• Title/Summary/Keyword: Thermal connection

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Implementation of Battery Management System for Li-ion Battery Considering Self-energy Balancing (셀프에너지 밸런싱을 고려한 리튬이온전지의 Battery Management System 구현)

  • Kim, Ji-Myung;Lee, Hu-Dong;Tae, Dong-Hyun;Ferreira, Marito;Park, Ji-Hyun;Rho, Dae-Seok
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.3
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    • pp.585-593
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    • 2020
  • Until now, 29 fire accidents have occurred; 22 of them were caused by the interconnection of renewable energy sources that occurred during the rest period after the lithium-ion battery had been fully charged regardless of the seasons. The fire accidents of ESS were attributed to thermal runaway due to the overcharging of a few cells with the phenomenon of self-energy balancing, which is unintentional current flow from cells with a high SOC to the low cells if the SOC condition of each cell connected in parallel is different. Therefore, this paper proposes a novel configuration and operation algorithm of the BMS to prevent the self-energy balancing of ESS and presents a hybrid SOC estimation algorithm. From the test results of the self-energy balancing phenomenon between aging and normal cells based on the proposed algorithm and BMS, it was confirmed the possibility of self-energy balancing, which is unintentional current flow from cells with a high SOC to cells with a low SOC. In addition, the proposed configuration of the BMS is useful and practical to improve the safety of lithium-ion batteries because the BMS can reliably disconnect a parallel connection of the cells if the self-energy balancing current becomes excessively high.

A Study on the Cobalt Electrodeposition of High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive (단일 첨가제를 이용한 고종횡비 TSV의 코발트 전해증착에 관한 연구)

  • Kim, Yu-Jeong;Lee, Jin-Hyeon;Park, Gi-Mun;Yu, Bong-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.140-140
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    • 2018
  • The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

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Optical System Design of Compact Head-Up Display(HUD) using Micro Display (마이크로 디스플레이를 이용한 소형 헤드업 디스플레이 광학계 설계)

  • Han, Dong-Jin;Kim, Hyun-Hee
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.9
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    • pp.6227-6235
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    • 2015
  • The HUD has recently been downsized due to the development of micro display and LED technology as a see through information display device, gradually expands the application areas. In this paper, using a DLP micro display device designed a compact head-up display(HUD) optical system for biocular observation of the image exhibition area 5 inches. It was analyzed for each design element of the optical system in order to design a compacted HUD. DLP, projection optical system and concave image combiner were discussed the design approach and the characteristics. Through a connection structure analysis of each optical system, detailed design specifications were set up and designed the optical system in detail. Put a folded configuration in the form of a white diffuse reflector between the projection lens and concave image combiner was designed to be independent, respectively. Distance of the projected image is adjustable up to approximately 2m ~ infinity and observation distance is 1m. Resolution could be recognized by 1 ~ 2pixels in HD($1,280{\times}720pixels$) class, various characters and symbols could be read. In addition, color navigation map, daytime video camera and thermal imaging cameras can be displayed.

A Recurring Eddy off the Korean Northest Coast Captured on Satellite Ocean Color and Sea Surface Temperature Imagery (위성의 해색 영상과 해수면온도 영상을 활용한 재발생 와동류에 관한 연구)

