• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.23-29
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• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.214-219
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• 2001

One of the major limitations of productivity and quality in metal cutting is the machining accuracy of machine tools. The machining accuracy is affected by geometric errors, thermally-induced errors, and the deterioration of the machine tools. Geometric and thermal errors of machine tools should be measured and compensated to manufacture high quality products. In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. In this study, the compensation device and temperature-based algorithm have been presented in order to compensate thermal error of machine tools under the real-time. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses, a designed spherical ball artifact, and five gap sensors. In order to compensate thermal characteristics under several operating conditions, experiments performed with five gap sensors and manufactured compensation device on the horizontal machining center.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1206-1209
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• 2007

Both PM-OLEDs and AM-OLEDs are now in production. However, manufacturers are still concerned about life-time, voltage drift, operating voltage and efficiency in order to develop larger displays. Most material suppliers seem to be focussing on emitters and the benefits of introducing suitable charge transporters have been largely unexplored. OLED-T has developed a novel organic electron injector (Trade Name: EI-101) which evaporates at a very low temperature of $300^{\circ}C$ as opposed to the conventional LiF which requires $580^{\circ}C$. EI-101 has been found to increase the lifetime by up to 12%, reduce the voltage drift by up to 61% and increase the efficiency by up to 15%. The material can be handled in air and in situ Q-mass spectroscopy on extended thermal evaporation has confirmed its high stability for use in mass production.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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• pp.609-610
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2241-2242
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 전자공학회논문지D
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• 제34D권3호
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• pp.105-113
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• 1997

We constructed a very accurate fiber bragg grating sensor system using an unbalanced mach-zehnder interferometer which converts the measurand-induced bragg wavelength shift to phase change of th einterference signal. With a shielded reference grating, output phase drift which orginates from the thermal drift on the interferometer was compensated. Mesured accuracy of the constructed system was 0.03 .deg. C and 0.26.mu. strain for temperature and strain measuremtn, respectively. It is over 300 times better resolution compared to the conventional optical spectrum analyzer which has 0.1nm wavelength resolution capability.

• 한국산업융합학회 논문집
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• 제4권3호
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• pp.329-337
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• 2001

This simulator is developed for the analysis of a MOSFET based on Thermally Coupled Energy Transport Model(TCETM). The simulator has the ability to calculate not only stationary characteristics but also non - stationary characteristics of a MOSFET. It solves basic semiconductor devices equations including Possion equation, current continuity equations for electrons and holes, energy balance equation for electrons and heat flow equation, using finite difference method. The conventional semiconductor device simulation technique, based on the Drift-Diffusion Model (DDM), neglects the thermal and other energy-related properties of a miniaturized device. I, therefore, developed a simulator based on the Thermally Coupled Energy Transport Model (TCETM) which treats not only steady-state but also transient phenomena of such a small-size MOSFET. In particular, the present paper investigates the breakdown characteristics in transient conditions. As a result, we found that the breakdown voltage has been largely underestimated by the DDM in transient conditions.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.1275-1276
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• International Journal of Precision Engineering and Manufacturing
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• 제1권1호
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• pp.111-117
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• 2000

One of the major limitations of productivity and quality in metal cutting is the machining accuracy of machine tools. The machining accuracy is affected by geometric errors, thermally-induced errors, and the deterioration of the machine tools. Geometric and thermal errors of machine tools should be measured and compensated to manufacture high quality products. In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models the thermal errors for error analysis and develops an on-the-machine measurement system by which the volumetric errors are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses and a designed spherical ball artifact (SBA). Experiments show that the developed system provides a high measuring accuracy, with repeatability of $\pm$2$\mu\textrm{m}$ in X, Y and Z directions. It is believed that the developed measurement system can be also applied to the machine tools with CNC controller. In addition, machining accuracy and product quality can be also improved by using the developed measurement system when the spherical ball artifact is mounted on a modular fixture.

• 한국정밀공학회지
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• 제17권1호
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• pp.120-128
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• 2000

One of the major limitations of productivity and quality in metal cutting is the machining accuracy of machine tools. The machining accuracy is affected by geometric errors, thermally-induced errors, and the deterioration of the machine tools. Geometric and thermal errors of machine tools should be measured and compensated to manufacture high quality products. In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models of the thermal errors for error analysis and develops on-the-machine measurement system by which the volumetric error are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses and a designed spherical ball artifact (SBA). Experiments, performed with the developed measurement system, show that the system provides a high measuring accuracy, with repeatability of $\pm$2${\mu}{\textrm}{m}$ in X, Y and Z directions. It is believed that the developed measurement system can be also applied to the machine tools with CNC controller. In addition, machining accuracy and product quality can be improved by using the developed measurement system when the spherical ball artifact is mounted on the modular fixture.