• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.37 no.5
• /
• pp.657-664
• /
• 2013

By using shear mixing and ultrasonication, we fabricated specimens of well-dispersed multi-walled carbon nanotube composites. To confirm the proper dispersion of the filler, we used scanning electron microscopy images for quantitative evaluation and a tensile test for qualitative assessment. Furthermore, the coefficients of thermal expansion of several specimens having different filler contents were calculated from the measured thermal strains and temperatures of the specimens. Based on the microscopy images of the well-dispersed fillers and the small deviations in the measurements of the tensile strength and stiffness, we confirmed the proper dispersion of nanotubes in the epoxy. As the filler contents were increased, the values of tensile strength increased from 58.33 to 68.81 MPa, and those of stiffness increased from 2.93 to 3.27 GPa. At the same time, the coefficients of thermal expansion decreased. This implies better thermal stability of the specimen.

• Nuclear Engineering and Technology
• /
• v.49 no.7
• /
• pp.1388-1395
• /
• 2017

The Helically coiled tube Once-Through Steam Generator (H-OTSG) is a key piece of equipment for compact small reactors. The present study developed and verified a thermal-hydraulic design and performance analysis computer code for a countercurrent H-OTSG installed in a small pressurized water reactor. The H-OTSG is represented by one characteristic tube in the model. The secondary side of the H-OTSG is divided into single-phase liquid region, nucleate boiling region, postdryout region, and single-phase vapor region. Different heat transfer correlations and pressure drop correlations are reviewed and applied. To benchmark the developed physical models and the computer code, H-OTSGs developed in Marine Reactor X and System-integrated Modular Advanced ReacTor are simulated by the code, and the results are compared with the design data. The overall characteristics of heat transfer area, temperature distributions, and pressure drops calculated by the code showed general agreement with the published data. The thermal-hydraulic characteristics of a typical countercurrent H-OTSG are analyzed. It is demonstrated that the code can be utilized for design and performance analysis of an H-OTSG.

• Journal of the Korean Institute of Gas
• /
• v.7 no.3 s.20
• /
• pp.58-64
• /
• 2003

This paper presents design safety analysis of pressure vessels. The gas pressure and thermal loads are applied to the pressure vessel simultaneously. In this study, ASME Sec. VIII Div. 2 code was accepted for the safety design of high-pressure vessel. And this result was analyzed using a coupled thermal-mechanical FEM analysis technique. The FEM computed result shows that ASME design code may not guarantee for combined loads of high gas pressure and thermal loads. And solid pressure vessel may be safe compared to other pressure vessels with supporting rings round the cylinder body.

• Journal of computational fluids engineering
• /
• v.21 no.2
• /
• pp.90-98
• /
• 2016

A numerical study is conducted on thermal performance of a large-area hot plate specially designed as a heating and cooling tool for thermal nanoimprint lithography process. The hot plate has a dimension of $240mm{\times}240mm{\times}20mm$, in which a series of cartridge heaters and cooling holes are installed. The material is stainless steel selected for enduring the high molding pressure. A numerical model based on the ANSYS Fluent is employed to predict the thermal behavior of the hot plate both in heating and cooling phases. The PID thermal control of the device is modeled by adding user defined functions. The results of numerical computation demonstrate that the use of cartridge heaters provides sufficient heat-up performance and the active liquid cooling in the cooling holes provides the required cool-down performance. However, a crucial technical issue is raised that the proposed design poses a large temperature non-uniformity in the steady heating phase and in the transient cooling phase. As a remedy, a new hot plate in which heat pipes are installed in the cooling holes is considered. The numerical results show that the installation of heat pipes could enhance the temperature uniformity both in the heating and cooling phases.

