• Title/Summary/Keyword: Thermal shock cycle test

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A Fatigue Analysis of Thermal Shock Test in Brake Disc Material for Railway (철도차량 제동디스크 소재 열충격 실험에 대한 피로해석)

  • Lim, Choong-Hwan;Goo, Byeong-Choon
    • Proceedings of the KSR Conference
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    • 2010.06a
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    • pp.615-620
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    • 2010
  • During braking of railway vehicles the repetitive thermal shock leads to thermal cracks on disc surface, and the lifetime of brake disc is dependent on the number of trimming works for removing these thermal cracks. Many tries for development of high heat resistant brake disc to extend the disc life and to warrant reliable braking performance has been continued. In present study, we carry out the computational fatigue analysis for thermal fatigue test in three candidate materials which were made to develop new high heat resistant material. Using FEM, we simulate thermal fatigue test in three candidate materials and conventional disc material. We then estimate the number of cycle to thermal crack initiation based on data from mechanical fatigue tests, and the results are compared with each material. For each material, the correction factor for $N_{f-40}$ which is the number of cycles when crack over $40{\mu}m$ was observed in thermal fatigue test is decided. From this study, we can verify the performance of thermal fatigue test system and suggest a qualitatively comparative method for heat resistance by FEM analysis of thermal shocking phenomenon.

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Thermal stress analysis of the turbocharger housing using finite element method (유한요소법에 의한 터보차져 하우징의 열응력 해석)

  • Choi, B.L.;Bang, I.W.
    • Journal of Power System Engineering
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    • v.15 no.6
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    • pp.5-10
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    • 2011
  • A turbocharger is subjected to rapid temperature changes during thermal cyclic loads. In order to predict the thermo-mechanical failures, it's very important to estimate temperature distributions under the thermal shock test. This paper suggest the finite element techniques with the temperature histories, a constitutive material model and the mechanical constraints to calculate the thermal stresses and plastic strain distributions for the turbine housing. The first step was to develop a simple coupon approach to represent the failure mechanism of the classical design shapes and secondly applied the actual turbocharger to predict and validate the weak locations under the physical engine test.

Evaluation of Defects of Thermal Barrier Coatings by Thermal Shock Test Using Eddy Current Testing (열차폐 코팅층의 고온 열충격 시험후 ECT를 이용한 결함 평가)

  • Heo, Tae-Hoon;Cho, Youn-Ho;Lee, Joon-Hyun;Oh, Jeong-Seok;Lee, Koo-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.29 no.5
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    • pp.450-457
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    • 2009
  • Periodical thermal shock can introduce defects in thermal barrier coating made by layers of CoNiCrAlY bond coating(BC) and $ZrO_2-8wt%Y_2O_3$ ceramic top coating(TC) on Inconel-738 substrate using plasma spraying. Thermal shock test is performed by severe condition that is to heat until $1000^{\circ}C$ and cool until $20^{\circ}C$. As the number of cycle is increased, the fatigue by thermal shock is also increased. After test, the micro-structures and mechanical characteristics of thermal barrier coating were investigated by SEM, XRD. The TGO layer of $Al_2O_3$ is formed between BC and TC by periodical thermal shock test, and its change in thickness is inspected by eddy current test(ECT). By ECT test, it is shown that TGO and micro-crack can be detected and it is possible to predict the life of thermal barrier coating.

Electric Degradation of Failure Mode of Solar Cell by Thermal Shock Test (열충격 시험 후 태양전지 파괴 모드에 따른 전기적 특성변화)

  • Kang, Min-Soo;Jeon, Yu-Jae;Shin, Young-Eui
    • Journal of Energy Engineering
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    • v.22 no.4
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    • pp.327-332
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    • 2013
  • 일본 연구에서는 열충격 시험을 통한 태양전지의 파괴모드에 따른 전기적 특성을 분석하였다. 시편은 Photovoltaic Module을 만들기 전 3 line Ribbon을 Tabbing한 단결정 Solar Cell을 제작하였다. 열충격 시험 Test 1의 온도조건은 저온 $-40^{\circ}C$, 고온 $85^{\circ}C$, Test 2는 저온 $-40^{\circ}C$, 고온 $120^{\circ}C$에서 Ramping Time을 포함하여 각각 15분씩, 총 30분을 1사이클로 500사이클을 각각의 조건으로 수행하였다. 열충격 시험 후 Test 1에서는 4.0%의 효율 감소율과 1.5%의 Fill Factor 감소율을 확인하였으며, Test 2에서는 24.5%의 효율 감소율과 11.8%의 Fill Factor 감소율을 확인하였다. EL(Electroluminescence)촬영 및 단면을 분석한 결과, Test 1과 Test 2 시편 모두 Cell 표면 및 내부에서의 Crack이 발견되었다. 하지만, Test 2의 시험이 Test 1보다 가혹한 온도조건의 시험으로 인해 Test 1에서 나타나지 않았던, Cell 파괴를 Test 2에서 확인하였다. 결국, Test 1에서 효율의 직접적인 감소 원인은 Cell 내부에서의 Crack이며, Test 2에서는 Cell 내부에서의 Crack 및 Cell 파괴로 인한 Cell 자체의 성능저하로 효율이 크게 감소한다는 것을 본 실험을 통하여 규명하였다.

