components corundum and ru-tile in both cases. However with approximatelly 20% retention of the Al2TiO5 Thus in order to prevent decomposition of the stabilized material in the critical temperature range 800-130$0^{\circ}C$ it must be traversed within a short period of time.

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An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages (플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석)

  • Shin, Ki-Hoon;Kim, Hyoung-Tae;Jang, Dong-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.134-139
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    • 2007
  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

Thermal Shock and Hot Corrosion Resistance of Si3N4 Fabricated by Nitrided Pressureless Sintering (질화상압(NPS)법으로 제조한 질화규소의 열충격 저항성 및 내부식성 특성평가)

  • Kwak, Kil-Ho;Kim, Chul;Han, In-Sub;Lee, Kee-Sung
    • Journal of the Korean Ceramic Society
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    • v.46 no.5
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    • pp.478-483
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    • 2009
  • Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.

Development of structural integrity evaluation program for reactor vessel under pressurized thermal shock (가압열충격에 대한 원자로용기의 구조건전성 평가프로그램의 개발)

  • 정명조
    • Computational Structural Engineering
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    • v.9 no.2
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    • pp.153-161
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    • 1996
  • In this paper, theory of fracture mechanics for the pressurized thermal shock is investigated and numerical procedure for the evaluation of the pressure vessel under pressurized thermal shock is developed. For the given material properties, transient history such as temperature and pressure, and postulated flaw, the stress distribution is obtained to calculate stress intensities for a wide range of assumed crack sizes. The stress intensities are compared with the material fracture toughness values corresponding to the chemical compositions and the distribution of the nil ductility transition temperature, to determine the crack growth during the transient. Plant-specific calculations have been performed for several transients and the evaluation results are discussed.

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Development of the Heat-Resistant Functionally Gradient Material with Metal Substrate (금속기지 내열 경사기능 복합재료 개발에 관한 연구)

  • Kim, Bu-Ahn;Nam, Ki-Woo;Cho, Mun-Ho
    • Journal of Ocean Engineering and Technology
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    • v.13 no.1 s.31
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    • pp.62-69
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    • 1999
  • 67Ni-22Cr-10Al-1Y and $ZrO_2-8Y_2O_3$ were coated on the substrate surface of ST304 and Al2024 by the plasma spraying method. The adgesion of the films varies depending on the substrates and the laminating method. In the case of STS304, the cracks were observed at thermal shock temperature difference ${Delta}T$ of $900^{circ}C$ in the non functionally gradient material(NFGM) and at $1100^{circ}C$ in the functionally gradient material(FGM). The film adhesion of the FGM is better than that of the NFGM in ST304. The cumulative AE count of the FGM of STS304 increased continuously at the bending test. But the NFGM of STS304 showed discontinuity of the AE count. The total AE count for the FGM of STS304 decreased as the number of thermal shock increased, and this tendency was evident as the thermal shock temperature difference increased.

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Thermal Shock Behavior of TiN Coating Surface by a Pulse Laser Ablation Method

  • Noh, Taimin;Choi, Youngkue;Jeon, Min-Seok;Shin, Hyun-Gyoo;Lee, Heesoo
    • Korean Journal of Metals and Materials
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    • v.50 no.7
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    • pp.539-544
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    • 2012
  • Thermal shock behavior of TiN-coated SUS 304 substrate was investigated using a laser ablation method. By short surface ablation with a pulse Nd-YAG laser, considerable surface crack and spalling were observed, whereas there were few oxidation phenomena, such as grain growth of TiN crystallites, nucleation and growth of $TiO_2$ crystallites, which were observed from the coatings quenched from $700^{\circ}C$ in a chamber. The oxygen concentration of the ablated coating surface with the pulse laser also had a lower value than that of the quenched coating surface by Auger electron spectroscopy and electron probe micro analysis. These results were attributed to the fact that the properties of the pulse laser method have a very short heating time and so the diffusion time for oxidation was insufficient. Consequently, it was verified that the laser thermal shock test provides a way to evaluate the influence of the thermal shock load reduced oxidation effect.

Re-acceleration of Nonthermal Particles at Weak Cosmological Shock Waves

  • Kang, Hye-Sung;Ryu, Dong-Su
    • The Bulletin of The Korean Astronomical Society
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    • v.36 no.1
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    • pp.45.1-45.1
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    • 2011
  • Shock waves form in the intergalactic medium as a consequence of accretion, merger, and turbulent motion during the structure formation of the universe. They not only heat gas but also govern non-thermal processes through the acceleration of cosmic rays (CRs), production of magnetic fields, and generation of vorticity. We examine diffusive shock acceleration of the pre-existing as well as freshly injected populations of nonthermal, CR particles at weak cosmological shocks. Since the injection is extremely inefficient at weak shocks, the pre-existing CR population dominates over the injected population. If the pressure due to pre-existing CR protons is about 5 % of the gas thermal pressure in the upstream flow, the downstream CR pressure can absorb typically a few to 10 % of the shock ram pressure at shocks with the Mach number M<3. Yet, the re-acceleration of CR electrons can result in a substantial synchrotron emission behind the shock. The implication of our findings for observed bright radio relics is discussed.

