• 한국해양공학회지
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• 제27권5호
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• pp.22-27
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• 2013

The present work dealt with the high temperature thermal shock properties of 316 stainless steels, in conjunction with a detailed analysis of their microstructures. In particular, the effects of the thermal shock temperature difference and thermal shock cycle number on the properties of 316 stainless steels were investigated. A thermal shock test for 316 stainless steel was carried out at thermal shock temperature differences from $300^{\circ}C$ to $1000^{\circ}C$. The cyclic thermal shock test for the 316 stainless steel was performed at a thermal shock temperature difference of $700^{\circ}C$ up to 100 cycles. The characterization of 316 stainless steels was evaluated using an optical microscope and a three-point bending test. Both the microstructure and flexural strength of 316 stainless steels were affected by the high-temperature thermal shock. The flexural strength of 316 stainless steels gradually increased with an increase in the thermal shock temperature difference, accompanied by a growth in the grain size of the microstructure. However, a thermal shock temperature difference of $800^{\circ}C$ produced a decrease in the flexural strength of the 316 stainless steel because of damage to the material surface. The properties of 316 stainless steels greatly depended on the thermal shock cycle number. In other words, the flexural strength of 316 stainless steels decreased with an increase in the thermal shock cycle number, accompanied by a linear growth in the grain size of the microstructure. In particular, the 316 stainless steel had a flexural strength of about 500 MPa at 100 thermal-shock cycles, which corresponded to about 80% of the strength of the as-received materials.

• International Journal of Automotive Technology
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• 제5권4호
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• pp.297-302
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• 2004

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermo-mechanical cyclic loading. As a failure of the exhaust manifold is mainly caused by geometric constraints of the less expanded inlet flange and cylinder head, the analysis is based on the exhaust system model with three-dimensional temperature distribution and temperature dependent material properties. The result show that large compressive plastic deformations are generated at an elevated temperature of the exhaust manifold and tensile stresses are remained in several critical zones at a cold condition. From the repetition of these thermal shock cycles, maximum plastic strain range (0.454%) could be estimated by the stabilized stress-strain hysteresis loops. It is used to predict the low cycle thermal fatigue life of the exhaust manifold for the thermal shock test.

• 한국전기전자재료학회논문지
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• 제23권8호
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• 한국전기전자재료학회논문지
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• 제29권3호
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• 산업기술연구
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• 제24권A호
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• pp.9-15
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• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• 한국자동차공학회논문집
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• 제15권1호
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• pp.139-145
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• 2007

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermomechanical cyclic loadings. The analysis includes the FE model of the exhaust system, temperature dependent material properties, and thermal loadings. The result shows that at an elevated temperature, large compressive plastic deformations are generated, and at a cold condition, tensile stresses are remained in several critical zones of the exhaust manifold. From the repetitions of thermal shock cycles, plastic strain ranges could be estimated by the stabilized stress-strain hysteresis loops. The method was applied to assess the low cycle thermal fatigue for the engine exhaust manifold. It shows a good agreement between numerical and experimental results.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.31-33
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• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.

• 에너지공학
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• 제21권1호
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• pp.26-32
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• 2012

본 연구에서는 PV(photovoltaic)모듈에서 경년에 따른 효율 저하의 원인을 분석하기 위해 셀 레벨에서의 열충격 시험을 수행하였다. 열충격 시험의 조건은 $-40^{\circ}C$에서 $85^{\circ}C$로 각각 15분씩 30분을 1사이클로 하였으며, 열충격 시험 500 사이클 동안 100 사이클 간격으로 EL분석 및 I-V분석을 수행하였다. 효율 감소율은 단결정 Bare Cell이 8%, Solar Cell이 9%였으며, 다결정 Bare Cell이 6%, Solar Cell이 13%의 감소율을 보였다. 열충격 시험 후 Solar Cell은 표면 손상으로 인한 효율저하를 확인할 수 있었다. Bare Cell의 경우 표면의 손상이 없었지만, 효율이 저하된 것을 확인할 수 있었다. 이는 Fill Factor 분석에 의해 경년 시 나타나는 누설전류에 의한 소모전력 증가로 효율 저하에 영향을 준 것으로 판단된다. 또한, Bare Cell보다 Solar Cell에서의 효율 감소율이 상대적으로 높게 나타난 결과는 표면 손상 및 소모 전력의 증가로 인해 Solar Cell 효율에 큰 영향을 미치는 것으로 판단된다. 향후 단면 분석법 및 다양한 조건의 시험 기법을 활용하여 PV모듈 뿐 아니라 Cell 레벨에서의 불규칙한 효율 및 Fill Factor의 감소 원인을 검토하고, Solar Cell에서의 효율 저하가 가속되는 원인에 대한 대책 방안 연구가 수행되어야 할 것이다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1312-1314
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• 1998

SOFC system is often subject to thermal cycle condition during normal start/stop, shutdown, and emergence state. Under the thermal cycle condition of heating and cooling, the SOFC components expand or shrink, which produces thermal stress and thermal shock. The SOFC performance is degraded by the thermal factors. To protect SOFC system from the thermal degradation, the optimum thermal condition must be clarified. In this study, to examine the thermal cycle characteristics, we fabricated single cells of planar SOFC with an area of $5{\times}5cm$. The electrolyte and PEN were tested under thermal cycle conditions in the range of$ 2-8^{\circ}C/min$. After thermal cycle test. crack creation of the components were examined using ultraviolet apparatus. No crack in the electrolyte and PEN were observed. The single cell system with alumina frame were also tested under thermal cycle conditions of 2, 3, $4^{\circ}C/min$. The single cell was fractured at the thermal cycle of 3 and $4^{\circ}C/min$ and the optimum condition of the thermal cycle to be found below $2^{\circ}C/min$.