• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.100-107
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• 2020

As demand for high value-added products with hard materials increases, the line center is used for producing high value-added products in many industries such as aerospace, automobile fields. The line center is a key device for smart factory automation that can improve the production efficiency and the productivity. Therefore, the development of a mill-turn line center is necessary to produce high value-added products with complex shapes flexibly. In the mill-turn process, a milling process and a turning process are combined. In particular, the turning process needs to increase the rigidity of the spindle. The purpose of this study is to analyze the thermal-structural stability through thermo-structural coupled analysis for a mill-turn spindle with a curvic coupling. The maximum temperature and thermal stability of the spindle were analyzed by thermal distribution. In addition, the thermal deformation and thermal-structural stability of the spindle were analyzed through thermo-structural coupled analysis.

• Transactions on Electrical and Electronic Materials
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• v.9 no.2
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• pp.47-51
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• 2008

In this paper, thermal stability of Nickel silicide formed on p-type silicon wafer using Ni-V alloy film was studied. As compared with pure Ni, Ni-V shows better thermal stability. The addition of Vanadium suppresses the phase transition of NiSi to $NiSi_2$ effectively. Ni-V single structure shows the best thermal stability compared with the other Ni-silicide using TiN and Co/TiN capping layers. To enhance the thermal stability up to $650^{\circ}C$ and find out the optimal thickness of Ni silicide, different thickness of Ni-V was also investigated in this work.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.12
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• pp.45-51
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• 2019

As the separator becomes thinner, the role of thermal stability becomes more important in ensuring the high capacity of medium- and large-sized lithium-ion secondary batteries. In this study, we researched coating technology to improve the separator's thermal stability. We minimized the coating time by optimizing the design of a vertical two-stage coater that was thin, uniform, and capable of coating on both sides at the same time with a maximum 2㎛ thickness coating layer of fluorinated polymer (PVdF-HFP) on the bare polyethylene (PE) separator, which increased the thermal stability. In addition, during the coating process, a dual-jacket-roll method of drying was developed that increased the drying effectiveness without thermal damage to the separator. We also investigated the thermal stability of the separator manufactured from a coating machine, and studied the battery-applied performance by making a lithium-ion pouch battery.

• Structural Engineering and Mechanics
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• v.32 no.3
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• pp.429-445
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• 2009

Thermal stability of quasi-isotropic composite and polymeric structures is considered one of the most important criteria in predicting life span of building structures. The outdoor applications of these structures have raised some legitimate concerns about their durability including moisture resistance and thermal stability. Exposure of such quasi-isotropic composite/polymeric structures to various and severe climatic conditions such as heat flux and frigid climate would change the material behavior and thermal viability and may lead to the degradation of material properties and building durability. This paper presents an analytical model for the generalized problem. This model accommodates the non-linearity and the non-homogeneity of the internal heat generated within the structure and the changes, modification to the material constants, and the structural size. The paper also investigates the effect of the incorporation of the temperature and/or material constant sensitive internal heat generation with four encountered climatic conditions on thermal stability of infinite cylindrical quasi-isotropic composite/polymeric structures. This can eventually result in the failure of such structures. Detailed critical analyses for four case studies which consider the population of the internal heat generation, cylindrical size, material constants, and four different climatic conditions are carried out. For each case of the proposed boundary conditions, the critical thermal stability parameter is determined. The results of this paper indicate that the thermal stability parameter is critically dependent on the cylinder size, material constants/selection, the convective heat transfer coefficient, subjected heat flux and other constants accrued from the structure environment.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

• Biotechnology and Bioprocess Engineering:BBE
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• v.3 no.1
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• pp.32-34
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• 1998

Phytase from Aspergillus species is a very heat unstable enzyme which inactivates to a great extent during the thermal processing of animal feed formulation. Various protein stabilization additives were tested to improve its heat stability. Among them, a basic amino acid, L-arginine remarkably increased the thermal stability of phytase in an aqueous solution state.

• Journal of the Korean Society of Safety
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• v.22 no.4
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• pp.43-50
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• 2007

Lack of understanding of the process chemistry and thermodynamics are the major reasons that can is lead to thermal runaway reaction in the chemical reaction process. The evaluation of reaction factors and thermal behavior in neutralization process of pigment plant are described in this paper. The experiments were performed in the C 80 calorimeter, and Thermal Screening Unit($TS^{u}$). The aim of the study was to evaluate the results of thermal stability in terms of safety reliability to be practical applications. It suggested that we be proposed safe operating conditions and securities for accident prevention through this study.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.21 no.2
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• pp.86-93
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• 2007

This paper proposes two fast calculation methods of ATC. These two methods evaluate ATC with thermal constraints(Thermal ATC) and ATC with voltage stability constraints(Voltage ATC) respectively. The ATC with thermal constraints was based on the linear incremental power flow to account for the line flow thermal loading effects when the n-1 security constraints were included. The ATC with voltage stability constraints used two-bus equivalents of the system to find the maximum load at a load bus before reaching the voltage stability problem. The methods were tested on the IEEE 30bus systems and the results obtained were compared with those found by some other methods.

• Elastomers and Composites
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• v.58 no.2
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• pp.70-80
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• 2023

The effect of phenylphosphonic acid (PPOA) on polyurethane (PU) thermal stability was studied through Fourier transform infrared spectroscopy and Thermogravimetric analysis. To synthesize PPOA-modified PUs (PPOA-PUs), polyether-type diols (Mw=62, 106, 190, 419, 605) were chemically modified with PPOA and then reacted with 4,4'-dicyclohexylmethane diisocyanate (H₁₂MDI) and 4,4-diphenylmethane diisocyanate (MDI). During thermal decomposition in air, the PPOA embedded in the PUs formed intumescent phosphocarbonaceous char. Below 400℃, PPOA-H₁₂MDI-PUs were more unstable, as PPOA decomposed at lower temperatures than phenyl groups and aliphatic ethers. Above 550℃, the thermal stability of PUs followed this order: PPOA-MDI-PUs > PPOA-H₁₂MDI-PUs > MDI-PUs > H₁₂MDI-PUs. At 700℃, unmodified PUs had no residue, while the PPOA-MDI-PU residue was 4.4~23.0 wt.% and the PPOA-H₁₂MDI-PU residue was 1.5~17.5 wt.%. The enhanced thermal stability of PPOA-MDI-PUs at high temperatures can be attributed to the synergetic effect of PPOA and phenyl groups on the formation of phosphocarbonaceous char.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.