• Journal of Energy Engineering
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• v.25 no.2
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• pp.94-100
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• 2016

ESS(Energy Storage System) is an important source that keeps power supply stable and utilizes electricity efficiently. For example, ESS contributes to resolve power supply imbalance, stabilize new renewable energy output and regulate frequency. ESS is predicted to be expanded to 55.9GWh of installed capacity by 2023, which is 30 times more than that of 2014. To raise competitiveness of domestic ESS industry in this increasing world market, we have disseminated load-shift ESS for continuous power supply imbalance with FR ESS, and also necessity to secure domestic track record is required. However in case of FR ESS, utility of installing thermal power plant is generally generated within 5% range of rated capacity, so that scalability of domestic market is low without dramatic increase of thermal power plant. Necessity of load-shift ESS dissemination is also decreasing effected by surplus backup power securement policy, raising demand for new dissemination model. New dissemination model is promising for $CO_2$ reduction effect in spite of intermittent output. By stabilizing new renewable energy output in connection with new renewable energy, and regulating system input timing of new renewable energy generation rate, it is prospected model for 'post-2020' regime and energy industry. This research presents a policy alternatives of REC multiplier calculation method to induce investment after outlining PV-connected ESS charge/discharge mode to reduce GHG emission, This alternative is projected to utilize GHG emission reduction methodology for 'Post-2020' regime, big issue of new energy policy.

• Korean Journal of Remote Sensing
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• v.32 no.4
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• pp.353-364
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• 2016

Yangon city is experienced a rapid urban expansion over the last two decades due to accelerate with the socioeconomic development. This research work studied an investigation into the application of the integration of the Remote Sensing (RS) and Geographic Information System (GIS) for observing Land Use and Land Cover (LULC) patterns and evaluate its impact on Land Surface Temperature (LST) of the downtown, suburban 1 and suburban 2 of Yangon city. The main purpose of this paper was to examine and analyze the variation of the spatial distribution property of the LULC of urban spatial information related with the LST and Normalized Difference Vegetation Index (NDVI) using RS and GIS. This paper was observed on image processing of LULC classification, LST and NDVI were extracted from Landsat 8 Operational Land Imager (OLI) image data. Then, LULC pattern was linked with the variation of LST data of the Yangon area for the further connection of the correlation between surface temperature and urban structure. As a result, NDVI values were used to examine the relation between thermal behavior and condition of land cover categories. The spatial distribution of LST has been found mixed pattern and higher LST was located with the scatter pattern, which was related to certain LULC types within downtown, suburban 1 and 2. The result of this paper, LST and NDVI analysis exhibited a strong negative correlation without water bodies for all three portions of Yangon area. The strongest coefficient correlation was found downtown area (-0.8707) and followed suburban 1 (-0.7526) and suburban 2(-0.6923).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.54-54
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• 2009

Ag thick film has been used for electrode materials with the excellent conductivity. Ag electrode is used in screen-printed silicon solar cells as a electrode material. Compared to photolithography and buried-contact technology, screen-printing technology has the merit of fabricating low-priced cells and enormous cells in a few hours. Ag paste consists of Ag powders, vehicles and additives such as frits, metal powders (Pb, Bi, Zn). Frits accelerate the sintering of Ag powders and induce the connection between Ag electrode and Si wafer. Thermophysical properties of frits and reactions among Ag, frits and Si influence on cell performance. In this study, Ag pastes were fabricated with adding different kinds of frits. After Ag pastes were printed on silicon wafer by screen-printing technology, the cells were fired using a belt furnace. The cell parameters were measured by light I-V to determine the short-circuit current, open-circuit voltage, FF and cell efficiency. In order to study the relationship between the reactivity of Ag, frit, Si and the electrical properties of cells, the reaction of frits and Si wafer on was studied with thermal properties of frits. The interface structure between Ag electrode and Si wafer were also measured for understanding the reactivity of Ag, frit and Si wafer. The excessive reactivity of Ag, frit and Si wafer certainly degraded the electrical properties of cells. These preliminary studies suggest that reactions among Ag, frits and Si wafer should optimally be controlled for cell performances.

