• Title/Summary/Keyword: Thermal interface materials

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Improvement of Adhesion Strength of High Temperature Plasma Coated Aluminum Substrate with Aluminum-Alumina Powder Mixture (알루미늄 기지에 알루미늄-알루미나 혼합분말을 이용한 고온플라즈마 열분사 코팅층의 밀착강도 향상기구)

  • Park, Jin Soo;Lee, Hyo Ryong;Lee, Beom Ho;Park, Joon Sik
    • Korean Journal of Materials Research
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    • v.25 no.5
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    • pp.226-232
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    • 2015
  • High temperature plasma coating technology has been applied to recover damaged aluminum dies from wear by spraying pure aluminum and alumina powder. However, the coated mixed powder layer composed of aluminum and alumina often undergoes a detachment from the substrate, making the coated substrate die unable to maintain its expected life span. In this study, in order to increase the bonding strength between the substrate and the coating layer, a pure aluminum layer was applied as an intermediate bond layer. In order to prepare the specimen with variable bond coating conditions, the bond coat layers with a various gun speed from 10 cm/sec to 30 cm/sec were prepared with coating cycle variations ranging from three to nine cycles. The specimen with a bond coat layer coated with a gun speed of 20 cm/sec and three coating cycles exhibited ~13MPa of adhesion strength, while the specimen without a bond coat layer showed ~6 MPa of adhesion strength. The adhesion strength with a variation of bond coat layer thickness is discussed in terms of coating parameters.

Effect of Ta/Cu Film Stack Structures on the Interfacial Adhesion Energy for Advanced Interconnects (미세 배선 적용을 위한 Ta/Cu 적층 구조에 따른 계면접착에너지 평가 및 분석)

  • Son, Kirak;Kim, Sungtae;Kim, Cheol;Kim, Gahui;Joo, Young-Chang;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.1
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    • pp.39-46
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    • 2021
  • The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

Efficiency and Lifetime Improvement of Organic Light- Emitting Diodes with a Use of Lithium-Carbonate- Incorportated Cathode Structure

  • Mok, Rang-Kyun;Kim, Tae-Wan
    • Transactions on Electrical and Electronic Materials
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    • v.13 no.2
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    • pp.60-63
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    • 2012
  • Enhancement of efficiency and luminance of organic light-emitting diodes was investigated by the introduction of a lithium carbonate ($Li_2CO_3$) electron-injection layer. Electron-injection layer is used in organic light-emitting diodes to inject electrons efficiently between a cathode and an organic layer. A device structure of ITO/TPD (40 nm)/$Alq_3$ (60 nm)/$Li_2CO_3$ (x nm)/Al (100 nm) was manufactured by thermal evaporation, where the thickness of $Li_2CO_3$ layer was varied from 0 to 3.3 nm. Current density-luminance-voltage characteristics of the device were measured and analyzed. When the thickness of $Li_2CO_3$ layer is 0.7 nm, the current efficiency and luminance of the device at 8.0 V are improved by a factor of about 18 and 3,000 compared to the ones without the $Li_2CO_3$ layer, respectively. The enhancement of efficiency and luminance of the device with an insertion of $Li_2CO_3$ electron-injection layer is thought to be due to the lowering of an electron barrier height at the interface region between the cathode and the emissive layer. This is judged from an analysis of current density-voltage characteristics with a Fowler-Nordheim tunneling conduction mechanism model. In a study of lifetime of the device that depends on the thickness of $Li_2CO_3$ layer, the optimum thickness of $Li_2CO_3$ layer was obtained to be 1.1 nm. It is thought that an improvement in the lifetime is due to the prevention of moisture and oxygen by $Li_2CO_3$ layer. Thus, from the efficiency and lifetime of the device, we have obtained the optimum thickness of $Li_2CO_3$ layer to be about 1.0 nm.

Improvement Performance of Graphene-MoS2 Barristor treated by 3-aminopropyltriethoxysilane (APTES)