• Proceedings of the Korean Geotechical Society Conference
• /
• 2010.09a
• /
• pp.813-824
• /
• 2010

Thermal conductivity of soils is one of the most important parameters to design horizontal ground heat exchangers. It is well known that the thermal conductivity of soil is strongly influenced by its density and water content because of soil's particulate structure. This paper reviewed and evaluated some of the commonly used prediction models for thermal conductivity of soils with the experimental data available in the literature. Semi-theoretical models for two-component materials were found inappropriate to estimate the thermal conductivity of dry state sands. It came out that the model developed by Cote and Konrad gave the best overall prediction for unsaturated sands available in the literature. Also, a parametric analysis is conducted to investigate the effect of thermal conductivity and water content, soil type on the horizontal ground heat exchanger design. The analysis shows that a required pipe length for the horizontal ground heat exchanger is reduced with the increase of soil thermal conductivity and water content. The calculation results also show that the dimension of the horizontal ground heat exchanger can be reduced to a certain extent by using backfilling material with a higher thermal conductivity of solid particles.

• Progress in Superconductivity and Cryogenics
• /
• v.14 no.4
• /
• pp.24-27
• /
• 2012

The measurement of the coefficient of thermal expansion (CTE) of polypropylene laminated paper (PPLP) as electric insulating material is important for its practical superconducting device application. The thermal strain induced to HTS tapes and its insulating material during cooling from room temperature might largely affect the critical current ($I_c$) of HTS tapes. In this study, the thermal contraction of PPLP material was measured during cooling from 300 K to 77 K using double extensometers. Initially, the CTE of a brass tape was measured and it was compared with a reference data. It was found that the measured thermal expansion data of the brass material approaches that of the reference one. Based on the results, it was then confirmed that the measurement technique could be applied to thin and flexible samples. Therefore, the same measurement procedure was applied to PPLP material using double extensometers. As a result, the linear CTE of the PPLP at 77 K has been measured to be ${\sim}15.3{\times}10^{-6}/K$. Also, it was found that the thermal contraction characteristics of PPLP was dominated by polypropylene on the cross direction (higher thermal contraction) while it was dominated by Kraft paper on the machine direction (lower thermal contraction). Overall, this measurement procedure could be adopted for the determination of CTE of flexible materials such as PPLP.

• KIEAE Journal
• /
• v.17 no.3
• /
• pp.15-21
• /
• 2017

Purpose: "Building energy design standard" is used to limit the thermal transmittance of building in Korea. However, it only covers the insulation standard for each appropriate elements of a building, not the thermal performance of Junction thermal bridge of windows and doors installed in wall. Therefore in this study, we have evaluated the thermal performance of Junction thermal bridge depending on installation method and position of windows and provide it as design data. Method: We analyzed heat transfer of 4-Track sliding window and tilt & turn triple glazed window that are placed in the first class category on window energy efficiency rating using Window 7.4 and Therm 7.4. Result : First, linear thermal transmittance of 4-Track sliding window differs by 2.2 times or more depending of installation method and location. It is higher than the linear thermal transmittance, 0.01W/mK, proposed by Passivhaus. Second, linear thermal transmittance of Tilt & turn triple glazed window differs by 7.7 times or more depending of installation method and location. The average linear thermal transmittance was less than 0.01W /mK when windows were installed on the internal wall insulation by the fixed hardware attachment method. Third, the thermal losses of a window caused by a junction thermal bridge are inversely proportional to the window area and converge gradually as the area increased.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.39 no.11
• /
• pp.1069-1076
• /
• 2011

All of the satellite components must be operated within the permissible temperature range during the mission in orbit. Therefore, thermal design is performed to develop verified thermal model and to secure thermal stability on the ground. In this study, thermal model correlation was performed to satisfy the criteria of correlation using ground thermal vacuum/thermal balance test results of LEO satellite optical payload. We also secured verified thermal model by controlling operating cycle of flight heaters. In addition, it was confirmed that all components are within the permissible temperature range through conducting orbit environment thermal analysis. We also secured thermal stability of the satellite.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.24-24
• /
• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• Journal of Sensor Science and Technology
• /
• v.27 no.5
• /
• pp.300-305
• /
• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.