• Transactions of the Korean hydrogen and new energy society
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• v.30 no.4
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• pp.376-383
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• 2019

This paper presents of thermal performance analysis by using mathematical models for a compound parabolic collector (CPC) system employing heat storage tank. The thermal performance including insolation energy, heat loss from collector system, useful energy, collector efficiency, and temperature of storage tank were theoretically investigated through a year using monthly-average meteorological data at Seoul. The simulated results showed that the CPC systems are suitable for the applications of higher temperature than flat plate collector (FPC) systems.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.562-563
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• 2005

In case of aged porcelain, the failure in basic performance tests happened in cool-heat tests. Based on this characteristic, we studied the method predicting failure phenomena through more severe accelerated cool-heat ageing and accelerating thermal mechanical performance tests. Test results indicated that the thermal stress by temperature gradient was more severe parameter than thermal stress by quenching cycles within a category of standard or accelerating methods. And there is no the deterioration of statistic strength, but the deterioration of strength according to accelerating tests is serious.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.220-221
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• 2007

Recently, imprint lithography have received significant attention due to an alternative technology for photolithography on high performance microelectronic devices. In this work, we investigated thermal stabilities and dynamic mechanical properties of dielectric materials for thermal imprint lithography. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various curing agent and spherical filler were studied using dynamic differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), rheometer and universal test machine(UTM).

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.180-186
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• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Transactions of the Korean Society of Mechanical Engineers
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• v.2 no.2
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• pp.42-46
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• 1978

Thermal conductivities of Freon-12 and Freon-22 were measured at room temperature up to 35 MPa with the aid of transient hot wire method. Glycerin was used to check the performance of the experimental equipment. The thermal conductivities of Freon-12 and Freon-22 at the maximum pressure, 35 MPa, were increased by 25% approximately for those at satufated state.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.297-312
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• 2012

For future multi-core processors, 3D integration is regarded as one of the most promising techniques since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Conventional air cooling schemes are not enough for 3D multi-core processors due to the limit of the heat dissipation capability. Without more efficient cooling methods such as liquid cooling, the performance of 3D multi-core processors should be degraded by dynamic thermal management. In this paper, we examine the architectural impact of cooling methods on the 3D multi-core processor to find potential benefits of liquid cooling. We first investigate the thermal behavior and compare the performance of two different cooling schemes. We also evaluate the leakage power consumption and lifetime reliability depending on the temperature in the 3D multi-core processor.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.7 s.238
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• pp.868-877
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• 2005

We performed the experimental and the numerical study on the comparison of thermal comfort performance indices for cooling loads in the lecture room for 4 cases: Fan coil unit(FCU) or 4-way cassette air-conditioner is respectively operated with the ventilation system or without. We measured the velocity, the temperature distribution and predicted mean vote(PMV) value in the lecture room for 4 different air-conditioning methods. Effective draft temperature(EDT) and PMV were investigated to analyze the characteristics of two thermal comfort indices in the lecture room and to compare their values each other. From the results we knew that there is the similarity between PMV values and EDTs when the room is air-conditioned for cooling loads. It turned out that definition of the control temperature is very important when the EDT is calculated. Finally EDT should not be used to predict the accurate thermal comfort in case that the temperature and humidity are suddenly varied and the zone affected by the solar and inner wall radiation.

• Journal of the Korean Society of Visualization
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• v.21 no.2
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• pp.34-45
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• 2023

When lithium-ion batteries operate out of the proper temperature range, their performance can be significantly degraded and safety issues such as thermal runaway can occur. Therefore, battery thermal management systems are widely researched to maintain the temperature of Li-ion battery cells within the proper temperature range during the charging and discharging process. This study investigates the cooling performance and isothermal maintenance of cooling materials by measuring the surface temperature of a battery cell with or without cooling materials, such as silicone oil, thermal adhesive, and phase change materials during discharge process of battery by the experimental and numerical analysis. As a result of the experiment, the battery pack filled with phase change material showed a temperature reduction of 47.4 ℃ compared to the case of natural convection. It proves the advanced utility of the cooling unit using phase change material that is suitable for use in battery thermal management systems.

• Korean Journal of Metals and Materials
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• v.47 no.8
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

• Transactions of the Korean hydrogen and new energy society
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• v.22 no.3
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• pp.402-408
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• 2011

Organic Rankine cycles (ORC) can be used to produce power from heat at different temperature levels available as geothermal heat, as biogenic heat from biomass, as solar or as waste heat. In ORC working fluids with relatively low critical temperatures and pressures can be compressed directly to their supercritical pressures and heated before expansion so as to obtain a better thermal match with their heat sources. In this work thermal performance of ORC with and without an internal heat exchanger is comparatively investigated in the range of subcritical and transcritical cycles. R134a is considered as working fluid and special attention is paid to the effect of turbine inlet pressure on the characteristics of the system. Results show that operation with supercritical cycles can provide better performance than subcritical cycles and the internal heat exchanger can improve the thermal efficiency when the temperature of heat source becomes higher.