  • O, Ae-Ri;Sim, Jae-U;Park, Jin-Hong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.291.1-291.1
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    • 2016
  • Graphene by one of the two-dimensional (2D) materials has been focused on electronic applications due to its ultrahigh carrier mobility, outstanding thermal conductivity and superior optical properties. Although graphene has many remarkable properties, graphene devices have low on/off current ratio due to its zero bandgap. Despite considerable efforts to open its bandgap, it's hard to obtain appropriate improvements. To solve this problem, heterojunction barristor was proposed based on graphene. Mostly, this heterojunction barristor is made by transition metal dichalcogenides (TMDs), such as molybdenum disulfide ($MoS_2$) and tungsten diselenide ($WSe_2$), which have extremely thickness scalability of TMDs. The heterojunction barristor has the advantage of controlling graphene's Fermi level by applying gate bias, resulting in barrier height modulation between graphene interface and semiconductor. However, charged impurities between graphene and $SiO_2$ cause unexpected p-type doping of graphene. The graphene's Fermi level modulation is expected to be reduced due to this p-doping effect. Charged impurities make carrier mobility in graphene reduced and modulation of graphene's Fermi level limited. In this paper, we investigated theoretically and experimentally a relevance between graphene's Fermi level and p-type doping. Theoretically, when Fermi level is placed at the Dirac point, larger graphene's Fermi level modulation was calculated between -20 V and +20 V of $V_{GS}$. On the contrary, graphene's Fermi level modulation was 0.11 eV when Fermi level is far away from the Dirac point in the same range. Then, we produced two types heterojunction barristors which made by p-type doped graphene and graphene treated 2.4% APTES, respectively. On/off current ratio (32-fold) of graphene treated 2.4% APTES was improved in comparison with p-type doped graphene.

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Pd/Si/Ti/Pt Ohmic Contact for Application to AlGaAs/GaAs HBT (AIGaAs/GaAs HBT 응용을 위한 Pd/Si/Ti/Pt 오믹 접촉)

  • 김일호;박성호(주)가인테크
    • Journal of the Korean Vacuum Society
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    • v.10 no.3
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    • pp.368-373
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    • 2001
  • Pd/Si/Ti/Pt ohmic contact to n-type InGaAs was investigated. As-deposited contact showed non-ohmic behavior, and high specific contact resistivity of $5\times10^{-3}\Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $375^{\circ}C$ for 10 seconds. However, the specific contact resistivity decreased remarkably to $1.7\times10^{-6}\Omega\textrm{cm}^2$ and $2\times10^{-6}\Omega\textrm{cm}^2$ at $375^{\circ}C$/60sec and $425^{\circ}C$/10sec, respectively. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained even at $450^{\circ}C$, therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

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Multi-Scale Heterogeneous Fracture Modeling of Asphalt Mixture Using Microfabric Distinct Element Approach

  • Kim Hyun-Wook;Buttler William G.
    • International Journal of Highway Engineering
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    • v.8 no.1 s.27
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    • pp.139-152
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    • 2006
  • Many experimental and numerical approaches have been developed to evaluate paving materials and to predict pavement response and distress. Micromechanical simulation modeling is a technology that can reduce the number of physical tests required in material formulation and design and that can provide more details, e.g., the internal stress and strain state, and energy evolution and dissipation in simulated specimens with realistic microstructural features. A clustered distinct element modeling (DEM) approach was implemented In the two-dimensional particle flow software package (PFC-2D) to study the complex behavior observed in asphalt mixture fracturing. The relationship between continuous and discontinuous material properties was defined based on the potential energy approach. The theoretical relationship was validated with the uniform axial compression and cantilever beam model using two-dimensional plane strain and plane stress models. A bilinear cohesive displacement-softening model was implemented as an intrinsic interface and applied for both homogeneous and heterogeneous fracture modeling in order to simulate behavior in the fracture process zone and to simulate crack propagation. A disk-shaped compact tension test (DC(T)) with heterogeneous microstructure was simulated and compared with the experimental fracture test results to study Mode I fracture. The realistic arbitrary crack propagation including crack deflection, microcracking, crack face sliding, crack branching, and crack tip blunting could be represented in the fracture models. This micromechanical modeling approach represents the early developmental stages towards a 'virtual asphalt laboratory,' where simulations of laboratory tests and eventually field response and distress predictions can be made to enhance our understanding of pavement distress mechanisms, such its thermal fracture, reflective cracking, and fatigue crack growth.

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Investigation of Ni/Cu Contact for Crystalline Silicon Solar Cells (결정질 실리콘 태양전지에 적용하기 위한 도금법으로 형성환 Ni/Cu 전극에 관한 연구)

  • Kim, Bum-Ho;Choi, Jun-Young;Lee, Eun-Joo;Lee, Soo-Hong
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.06a
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    • pp.250-253
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    • 2007
  • An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

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A Study on Tensile Properties of CFRP Composites under Cryogenic Environment (극저온 환경에서 탄소섬유강화 복합재의 인장 물성에 관한 연구)

