• 한국전기전자재료학회논문지
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• 제23권8호
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• Nuclear Engineering and Technology
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• 제33권2호
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• pp.132-144
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• 2001

Fracture mechanics is one of the major areas of the pressurized thermal shock (PTS) evaluation. To evaluate the reactor pressure vessel integrity associated with PTS, PFM methodology demands precise calculation of temperature, stress, and stress intensity factor for the variety of PTS transients. However, the existence of stainless steel cladding, with different thermal, physical, and mechanical property, at the inner surface of reactor pressure vessel complicates the fracture mechanics analysis. In this paper, treatment schemes to evaluate stress and resulting stress intensity factor for RPV with stainless steel clad are introduced. For a reference transient, the effects of clad thermal conductivity and thermal expansion coefficients on deterministic fracture mechanics analysis are examined.

• 한국세라믹학회지
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• 제42권8호
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• pp.532-536
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• 2005

Thermal shock resistance of structural ceramics is a property that is difficult to quantity, and as such is usually expressed in terms of a number of empirical resistance parameters. These are dependant on the conditions imposed, but one method that can be used is the examination of density, Young's modulus and thermal expansion retention after quenching. For high temperature applications, long-annealing thermal durability, cycle thermal stability and residual mechanical properties are very important if these materials are to be used between $1000^{\circ}C$ and $1300^{\circ}C$. In this study, an excellent thermal shock-resistant material based on $Al_2TiO_5-mullite$ composites of various compositions was fabricated by sintering reaction from the individual oxides and adjusting the composition of $Al_2O_3TiO_2/SiO_2$ ratios. The characterization of the damage induced by thermal shock was done by measuring the evolution of the Young's modulus using ultrasonic analysis, density and thermal expansion coefficients.

• 한국해양공학회지
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• 제25권3호
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• pp.28-33
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• 2011

The thermal shock properties of SiC materials were investigated for high temperature applications. In particular, the effect of thermal shock temperature on the flexural strength of SiC materials was evaluated, in conjunction with a detailed analysis of their microstructures. The efficiency of a nondestructive technique using ultrasonic waves was also examined for the characterization of SiC materials suffering from a cyclic thermal shock history. SiC materials were fabricated by a liquid phase sintering process (LPS) associated with hot pressing, using a commercial submicron SiC powder. In the materials, a complex mixture of $Al_2O_3$ and $Y_2O_3$ powders was used as a sintering additive for the densification of the microstructure. Both the microstructure and mechanical properties of the sintered SiC materials were investigated using SEM, XRD, and a three point bending test. The SiC materials had a high density of about 3.12 Mg/m3 and an excellent flexural strength of about 700 MPa, accompanying the creation of a secondary phase in the microstructure. The SiC materials exhibited a rapid propagation of cracks with an increase in the thermal shock temperature. The flexural strength of the SiC materials was greatly decreased at thermal shock temperatures higher than $700^{\circ}C$, due to the creation of microcracks and their propagation. In addition, the SiC materials had a clear tendency for a variation in the attenuation coefficient in ultrasonic waves with an increase in thermal shock cycles.

• 한국분말재료학회지
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• 제22권2호
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• pp.111-115
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• 2015

This study investigates the microstructure and thermal shock properties of polycrystalline diamond compact (PDC) produced by the high-temperature, high-pressure (HPHT) process. The diamond used for the investigation features a $12{\sim}22{\mu}m$- and $8{\sim}16{\mu}m$-sized main particles, and $1{\sim}2{\mu}m$-sized filler particles. The filler particle ratio is adjusted up to 5~31% to produce a mixed particle, and then the tap density is measured. The measurement finds that as the filler particle ratio increases, the tap density value continuously increases, but at 23% or greater, it reduces by a small margin. The mixed particle described above undergoes an HPHT sintering process. Observation of PDC microstructures reveals that the filler particle ratio with high tap density value increases direct bonding among diamond particles, Co distribution becomes even, and the Co and W fraction also decreases. The produced PDC undergoes thermal shock tests with two temperature conditions of 820 and 830, and the results reveals that PDC with smaller filler particle ratio and low tap density value easily produces cracks, while PDC with high tap density value that contributes in increased direct bonding along with the higher diamond content results in improved thermal shock properties.

• 산업기술연구
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• 제24권A호
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• pp.9-15
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• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• 한국세라믹학회지
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• 제28권1호
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• pp.11-18
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• 1991

A precipitation method, one of the most effective liquid phase reaction methods, was adopted in order to prepare high-tech Al2O3/ZrO2 composite ceramics, and the effects of stress-induced phase transformation of ZrO2 on thermal shock behavior of Al2O3-ZrO2 ceramics were investigated. Al2(SO4)3.18H2O, ZrOCl2.8H2O and YCl3.6H2O were used as starting materials and NH4OH as a precipitation agent. Metal hydroxides were obtained by single precipitation(process A) and co-precipitation(process B) method at the condition of pH=7, and the composition of Al2O3-ZrO2 composites was fixed as Al2O3-15v/o ZrO2(+3m/o Y2O3). Critical temperature difference showing rapid strength degradation by thermal shock showed higher value in Al2O3/ZrO2 composites(process A : 20$0^{\circ}C$, process B : 215$^{\circ}C$) than in Al2O3(175$^{\circ}C$). The improvement of thermal shock property for Al2O3/ZrO2 composites was mainly due to the increase of strength at room temperature by adding ZrO2. The strength degradation was more severe for the sample with higher strength at room temperature. Crack initiation energies by thermal shock showed higher values in Al2O3/ZrO2 composites than in Al2O3 ceramics due to increase of fracture toughness by ZrO2.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1538-1541
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• 2005

For reliability evaluation of AC-PDP, one of the most important factor is sealing property. In this paper, the reliability evaluation test method of the commercialized sealing glass frit in AC-PDP was studied. 6 inch AC-PDP panels were tested for evaluation of sealing glass frit by vibration shock test, thermal shock test, non -destructive X-ray inspection, residual stress inspection and residual gas detection. These test methods are proposed as a standard for testing the reliability of sealing glass frit. The main failure mode of sealing glass frit in AC-PDP seems to be the crack propagation from thermal cycling rather than mechanical factor.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.335-338
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• 1999

The effect of monoclinic $ZrO_2$(pure) and tetragonal $ZrO_2$ containing 5.35wt% $Y_2$$O_3$(Y-TZP) addition on the mechanical properties and thermal shock resistance of $Al_2$$O_3$ ceramic were investigated. The addition of $ZrO_2$(m) and Y-TZP increased sintering density of $Al_2$$O_3$. The vickers hardness increased with increasing the volume fraction of Y-TZP going through a maximum at 20wt%. The hardness of the specimens was found to be depend on the sintering density. With increasing the volume fraction of $ZrO_2$(m) and Y-TZP, the fracture toughness of the composite is increased. This result may be taken as evidence that toughening of ${Al_2}{O_3}$ can also be achieved by the transformation toughening and microcrack toughening of $ZrO_2$. The property of the& shock for ${Al_2}{O_3}$-$ZrO_2$ composites was improved by increasing the volume fraction of monoclinic $ZrO_2$(pure).Grain size increased with increasing the volume fraction of $ZrO_2$.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.23-29
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• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.