• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1997.10a
• /
• pp.102-109
• /
• 1997

The surface deformation of shadow mask was studied by the experiments and numerical analysis for process improvement and delet of the stabilizing process in the shadow mask manufaturing line. To inverigate the thermal deformation of shadow mask with and without stabilizing process mask, data of spring strength, frame flatness, frame magnetic force and a mask surface curvature were measured. The tube characteristics of two kind of shadow masks were also investigated.

• Proceedings of the KSR Conference
• /
• 2002.05a
• /
• pp.411-416
• /
• 2002

The strength evaluation of a wheel is becoming very important due to the high speed of railway system and the reduction of wheel weight. Therefore, in this study, the influence of thermal stress at tread breaking in Korean High Speed Train wheel was investigated using FEM. During FEM analysis, the mechanical load or wheel-rail contract load and braking load were considered. When 300% of the block force was applied, the maximum von Mises stress of 61.0 ㎫ was found at the outside plate around 400mm far away from the wheel center.

• Journal of the Korean institute of surface engineering
• /
• v.48 no.2
• /
• pp.33-37
• /
• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.11
• /
• pp.683-687
• /
• 2017

We investigated the structure of an ultra-thin insulating board with low thermal conductivity along z-axis, which was based on the idea of void layers created during the glass infiltration process for the zero-shrinkage low-temperature co-fired ceramic (LTCC) technology. An alumina and four glass powders were chosen and prepared as green sheets by the tape casting method. After comparison of the four glass powders, bismuth glass was selected for the experiment. Since there is no notable reactivity between alumina and bismuth glass, alumina was selected as the supporting additive in glass layers. With 2.5 vol% of alumina powder, glass green sheets were prepared and stacked alternately with alumina green sheet to form the 'alumina/glass (including alumina additive)/alumina' structure. The stacked green sheets were sintered into an insulating substrate. Scanning electron microscopy revealed that the additive alumina formed supporting bridges in void layers. The depth and number of the stacking layers were varied to examine the insulating property. The lowest thermal conductivity obtained was 0.23 W/mK with a $500-{\mu}m-thick$ substrate.

• The Korean Journal of Zoology
• /
• v.39 no.1
• /
• pp.98-105
• /
• 1996

Studies on thermal adaptation postulate that optimal temperature of physiological properties matches a usually experienced body temperature (Tb) of organisms. Hibernating bats maintain Tb's that are slighdy higher than ambient temperatures (9$^{\circ}$-12$^{\circ}$C) of their wintering sites. To test the hypothesis that muscle function is adjusted to the Tb range of the hibernating animals, we examined contractile function of the biceps brachil muscle of Korean greater horseshoe bats, Rhinolophus ferrumequlnum korai (n = 5) at tissue temperatures between 1O$^{\circ}$ and 35$^{\circ}$C. Relative tetanic force (% of maximum force) was highest at temperatures of 1O$^{\circ}$-15$^{\circ}$C, which match well their Tb's during hibernation. Because non-hibernating endotherms with Tb of around 37$^{\circ}$C show the optimal temperature for muscle force over 30$^{\circ}$-40$^{\circ}$C, our results strongly suggest that the flight muscle of the bats may exhibit thermal adjustments according to their seasonal Tb's. The capacity to generate strong force at such low body temperatures may be adaptive, because bats must have muscles functioning to fly for occasional watering or excretion, or to move away from potential predators during hibernation.