Thermal Structural Analysis of the Engine Turbocharger under the Transient Temperature History Corresponding to the Motoring Fatigue Test (모터링 내구시험을 상사한 비정상 온도이력을 받고 있는 엔진 터보차져의 열적 거동해석)

  • Choi, Bok-Lok;Bang, In-Wan;Chang, Hoon
    • Transactions of the Korean Society of Automotive Engineers
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    • v.19 no.6
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    • pp.126-132
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    • 2011
  • Fatigue cracks of the turbocharger are often observed for high performance engines under thermal shock tests. Maximum exhaust gas temperature of recently developed gasoline engines could reach approximately $950^{\circ}C$. It's very important to estimate transient temperature histories during thermal shock cycles to predict the stress and the fatigue life of the turbocharger. With these temperature profiles, temperature-dependent material properties and boundary conditions, we could identify critical locations by the application of finite element simulation technologies. In this paper, we applied the reliable analysis approach to the actual turbocharger to predict the weak locations due to the repetitions of plastic strains and compared the results with the crack locations under physical engine test.

Evaluation on Reliability of High Temperature Lead-free Solder for Automotive Electronics (자동차 전장 보드용 고온 무연 솔더의 신뢰성 평가)

  • Ko, Yong-Ho;Yoo, Se-Hoon;Lee, Chang-Woo
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.35-40
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    • 2010
  • In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.

Characteristics of Reliability for Flip Chip Package with Non-conductive paste (비전도성 접착제가 사용된 플립칩 패키지의 신뢰성에 관한 연구)

  • Noh, Bo-In;Lee, Jong-Bum;Won, Sung-Ho;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.4
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    • pp.9-14
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    • 2007
  • In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

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Study on the Estimation of Long Life Cycle and Reliability Tests for Epoxy Insulation Busway System (에폭시 박막 절연형 버스웨이 시스템의 장기 수명 및 신뢰성 평가에 관한 연구)

  • Jang, Dong-Uk;Park, Seong-Hee;Lee, Kang-Won
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.9
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    • pp.261-268
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    • 2018
  • The use of electric cable was limited due to the installation time and large space as the increase of power demand and load quantity in side line. In order to solve these problems, the application of busway system which can supply the large current was increasing. But it was lack of methods of performance tests to evaluate the reliability and results of test for busway system. In this paper, we presented items to evaluate the reliability test for epoxy coated busway system with reference to IEC 61349-6. In addition, we proposed items to evaluate the reliability and long term life cycle test for the epoxy coated busway system. The combined acceleration deterioration test that reflects actual conditions of the survey as much as possible was conducted considering both thermal and electrical stresses. The deterioration condition was selected to satisfy fifty years life expectation and the insulation performance verification test of the busway system confirmed the long term life prediction. Furthermore, as test items for reliability assessment of compliance with the environment for the use of temperature, humidity and load current where busway system was installed, thermal overload test, water immersion test, cold shock temperature test and thermal cycle test were performed. And we examined changes in characteristics and abnormality after tests. From results, the test items presented to evaluate performance and reliability of the epoxy insulated busway system were confirmed to be appropriate in this paper, and the performance of the product was also confirmed to be excellent for reliability tests.

Scramjet Research at JAXA, Japan

  • Chinzei Nobuo
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • v.y2005m4
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    • pp.1-1
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    • 2005
  • Japan Aerospace Exploration Agency(JAXA) has been conducting research and development of the Scramjet engines and their derivative combined cycle engines as hypersonic propulsion system for space access. Its history will be introduced first, and its recent advances, focusing on the engine performance progress, will follow. Finally, future plans for a flight test of scramjet and ground test of combined cycle engine will be introduced. Two types of test facilities for testing those hypersonic engines. namely, the 'Ramjet Engine Test Facility (RJTF)' and the 'High Enthalpy Shock Tunnel (HIEST)' were designed and fabricated during 1988 through 1996. These facilities can test engines under simulated flight Mach numbers up to 8 for the former, whereas beyond 8 for the latter, respectively. Several types of hydrogen-fueled scramjet engines have been designed, fabricated and tested under flight conditions of Mach 4, 6 and 8 in the RJTF since 1996. Initial test results showed that the thrust was insufficient because of occurrence of flow separation caused by combustion in the engines. These difficulty was later eliminated by boundary-layer bleeding and staged fuel injection. Their results were compared with theory to quantify achieved engine performances. The performances with regards to combustion, net thrust are discussed. We have reached the stage where positive net thrust can be attained for all the test coditions. Results of these engine tests will be discussed. We are also intensively attempting the improvement of thrust performance at high speed condition of Mach 8 to 15 in High Enthalpy Shock Tunnel (HIEST). Critical issues for this purposemay be air/fuel mixing enhancement, and temperature control of combustion gas to avoid thermal dissociation. To overcome these issues we developed the Hypermixier engine which applies stream-wise vortices for mixing enhancement, and the M12-engines which optimizes combustor entrance temperature. Moreover, we are going to conduct the flight experiment of the Hypermixer engine by utilizing flight test infrastructure (HyShot) provided by the University of Queensland in fall of 2005 for comparison with the HIEST result. The plan of the flight experiment is also presented.

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Gate Leakage Current Characteristics of GaAs MESFETS′ with different Temperature (GaAs MESFET의 온도변화에 다른 게이트 누설전류 특성)

  • 원창섭;김시한;안형근;한득영
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.50-53
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    • 2001
  • In this study, gate leakage current mechanism has been analyzed for GaAs MESFET with different temperatures ranging from 27$^{\circ}C$ to 300$^{\circ}C$ . It is expected that the thermionic and field emission at the MS contact will dominate the current flow. Thermal cycle is applied to test the reliability of the device. From the results, it is proved that thermal stress gradually increases the gate leakage current at the same bias conditions and leads to the breakdown and failure mechanism which is critical in the field equipment. Finally the gate contact under the repeated thermal shock has been tested to check the quality of Schottky barrier and the current will be expressed in the analytical from to associate with the electrical characteristics of the device.

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