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A Study on Thermal Shock, Thermal Expansion and Thermal Cracking of Rocks under High Temperature (고온하에서 암석의 열충격, 열팽창 및 열파괴에 관한 연구)

  • 이형원;이정인
    • Tunnel and Underground Space
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    • v.5 no.1
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    • pp.22-40
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    • 1995
  • Thermomechanical characteristics of rocks such as thermal shock, thermal expansion, thermal cracking were experimentally investigaed using Iksan granite, Cheonan tonalite and Chung-ju dolomite to obtain the basic data for proper design and Chung-ju dolomite to obtain the basic data for proper design and stability analysis of underground structures subjected to temperature changes. The effect of thermal shock did not appear when the heating speed was under 3$^{\circ}C$/min. and there existed little difference between multi-staged cyclic heating and single-cycled heating. Thermal expansion of rocks was affected by mineral composition, crack porosity and the degree of thermal craking. In quartz-beraring multimineralic rocks such as Iksan granite and Cheonan tonalite, the thermal expansion coefficient increaseed continuously with temperature rise, but that of Chung-ju dolomite which was a monomineralic rock showed a constant value for the temperature above 250$^{\circ}C$, Chung-ju dolomite yielded the lowest critical threshold temperature(Tc) of 100$^{\circ}C$ and unstable thermal cracking was initiated above the new threshold temperature(Tc')of 300$^{\circ}C$. Above Tc' thermal cracks grew but they were not interconnected. Iksan granite showed closing of microcracks to the temperature of 100$^{\circ}C$, then expanded linearly to Tc of 200$^{\circ}C$. Above Tc, thermal cracking was initiated and progressed rapidly and almost all the grain boundaries were cracked at 600$^{\circ}C$. Cheonan tonalite also showed similar behavior to iksan granite except that Tc was 350$^{\circ}C$ and that thermal cracks propagated more rapidly. Thermal expansions calculated by Turner's equation were found to be valid in predicting the thermal expansion and cracking behavior of rocks.

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HSP27 EXPRESSION IN OSTEOBLAST BY THERMAL STRESS (골모세포에서 열자극에 의한 Hsp27 발현에 대한 연구)

  • Rim, Jae-Suk;Kim, Byeong-Ryol;Kwon, Jong-Jin;Jang, Hyon-Seok;Lee, Eui-Suk;Jun, Sang-Ho;Woo, Hyeon-Il
    • Maxillofacial Plastic and Reconstructive Surgery
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    • v.30 no.1
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    • pp.11-21
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    • 2008
  • Aim of the study: Thermal stress is a central determinant of osseous surgical outcomes. Interestingly, the temperatures measured during endosseous surgeries coincide with the temperatures that elicit the heat shock response of mammalian cells. The heat shock response is a coordinated biochemical response that helps to protect cells from stresses of various forms. Several protective proteins, termed heat shock proteins (hsp) are produced as part of this response. To begin to understand the role of the stress response of osteoblasts during surgical manipulation of bone, the heat shock protein response was evaluated in osteoblastic cells. Materials & methods: With primary cell culture studies and ROS 17/2.8 osteoblastic cells transfected with hsp27 encoding vectors culture studies, the thermal stress response of mammalian osteoblastic cells was evaluated by immunohistochemistry and western blot analysis. Results: Immunocytochemistry indicated that hsp27 was present in unstressed osteoblastic cells, but not fibroblastic cells. Primarily cultured osteoblasts and fibroblasts expressed the major hsp in response to thermal stress, however, the small Mr hsp, hsp27 was shown to be a constitutive product only in osteoblasts. Creation of stable transformed osteoblastic cells expressing abundant hsp27 protein was used to demonstrate that hsp27 confers stress resistance to osteoblastic cells. Conclusions: The demonstrable presence and function of hsp27 in cultured bones and cells implicates this protein as a determinant of osteoblastic cell fate in vivo.

Effect of Diamond Particle Ratio on the Microstructure and Thermal Shock Property of HPHT Sintered Polycrystalline Diamond Compact (PDC) (초 고온·고압 소결 공정으로 제조된 다결정 다이아몬드 컴팩트(PDC)의 미세조직 및 열충격 특성에 미치는 다이아몬드 입자 비율의 영향)

  • Kim, Ji-Won;Park, Hee-Sub;Cho, Jin-Hyeon;Lee, Kee-Ahn
    • Journal of Powder Materials
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    • v.22 no.2
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    • pp.111-115
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    • 2015
  • This study investigates the microstructure and thermal shock properties of polycrystalline diamond compact (PDC) produced by the high-temperature, high-pressure (HPHT) process. The diamond used for the investigation features a $12{\sim}22{\mu}m$- and $8{\sim}16{\mu}m$-sized main particles, and $1{\sim}2{\mu}m$-sized filler particles. The filler particle ratio is adjusted up to 5~31% to produce a mixed particle, and then the tap density is measured. The measurement finds that as the filler particle ratio increases, the tap density value continuously increases, but at 23% or greater, it reduces by a small margin. The mixed particle described above undergoes an HPHT sintering process. Observation of PDC microstructures reveals that the filler particle ratio with high tap density value increases direct bonding among diamond particles, Co distribution becomes even, and the Co and W fraction also decreases. The produced PDC undergoes thermal shock tests with two temperature conditions of 820 and 830, and the results reveals that PDC with smaller filler particle ratio and low tap density value easily produces cracks, while PDC with high tap density value that contributes in increased direct bonding along with the higher diamond content results in improved thermal shock properties.