• Economic and Environmental Geology
• /
• v.56 no.6
• /
• pp.629-646
• /
• 2023

Host rock of Cheonjeon-ri petroglyph is shale belonging to the Daegu Formation of Cretaceous Gyeongsang Supergroup. The rocks were hornfelsified by thermal alteration, and shows high density and hardness. The petroglyph forms weathered zone with certain depth, and has difference in mineral and chemical composition from the unweathered zone. As the physical deterioration evaluations, most of cracks on the surface appear parallel to the bedding, and are concentrated in the upper part with relatively low density. Breakout parts are occurred in the upper and lower parts of the petroglyph, accounting for 6.0% of the total area and occurs to have been created by the wedging action of cracks crossing. The first exfoliation parts occupying the surface were 23.8% of the total area, the second exfoliations covered with 9.3%, and the exfoliation parts with three or more times were calculated as 3.4%. It is interpreted that this is not due to natural weathering, and the thermal shock caused by the cremation custom here in the past. As the ultrasonic properties, the petroglyph indicates highly strength in the horizontal direction parallel to bedding, and the area with little physical damage recorded mean of 4,684 m/s, but the area with severe cracks and exfoliations showed difference from 2,597 to 3,382 m/s on average. Physical deterioration to the Cheonjeon-ri petroglyph occurred to influence by repeated weathering, which caused the rock surface to become more severe than the inside and the binding force of minerals to weaken. Therefore, it can be understood that when greater stress occurs in the weathered zone than in the unweathered zone, the relatively weathered surface loses its support and exfoliation occurs.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.3
• /
• pp.77-82
• /
• 2012

In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

• Journal of the Korean Vacuum Society
• /
• v.13 no.2
• /
• pp.72-78
• /
• 2004

Cu seed layers deposited by magnetron sputtering onto tantalum nitride barrier films were treated with ECR plasma and then the copper films were electroplated and rapid thermal annealed in an argon or nitrogen atmosphere at various temperatures ranging from 200 to $500^{\circ}C$. Changes in the microstructure and physical properties of the copper films electroplated on the hydrogen ECR plasma cleaned copper seed layers were investigated using X-ray diffraction (XRD), electron back-scattered diffraction (EBSD), and atomic force microscopy (AFM) analyses. It was found that the copper film undergoes complete recrystallization during annealing at a temperature higher than $400^{\circ}C$. The resistivity of the Cu film tends to decrease and the degree of (111) preferred orientation tends to increase as the annealing temperature increases. Theoptimum annealing condition for obtaining the film with the lowest resistivity, the smoothest surface and the highest degree of the (111) preferred orientation is rapid thermal annealing in a nitrogen atmosphere at $400^{\circ}C$ for 120 s. The resistivity and the surface roughness of the electroplated copper film annealed under this condition are 1.98 $\mu$O-cm and 17.77 nm, respectively.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.1
• /
• pp.49-53
• /
• 2011

Diamond-like carbon (DLC) films is a metastable form of amorphous carbon containing a significant fraction of Sp3 bond. DLC films have been characterized by a range of attractive mechanical, chemical, tribological, as well as optical and electrical properties. In this study DLC films were prepared by the RF magnetron sputter system on $SiO_2$ substrates using graphite target. The effects of the post annealing temperature on the Property variation of the DLC films were examined. The DLC films were annealed at temperatures ranging from 300 to $500^{\circ}C$ using rapid thermal process equipment in vacuum. The variation of electrical property and surface morphology as a function of annealing treatment was investigated by using a Hall Effect measurement and atomic force microscopy. Raman and X-ray photoelectron spectroscopy analyses revealed a structural change in the DLC films.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.6 no.1
• /
• pp.58-63
• /
• 2005

PTFE (polytetrafluoroethylene) thin films were prepared from the pellets of the graphite doped PTFE via pulsed laser ablation with 1064 nm Nd:YAG laser. The graphite powder converts the absorbed photon energy into thermal energy which is transmitted to nearby PTFE. The PTFE is decomposed by thermal process. The deposited films were transparent and crystalline. SEM (scanning electron microscopy) and AFM (atomic force microscopy) analyses indicated that the film surface morphology changed to fibrous structure with increasing thickness. The fluorine to carbon ratios of the film were 1.7 and molecular axis was parallel with (100) Si-wafer substrate. These results obtained by XPS (X-ray photoelectron spectroscopy), FTIR (fourier transform infrared spectroscopy) and XRD (X-ray diffraction).