• 한국전기전자재료학회논문지
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• 제17권1호
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• pp.94-100
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• 2004

We fabricated textured Ag substrates for YBCO coated conductor and evaluated the effects of annealing temperature on microstructural evolution, texture formation, and surface morphology. Ag ingot, as an initial specimen, was prepared by plasma arc melting(PAM). Subsequently, the ingot was cold rolled to 100 ${\mu}{\textrm}{m}$ thick tape and annealed at temperatures of 600-80$0^{\circ}C$. The texture and surface morphology of the substrate were characterized by pole-figure and atomic force microscopy(AFM) profile, respectively. It was observed that a strong ｛110｝<110> texture was formed after annealing and its symmetry improved as annealing temperature increased. The full-width at half-maximum(FWHM) of ｛110｝<110> pole was as sharp as 10$^{\circ}$ for the substrate annealed at 80$0^{\circ}C$. On the other hand, it was found that the thermal grooving and faceting became remarkable as annealing temperature increased : root-mean-square(RMS) roughness of the substrate annealed at 80$0^{\circ}C$ was 39.2 nm. The substrate of strong texture and smooth surface, fabricated in our study, is considered to be suitable for use as a substrate for the epitaxial deposition of superconductor film.

• 한국표면공학회지
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• 제24권4호
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• pp.196-205
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• 1991

Multi-level thin films are very important in ULSI applications because of their high electromigration resistance. This study presents the effects of titanium, titanium nitride and titanium tungsten underlayers of the stability of multi-aluminum thin films during isothermal annealing. High purity Al(99.999%) films have been electron-beam evaporated on Ti, TiN, TiW films formed on SiO2/Si (P-type(100))-wafer substrates by RF-sputtering in Ar gas ambient. The hillock growth was increased with annealing temperatures. Growth of hillocks was observed during isothermal annealing of the thin films by scanning electron microscopy. The hillock growth was believed to appear due to the recrystallization process driven by stress relaxation during isothermal annealing. Thermomigration damage was also presented in thin films by grain boundary grooving processes. It is shown that underlayers of Al/TiN/SiO2, Al/TiW/SiO2 thin films are preferrable to Al/SiO2 thin film metallization.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.493-494
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• 2006

Chip breaker of cutting tool is an important feature to enhance cutting performance. Powder injection molding process was used to produce a triangular-shape cermet grooving insert which has three chip breakers. Attrition milled cermet powders were mixed with wax-based binder system in continuous twin screw extruder. Three-plate injection mold with slide cores was used to produce injection-molded parts. After molding, solvent and thermal debinding was carried out. Sintering was conducted in a batch furnace with a graphite heater. The sintered parts satisfy the requirements of dimensional tolerances and material properties.

• 한국기계가공학회지
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• 제11권1호
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• pp.62-67
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• 2012

Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.292-292
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• 2000

Since high-power CO$_2$ Laser can be make a high densed energy to Local processing area, manufacturing processes using the laser can be processed for very Localized areas at a very fast rate with minimal or no distortion. Accordingly, the laser has been widely used in the fields of thermal manufacturing processes such as welding, fusion cutting, grooving, and heat treatment of metals. In particular, interest in the laser heat treatment process has grown tremendously in the past few years. In this process, maintaining the uniform hardening depth is important problem to obtain good quality products and to reduce heat induced distortion and residual stress. For achieving this objective, we introduced a new design technique of a fuzzy logic controller that greatly simplified the design procedure by defining several simplified design parameters. In the design procedure, the major design parameters of the controller are characterized by identifying several common aspects. From a series of simulation results, we found that the proposed design technique can be effectively used to design of a fuzzy logic controller for the LASER surface hardening process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.172-175
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• 2002

High speed machining is one of the most effective technologies to improve productivity. It can give great advantage for manufacture of die and Moulds. However, when machining of micro groove in high speed machining a severely thermal damage was generated on workpiece and cutting tool. Generally, the cutting fluid is used to improve penetration. lubrication. and cooling effect. In order to rise the performance of lubrication. it contains extreme pressure agents (Cl, S, P). But the environment of work room go bad by those additive. Therefore, the compressed chilly air with oil mist system was developed to replace the conventional cutting fluid system. This paper carried out the tests to evaluate the machinability by the cutting environment in high speed micro groove machining of NAK80 (HrC40). Compressed chilly air with oil mist was ejected on the contact area between cutting edge and workpiece. The effect of this developed compressed chilly air with oil mist system was evaluated in terms of tool life. The results showed that the tool lift of carbide tool coated TiAlN with compressed chilly air mist cooling was much longer than that of the dry and flood coolant when cutting the material.

• 대한금속재료학회지
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• 제50권12호
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• pp.913-920
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• 2012

In spite of some problems in processability and bondability, Au wires in the microelectronics industry are gradually being replaced by copper wires to reduce the cost of raw material. In this article, the effects of surface roughness enhanced capillaries on thermosonic Cu wire bonding were evaluated. The roughness-enhanced zirconia toughened alumina (ZTA) capillaries were fabricated via a thermal grooving technique. As a result, the shear bond strength of first bonds (ball bonds) bonded using the roughness-enhanced capillary was enhanced by 15% as compared with that of normal bonds due to more effective plastic deformation and flow of a Cu ball. In the pull-out test of second bonds (stitch bonds), processed at two limit conditions on combinations of process parameters, the bond strength of bonds formed using the roughness-enhanced capillary also resulted in values higher by 55.5% than that of normal bonds because of the increase in the bonding area, indicating the expansion of a processing window for Cu wire bonding. These results suggest that the adoption of roughness-enhanced capillaries is a promising approach for enhancing processability and bondability in Cu wire bonding.