• 한국신뢰성학회지:신뢰성응용연구
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• 제7권2호
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• pp.45-55
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• 2007

In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Nuclear Engineering and Technology
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• 제45권1호
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• pp.99-106
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• 2013

Thermal fatigue is a significant long-term degradation mechanism in nuclear power plants. In particular, as operating plants become older and life time extension activities are initiated, operators and regulators need screening criteria to exclude risks of thermal fatigue and methods to determine significant fatigue relevance. In general, the common thermal fatigue issues are well understood and controlled by plant instrumentation at fatigue susceptible locations. However, incidents indicate that certain piping system Tee connections are susceptible to turbulent temperature mixing effects that cannot be adequately monitored by common thermocouple instrumentations. Therefore, in this study thermal fatigue evaluation of piping system Tee-connections is performed using the fluid-structure interaction (FSI) analysis. From the thermal hydraulic analysis, the temperature distributions are determined and their results are applied to the structural model of the piping system to determine the thermal stress. Using the rain-flow method the fatigue analysis is performed to generate fatigue usage factors. The procedure for improved load thermal fatigue assessment using FSI analysis shown in this study will supply valuable information for establishing a methodology on thermal fatigue.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 대한금속재료학회지
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• 제46권2호
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• Journal of Advanced Marine Engineering and Technology
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• 제28권5호
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• pp.762-772
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• 2004

Fatigue life of a Piston for large liquid Petroleum liquid injection(LPLi) bus engines is analyzed considering effects of cooling condition parameters : temperature of cooling water, and heat transfer coefficients at oil gallery and bottom surface of piston head. Temperature of the piston is analyzed with varying cooling conditions Stresses of the piston from two load cases of pressure loading. and pressure and thermal loading are analyzed Fatigue life under repeated peak pressure and thermal cycle is analyzed by the strain-life theory. For the two load cases, required loading cycles for engine life are defined, and loading cycles to failure and partial damages are calculated. Based on the resulting accumulated fatigue usage factors, endurance of the piston is evaluated and effects of varying cooling condition Parameters are discussed.

• 한국생산제조학회지
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• 제19권2호
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• pp.157-162
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• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.160-165
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• 2004

At this research, we examined probability of light bulb's life span value and prediction on purpose to inquire out the span of repeat velocity as fracture probability by executing the fatigue test, which is considered property of Tungsten filament's thermal fatigue used as an automobile bulb. As a result we can confirm what the most suitable solution is weibull distribution and log normal distribution. Tungsten filament's span gets longer as the fatigue repeat velocity gets shorter And, repeat span is about 15%~40% shorter than sequence life span.

• International Journal of Automotive Technology
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• 제5권4호
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• pp.297-302
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• 2004

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermo-mechanical cyclic loading. As a failure of the exhaust manifold is mainly caused by geometric constraints of the less expanded inlet flange and cylinder head, the analysis is based on the exhaust system model with three-dimensional temperature distribution and temperature dependent material properties. The result show that large compressive plastic deformations are generated at an elevated temperature of the exhaust manifold and tensile stresses are remained in several critical zones at a cold condition. From the repetition of these thermal shock cycles, maximum plastic strain range (0.454%) could be estimated by the stabilized stress-strain hysteresis loops. It is used to predict the low cycle thermal fatigue life of the exhaust manifold for the thermal shock test.

• 한국자동차공학회논문집
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• 제15권1호
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• pp.139-145
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• 2007

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermomechanical cyclic loadings. The analysis includes the FE model of the exhaust system, temperature dependent material properties, and thermal loadings. The result shows that at an elevated temperature, large compressive plastic deformations are generated, and at a cold condition, tensile stresses are remained in several critical zones of the exhaust manifold. From the repetitions of thermal shock cycles, plastic strain ranges could be estimated by the stabilized stress-strain hysteresis loops. The method was applied to assess the low cycle thermal fatigue for the engine exhaust manifold. It shows a good agreement between numerical and experimental results.