• Journal of the Korean Ceramic Society
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• v.53 no.6
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• pp.689-699
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• 2016

The effects of composition, structure design, and coating thickness of thermal barrier coating (TBC) on thermal barrier performance were investigated by measuring the temperature differences of TBC samples. TBCs with the thin and thick top coats were used for these studies, including TBCs with rare-earth (Gd, Yb, and La) compositions. The thermal barrier performance was enhanced with increasing the thickness of top coat even for thin TBCs, indicating that the thermal barrier performance was commensurate to the thickness of top coat. On the other hand, the bi-layered TBC, which was prepared with Yb-Gd-YSZ feedstock powder, with the buffer layer of high purity 8YSZ showed a better thermal barrier performance than that of regular purity 8YSZ. The interfaces in the bi-layered TBCs had a decisive effect on the thermal barrier performance, showing the performance enhanced with increasing numbers of interfaces. However, a new structural design and an additional process should be considered to reduce stress concentrations and to ensure interface stability, respectively, for improving thermal durability in the multi-layered TBCs.

• Korean Journal of Materials Research
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• v.22 no.8
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• pp.390-396
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• 2012

Ag pastes added to Bi-oxide frits have been applied to the electrode material of Si solar cells. It has been reported that frits induce contacts between the Ag electrodes and the Si wafer after firing. During firing, the control of interfaces among Ag, the glass layer, and Si is one of the key factors for improving cell performance. Specifically, the thermo-physical properties of frits considerably influence Ag-Si contact. Therefore, the thermal properties of frits should be carefully controlled to enhance the efficiency of cells. In this study, the interface structures among Ag electrodes, glass layers, and recrystallites on an $n^+$ emitter were carefully analyzed with the thermal properties of lead-free frits. First, a cross-section of the area between the Ag electrodes and the Si wafer was studied in order to understand the interface structures in light of the thermal properties of the frits. The depth and area of the pits formed in the Si wafer were quantitatively calculated with the thermal properties of frits. The area of the glass layers between the Ag electrodes and Si, and the distribution of recrystallites on the $n^+$ emitter, were measured from a macroscopic point of view with the characteristics of the frits. Our studies suggest that the thermophysical properties should be controlled for the optimal performance of Si solar cells; our studies also show why cell performance deteriorated due to the high viscosity of frits in Ag pastes.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• Korean Journal of Materials Research
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• v.27 no.4
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• pp.221-228
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• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.67-72
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• 2015

A study on thermal properties for a single-layer metal and a 2-ply metal (clad metals) was investigated for the application of heat sink. For the single-layer metal, a stainless steel (STS) and an aluminum (Al) were selected. Also, a roll bonded clad metal with STS and Al was chosen for the 2-ply metal. The thermal conductivity of the sample was obtained from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared with the calculated values using the data from the references. For the single-layer metal, measured values for the thermal diffusivity and thermal conductivity were smaller than calculated values. Differences between measured and calculated values were about 6% and 18% for the STS and Al samples, respectively. For the clad metals, however, a large difference (55%) was observed. Here, a relatively small thermal conductivity measured by LFA was due to the existence of a interface between STS and Al in the clad metal. Such a interface reduces the moving velocity of free electrons and phonons in the clad metal. For the development of a high performance heat-issipation module with the multi-layer structure, the control of interface properties which determine thermal properties was confirmed to be important.

• Journal of Magnetics
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• v.10 no.4
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• pp.137-141
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• 2005

We confirmed that the improvement in properties of magnetic tunnel junctions prepared by radical oxidation after thermal treatment was mostly resulted from the redistribution of oxygen at the $AIOx/Co_{90}Fe_{10}$ interface. The as-deposited Al oxide barrier was oxygen-deficient but most of it re-oxidized into $Al_2O_3$, the thermodynamically stable stoichiometric phase, through thermal treatment. As a result, the effective barrier height was increased from 1.52 eV to 2.27 eV. On the other hand, the effective barrier width was decreased from 8.2 ${\AA}$ to 7.5 ${\AA}$. X-ray absorption spectra of Fe and Co clearly showed that the oxygen in the CoFe layer diffused back into the Al barrier and thereby enriched the barrier to close to a stoichiometirc $Al_2O_3$ phase. The oxygen bonded with Co and Fe diffused back by 6.8 ${\AA}$ and 4.5 ${\AA}$ after thermal treatment, respectively. Our results confirm that controlling the chemical structures of the interface is important to improve the properties of magnetic tunnel junctions.

• Journal of Mechanical Science and Technology
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• v.15 no.8
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• pp.1188-1195
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• 2001

A numerical analysis has been carried out to investigate the influences of thermosolutal convection on the heat and mass transfer and solute segregation in crystals grown by the vertical Bridgman technique. The governing equations are solved by a finite-volume method using the power law scheme and the SIMPLE algorithm in which body-fitted coordinate system has been used. A primary convective cell driven by thermal gradients forms in the bulk of the domain, while a secondary convective cell driven by solutal gradients forms near interface. As the solutal Rayleigh number increases, secondary cell becomes to be stronger and has a great influence on the radial concentration along the interface.

• The Korean Journal of Ceramics
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• v.4 no.4
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• pp.340-344
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• 1998

Failure mechanisms were investigated for the two layer thermal barrier coatings consisting of NiCrAlY bond coat and $ZrO_2$-8wt.% $Y_2O_3$ ceramic coating during cyclic oxidation. $Al_2O_3$ developed at the ceramic coating/bond coat interface first, followed by the Cr/Ni rich oxides such as $NiCr_2O_4$ and $Ni(Al, Cr)_2O_4$ during cyclic oxidation. It was observed that the spalling of ceramic coatings took place primarily within the NiCrAlY bond coat oxidation products or at the interface between the bond coat oxidation products and zirconia based ceramic coating or the bond coat. It was also observed that the fracture within these oxidation products occurred with the formation of $Ni(Cr, Al)_2O_4$ spinel or Cr/Ni rich oxides. It was therefore concluded that the formation of these oxides was a life-limiting event for the thermal barrier coatings.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.1
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• pp.33-41
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• 1994

It is well known that the position and the shape of the S/L interface affect the qualities of the single crystal in the growth process. Thus the information of the temperature profile in the growth system is very important. In this study, we developed the program to predict the temperature profile from the setting values of the heating blocks in VGF(vertical gradient freezing) single crystal growth system. With this program, we studied the effects of the materials and the sizes of support rod, the materials of the crucible on the S/L interface shape. The larger radius and/or smaller thermal diffusivity support rod was, the flatter the S/L interface was. When the thermal conductivity of crucible was isotropic, the S/L interface was more concave downward to the solid phase in proportional to the increase of thermal diffusivity of the crucible. By the comparison of the S/L interface shape between PBN crucible and quartz crucible for the same condition, the effect of anisotropy of thermal conductivity of crucible showed different trends with respect to the position of the S/L interface.

• Journal of Mechanical Science and Technology
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• v.15 no.7
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• pp.823-830
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• 2001

The single fiber pull-out technique has been commonly used to characterize the mechanical behavior of fiber/matrix interface in fiber reinforced composite materials. In this study, an improved analysis considering the effect of thermal residual stresses in both radial and axial directions is developed for the single fiber pull-out test. It is found to have the pronounced effects on the stress transfer properties across the interface and the interfacial debonding behavior.