• Title/Summary/Keyword: Thermal dissipation

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Evaluation of Surface Temperature Variation and Heat Exchange Rate of Concrete Road Pavement with Buried Circulating Water Piping (열매체 순환수 배관이 매설된 콘크리트 도로 포장체의 표면 온도 변화와 방열량 평가)

  • Byonghu Sohn;Yongki Kim
    • Journal of the Korean Society for Geothermal and Hydrothermal Energy
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    • v.19 no.3
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    • pp.1-13
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    • 2023
  • Hydronic heated road pavement (HHP) systems have been well established and documented to provide road safety in winter season over the past two decades. However, most of the systems run on asphalt, only a few are tested with concrete, and there rarely is a comparison between those two common road materials in their performance. The aim of this study is to investigate the thermal performance of the concrete HHP systems, including surface temperature variations of experimental pavements in winter season. For preliminary study a small-scale experimental system was installed to evaluate the heat transfer characteristics of the concrete HHP in the test field. The system consists of 3 concrete slabs made of 1 m in width, 1 m in length, and 0.25 m in height. In these slabs, circulating water piping was embedded with different pipe depths of 0.08 m (Case A), 0.12 m (Case B), and 0.20 m (Case C) and same horizontal space of 0.16 m. Heating performance in winter season was tested with different inlet temperatures of 25℃, 30℃, 35℃ and 40℃ during the entire measurement period. Overall, the surface temperature of the concrete HHPs remained above 3℃ in all experimental conditions applied in this study. The results of the surface temperature measurement with respect to the pipe depth showed that Case B was the highest among the three cases. However, the closer the circulating water pipe was to the pavement surface, the greater the heat exchange rate. This results is considered that the heat is continuously accumulated inside the pavements and then the temperature inside the pavements increases, while the amount of heat dissipation decreases as the temperature difference between the inlet and outlet of circulating water decreases. In this preliminary test the applicability of the concrete HHP on road deicing was confirmed. Finally, the results can be used as a basis for studying the effects of various variables on road pavements through numerical analysis and for conducting large-scale empirical experiments.

Reliability Assessment of Flexible InGaP/GaAs Double-Junction Solar Module Using Experimental and Numerical Analysis (유연 InGaP/GaAs 2중 접합 태양전지 모듈의 신뢰성 확보를 위한 실험 및 수치 해석 연구)

  • Kim, Youngil;Le, Xuan Luc;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.75-82
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    • 2019
  • Flexible solar cells have attracted enormous attention in recent years due to their wide applications such as portable batteries, wearable devices, robotics, drones, and airplanes. In particular, the demands of the flexible silicon and compound semiconductor solar cells with high efficiency and high reliability keep increasing. In this study, we fabricated a flexible InGaP/GaAs double-junction solar module. Then, the effects of the wind speed and ambient temperature on the operating temperature of the solar cell were analyzed with the numerical simulation. The temperature distributions of the solar modules were analyzed for three different wind speeds of 0 m/s, 2.5 m/s, and 5 m/s, and two different ambient temperature conditions of 25℃ and 33℃. The flexibility of the flexible solar module was also evaluated with the bending tests and numerical bending simulation. When the wind speed was 0 m/s at 25 ℃, the maximum temperature of the solar cell was reached to be 149.7℃. When the wind speed was increased to 2.5 m/s, the temperature of the solar cell was reduced to 66.2℃. In case of the wind speed of 5 m/s, the temperature of the solar cell dropped sharply to 48.3℃. Ambient temperature also influenced the operating temperature of the solar cell. When the ambient temperature increased to 33℃ at 2.5 m/s, the temperature of the solar cell slightly increased to 74.2℃ indicating that the most important parameter affecting the temperature of the solar cell was heat dissipation due to wind speed. Since the maximum temperatures of the solar cell are lower than the glass transition temperatures of the materials used, the chances of thermal deformation and degradation of the module will be very low. The flexible solar module can be bent to a bending radius of 7 mm showing relatively good bending capability. Neutral plane analysis was also indicated that the flexibility of the solar module can be further improved by locating the solar cell in the neutral plane.

Effect of Ta/Cu Film Stack Structures on the Interfacial Adhesion Energy for Advanced Interconnects (미세 배선 적용을 위한 Ta/Cu 적층 구조에 따른 계면접착에너지 평가 및 분석)

  • Son, Kirak;Kim, Sungtae;Kim, Cheol;Kim, Gahui;Joo, Young-Chang;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.1
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    • pp.39-46
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    • 2021
  • The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.