• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.337-337
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• 2001

High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.

• Tunnel and Underground Space
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• v.7 no.2
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• pp.130-135
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• 1997

When crystalline rocks are heated, thermal stress is induced by the differences in thermal expansion of the mineral composition and its orientation. In this study, high temperature uniaxial compressive tests were carried out for Iksan and Hwangdeung granites to study the deformation and failure behavior due to thermal loading. Compressive and tensile strength of Hwangdeung granite for 20$0^{\circ}C$ decreased to 80% and 82% of the room temperature strength, and those of Iksan granite decreased to 90% and 92% for 20$0^{\circ}C$, respectively. Elastic moduli of both granites were decreased sharply at the stress level of 80% of ultimate failure strength. Elastic moduli of both granites by variation of temperature at 50% of ultimate failure strength was decreased as almost linearly.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.79-94
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• 2002

Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

• Structural Engineering and Mechanics
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• v.37 no.3
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• pp.257-265
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• 2011

Plant-specific analyses of 5 types of domestic reactors in Korea are performed to assure the structural integrity of the reactor pressure vessel (RPV) during transients which are expected to initiate pressurized thermal shock (PTS) events. The failure probability of the RPV due to PTS is obtained by performing probabilistic fracture mechanics analysis. The through-wall cracking frequency is calculated and compared to the acceptance criterion. Considering the fluence at the end of life expected by surveillance test, the sufficient safety margin is expected for the structural integrity of all reactor pressure vessels except for the oldest one during the pressurized thermal shock events. If the flaw with aspect ratio of 1/12 is considered to eliminate the conservatism, the acceptance criteria is not exceeded for all plants until the fluence level of $8{\times}10^{19}\;n/cm^2$, generating sufficient margin beyond the design life.

• KEPCO Journal on Electric Power and Energy
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• v.6 no.1
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• pp.41-47
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• 2020

The contribution of damage mechanisms to failure of steam turbine casing made of Cr-Mo-V steel was investigated. Creep-fatigue interaction on the HP side corner of turbine casing was revealed as the root cause of the catastrophic failure performed by metallurgical analysis. The steady-state pressure and transient thermal stress were analyzed based on the actual operating condition of the thermal plant. Damage of creep-fatigue interaction to crack initiation was evaluated with multiaxial effects. The contribution ratio of creep and fatigue to the crack initiation was estimated to 3:1. Temporary geometrical correct action with repair weld was executed. For long-term operation, design improvement of casing equipment for creep resistance should be needed.

• Journal of the Korean Ceramic Society
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• v.36 no.10
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• pp.1069-1074
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• 1999

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.101-108
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• 2010

Domestic three-way catalyst satisfies exhaust gas conversion efficiency or pressure drop etc. but doesn't satisfy thermal durability. Thermal stress analysis for three-way catalyst was performed based on experimental temperature distribution. Thermal safety of three-way catalyst was estimated by safety factor. Aspect ratio variable had the most significant effect on thermal stress. Thickness variable had the least significant effect on thermal stress. Optimal conditions for premature failure prevention of three-way catalyst were as follows : (1) aspect ratio of three-way catalyst : 0.6:1 (2) 2.84mm thick (3) silicon nitride. The safety of Taguchi-optimized three-way catalyst were 4.7 times higher than that of existent three-way catalyst.

• The Korean Journal of Ceramics
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• v.4 no.4
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• pp.340-344
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• 1998

Failure mechanisms were investigated for the two layer thermal barrier coatings consisting of NiCrAlY bond coat and $ZrO_2$-8wt.% $Y_2O_3$ ceramic coating during cyclic oxidation. $Al_2O_3$ developed at the ceramic coating/bond coat interface first, followed by the Cr/Ni rich oxides such as $NiCr_2O_4$ and $Ni(Al, Cr)_2O_4$ during cyclic oxidation. It was observed that the spalling of ceramic coatings took place primarily within the NiCrAlY bond coat oxidation products or at the interface between the bond coat oxidation products and zirconia based ceramic coating or the bond coat. It was also observed that the fracture within these oxidation products occurred with the formation of $Ni(Cr, Al)_2O_4$ spinel or Cr/Ni rich oxides. It was therefore concluded that the formation of these oxides was a life-limiting event for the thermal barrier coatings.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.53-58
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• 2005

We researched damage formation and failure mechanism under DC(direct current) and AC(alternative current) in order to estimate reliability of Cu interconnects in ULSI. Higher current density and temperature induces more short TTF(time to failure) during interconnects carry DC. Measurement reveals that Cu electromigration has activation energy of 0.96eV and current density exponent value of 4. Thermal fatigue is occurred under DC, and higher frequency and ${\Delta}$T value gives more severe damage during interconnects carry AC Through failure morphology analysis with respect to texture, we observed that damages had grown widely and facetted grains had appeared in (100)grain but damages in (111) had grown thickness direction of line and had induced a failure rapidly.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.12
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• pp.1169-1176
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• 2005

In this paper, thermal reliability of a closed type BLDC (Brushless DC) motor for high speed axial fan was analyzed by the accelerated life test. The closed type BLDC (Model No. MB1-8855-J01) motor was controlled by PCB module, which was composed of various electrical components. The failure of the closed type BLDC motor happened in PCB module due to high temperature. Failure mechanism of the closed type BLDC motor appears to be electrolyte dry out of capacitor. The accelerate life test was performed in temperature stress of $85^{\circ}C\;and\;105^{\circ}C$, respectively The failure data from the accelerated life test were analyzed and the life in each stress level was estimated with 960h and 261 h. At last, both life expression according to operating temperature of PCB module and life of the closed type BLBC motor in normal condition $(50^{\circ}C)$ were suggested.