  • Kim Myung-Gon;Kang Sang-Guk;Kim Chun-Gon;Kong Cheol-Won
    • Composites Research
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    • v.17 no.6
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    • pp.52-57
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    • 2004
  • In this study, mechanical tensile properties of carbon fiber reinforced polymeric (CFRP) composite cycled with thermo-mechanical loading under cryogenic temperature (CT) were measured using cryogenic environmental chamber. Thermo-mechanical tensile cyclic loading (up to 10 times) was applied to graphite/epoxy unidirectional laminate composites far room temperature (RT) to $-50^{\circ}C$, RT to $-100^{\circ}C$ and RT to $-150^{\circ}C$. Results showed that tensile stiffness obviously increased as temperature decreased while the thermo-mechanical cycling has little influence on it. Tensile strength, however, decreased as temperature down to CT while the reduction of strength showed little after CT-cycling. For the analysis of the test results, coefficient of thermal expansion (CTE) of laminate composite specimen at both RT and CT were measured and the interface between fiber and matrix was observed using SEM images.

Knowledge- Evolutionary Intelligent Machine-Tools - Part 1 : Design of Dialogue Agent based on Standard Platform

  • Kim, Dong-Hoon;Song, Jun-Yeob
    • Journal of Mechanical Science and Technology
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    • v.20 no.11
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    • pp.1863-1872
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    • 2006
  • In FMS (Flexible Manufacturing System) and CIM (Computer Integrated Manufacturing), machine-tools have been the target of integration in the last three decades. The conventional concept of integration is being changed into the autonomous manufacturing device based on the knowledge evolution by applying advanced information technology in which an open architecture controller, high-speed network and internet technology are included. In the advanced environment, the machine-tools is not the target of integration anymore, but has been the key subject of cooperation. In the near future, machine-tools will be more improved in the form of a knowledge-evolutionary intelligent device. The final goal of this study is to develop an intelligent machine having knowledge-evolution capability and a management system based on internet operability. The knowledge-evolutionary intelligent machine-tools is expected to gather knowledge autonomically, by producing knowledge, understanding knowledge, reasoning knowledge, making a new decision, dialoguing with other machines, etc. The concept of the knowledge-evolutionary intelligent machine is originated from the machine control being operated by human experts' sense, dialogue and decision. The structure of knowledge evolution in M2M (Machine to Machine) and the scheme for a dialogue agent among agent-based modules such as a sensory agent, a dialogue agent and an expert system (decision support agent) are presented in this paper, with intent to develop the knowledge-evolutionary machine-tools. The dialogue agent functions as an interface for inter-machine cooperation. To design the dialogue agent module in an M2M environment, FIPA (Foundation of Intelligent Physical Agent) standard platform and the ping agent based on FIPA are analyzed in this study. In addition, the dialogue agent is designed and applied to recommend cutting conditions and thermal error compensation in a tapping machine. The knowledge-evolutionary machine-tools are expected easily implemented on the basis of this study and shows a good assistance to sensory and decision support agents.

Effect of core design on fracture resistance of zirconia-lithium disilicate anterior bilayered crowns

  • Ko, Kyung-Ho;Park, Chan-Jin;Cho, Lee-Ra;Huh, Yoon-Hyuk
    • The Journal of Advanced Prosthodontics
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    • v.12 no.4
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    • pp.181-188
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    • 2020
  • PURPOSE. The effect of core design on the fracture resistance of zirconia-lithium disilicate (LS2) bilayered crowns for anterior teeth is evaluated by comparing with that of metal-ceramic crowns. MATERIALS AND METHODS. Forty customized titanium abutments for maxillary central incisor were prepared. Each group of 10 units was constructed using the same veneer form of designs A and B, which covered labial surface to approximately one third of the incisal and cervical palatal surface, respectively. LS2 pressed-on-zirconia (POZ) and porcelain-fused-to-metal (PFM) crowns were divided into "POZ_A," "POZ_B," "PFM_A," and "PFM_B" groups, and 6000 thermal cycles (5/55 ℃) were performed after 24 h storage in distilled water at 37 ℃. All specimens were prepared using a single type of self-adhesive resin cement. The fracture resistance was measured using a universal testing machine. Failure mode and elemental analyses of the bonding interface were performed. The data were analyzed using Welch's t-test and the Games-Howell exact test. RESULTS. The PFM_B (1376. 8 ± 93.3 N) group demonstrated significantly higher fracture strength than the PFM_A (915.8 ± 206.3 N) and POZ_B (963.8 ± 316.2 N) groups (P<.05). There was no statistically significant difference in fracture resistance between the POZ_A (1184.4 ± 319.6 N) and POZ_B groups (P>.05). Regardless of the design differences of the zirconia cores, fractures involving cores occurred in all specimens of the POZ groups. CONCLUSION. The bilayered anterior POZ crowns showed different fracture resistance and fracture pattern according to the core design compared to PFM.