  • ;B.G.Mitchell
    • Korean Journal of Remote Sensing
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    • v.15 no.2
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    • pp.175-181
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    • 1999
  • A recurring eddy which located at the terminal end of the Korean East Warm Current was captured on ocean color and sea surface temperature imagery from satellite in spring and autumn. During late April, 1997 thermal infrared imagery from the NOAA AVHRR sensor and ocean color data from the Japanese ADEOS-I OCTS sensor, revealed this feature. The cold core had elevated chlorophyll concentrations, based on OCTS estimates, of greater than 3 mg/m$^3$ while the warmer surrounding waters had chlorophyll concentrations of 1 mg/m$^3$ or less. The elevated cholophyll accociated with this eddy has not been previously described. The eddy is also evident in SST images from autumn, but the SST in the core is warmer than in spring, and the warm jet flowing to the west of the eddy is also warmer is autumn compared to spring. A reccurring eddy and the high chlorophyll_a concentration area which surround around the eddy show on NOAA and SeaWiFS images in March 2, 1998. The eddy forms at the northern extent of the Korean East Warm Current as those waters collide with the cold, south-flowing Liman Current over a topographic shelf about 1500 m deep. This region of the eddy formation appears to have a strong connection with the dynamics of the western part of the polar front eddy field that dominates surface mesoscale structure in the central East (Japan) Sea. Interaction of the eddy with ARGOW tracked drifters, and evidence for its persistence are discussed.

An Experimental Study on the Evaluation of EMP Shielding Performance of Concrete Applied with ATMSM Using Zn-Al Alloy Wire (Zn-Al 합금 선재를 이용한 금속용사 공법 적용 콘크리트의 전자파 차폐 성능 평가에 관한 실험적 연구)

  • Choi, Hyun-Jun;Park, Jin-Ho;Min, Tae-Beom;Jang, Hyun-O;Lee, Han-Seung
    • Journal of the Korea Institute of Building Construction
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    • v.19 no.3
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    • pp.209-217
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    • 2019
  • EMP (Electromagnetic Pulse) usually means High Power Electromagnetic Wave (HPEM). In the case of the shielding plate against the EMP, there is a possibility of deterioration of the electromagnetic wave shielding performance due to the skill of the constructor, bad construction, deformation of the shielding plate at the connection portion (joint portion). The inefficient use of space due to the separation distance is also pointed out as a problem. Therefore, this study aims to derive the optimum electromagnetic shielding condition by applying ATMSM to concrete as a part of securing electromagnetic wave shielding performance with reflection loss against concrete wall. Experimental parameters included concrete wall thickness and application of Zn-Al ATMSM. For the concrete wall, the wall thickness was 100 to 300mm, which is generally applied, and experimental parameters were set for the application of Zn-Al metal spraying method to evaluate electromagnetic shielding performance. Experimental results showed that as the thickness increases, the electromagnetic shielding performance increases due to the increase of absorption loss. In addition, after the application of Zn-Al ATMSM, the average shielding performance increased by 56.68 dB on average, which is considered to be increased by the reflection loss of the ATMSM. In addition, it is considered that the shielding performance will be better than that when the conductive mixed material and the ATMSM are simultaneously applied.

Characterization of Charcoals prepared by Korean Traditional Kiln (우리나라 전통 숯가마로부터 생산된 숯의 특성분석)

  • An, Ki Sun;Kwak, Lee Ku;Kim, Hong Gun;Ryu, Seung Kon
    • Korean Chemical Engineering Research
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    • v.60 no.2
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    • pp.208-216
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    • 2022
  • Surface morphology and adsorption characteristics of black and white charcoals prepared from Korean traditional kiln were quantitatively analyzed. TGA and elemental analysis of charcoals were different from produced kiln, and thermal degradation temperature and carbon content of white charcoals were apparently higher than those of black charcoals. Surface morphology shows the activation progressed through the longitudinal direction of woods and new micropores were developed to radial direction on the surface of macropores as the furthermore activation resulting in the pore connection. BET adsorption isotherms show that there are low-pressure hysteresis due to the no desorption of adsorbates, which resulted in unique Type of charcoals overlapping Type I and Type IV. Such a low-pressure hysteresis is occurred from expansion of adsorbates, which were embedded in the micropore entrances and did not get out during the desorption run. The characteristics of charcoals such as specific surface area and pore size distribution did not show correct values depending on not only produced company but also sampling sites of one piece of charcoal. Therefore, it is not easy to suggest the quantitative characteristics of charcoals prepared from Korean traditional kiln. On the other hand, preparation the quality standard of charcoal is necessary for their special uses such as adsorbent.