• Journal of Energy Engineering
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• v.13 no.1
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• pp.12-19
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• 2004

A Molded Case Circuit Breaker (MCCB) is an electric control device to interrupt the abnormal currents which result from the over-loads or short-circuits. Its malfunction will result in severe accidents. In the development of the MCCB, higher current-rating and improved thermal performance become more and more important in providing the safe function and reliability for the modern devices requiring small scale and high performance. It is also very important to consider the factors of temperature rise in the design of MCCB. The major reasons of temperature rise in the MCCB result from the resistances, which are come from the connection and contact surfaces. These resistances are influenced by current, time, configuration of contact surfaces and applied voltage. In order to predict the temperature distribution inside MCCB, we have simulated the model with some assumptions and simplifications, using commercial code ICEPAK. To verify the results of temperature field analysis, the numerical results are compared with experimental ones for the same model. The results show a good agreement with actual temperature rise obtained by experiments.

• KIEAE Journal
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• v.15 no.4
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• pp.91-104
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• 2015

Recently, various researches for the improvement of Han-ok performance carried out. But, most of them are tend to come from the viewpoint of suppliers rather than that of Han-ok habitants. It means that environmental elements which real habitants feel are not reflected in the design of initial Han-ok design. Therefore, it is necessary that many researchers should analyze the degree of dwelling satisfaction derived from real life. Purpose: The purpose of this study is to find the avaliable factors that need to be considered in the process of initial Han-ok design and construction through the analysis on the living performance satisfaction ratio of modern New Han-ok's habitants. Method: To achieve this goal, surveys were carried out in 83 Han-oks which actual habitants were living, located in 14 happy villages Jeonnam province. Following are survey items about residential environmental conditions; kinds of wall material, gap(connection joint between wall and wood columns) reinforcement or not, kinds of window, kinds of facilities around windows, kinds of heating source, heating types(single, multiple), financial burdens, selective heating or not and so on. Result: The results of this study may be used to improve the living performance satisfaction ratio of new Han-ok habitants and as a basis for the specifying the desired thermal comfort environment of dwelling.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Fire Science and Engineering
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• v.22 no.4
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• pp.54-60
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• 2008

In this study, damage characteristics of MCCB and terminal block due to poor contact were analyzed, and various poor contact detection techniques were suggested. Firstly, the detection techniques using thermocouple and infrared thermal camera were analyzed respectively. Also, thermo-cap during poor contact detected abnormal status effectively by changing its color, and the detection system using an odor detector and odor capsules was analyzed. Lastly, poor contact detection screw was made using characteristics of fusible alloy, and we applied the poor contact detection screw to terminal block. The above methods could prevent electrical fire caused by poor contact effectively if they are used properly.

• Journal of Sensor Science and Technology
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• v.11 no.1
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• pp.1-8
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• 2002

In this paper, a thermopile which is applied to wide uses of temperature measuring was fabricated and its characteristic was improved by appling SOI structure to the fabrication. We improved characteristic of the thermopile by using single crystal silicon strips that has high seebeck coefficient and dielectric isolating the silicon strips from substrate with silicon dioxide film which dramatically decrease thermal conductivity between hot and cold junction compared to a silicon strip which was fabricated by ion implantation. The thermopile consists of 17 p-type single crystal silicon strips and 17 n-types by serial connection. The result of electromotive force measuring showed very good characteristic as 130mV/K when temperature difference between the two ends of the thermopile occurs by applying light on the thermopile fabricated with silicon strips of $1600{\mu}m$ length, $40{\mu}m$ width, $1{\mu}m$ thickness.

• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.7
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• pp.462-469
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• 2008

A regenerative evaporative cooler has been fabricated and tested for the evaluation of cooling performance. The regenerative evaporative cooler is a kind of indirect evaporative cooler comprised of multiple pairs of dry and wet channels. The air flowing through the dry channels is cooled without any change in the humidity and at the outlet of the dry channel a part of air is redirected to the wet channel where the evaporative cooling takes place. The regenerative evaporative cooler fabricated in this study consists of the multiple pairs of finned channels in counterflow arrangement. The fins and heat transfer plates were made of aluminum and brazed for good thermal connection. Thin porous layer coating was applied to the internal surface of the wet channel to improve surface wettability. The regenerative evaporative cooler was placed in a climate chamber and tested at various operation condition. The cooling performance is found greatly influenced by the evaporation water flow rate. To improve the cooling performance, the evaporation water flow rate needs to be minimized as far as the even distribution of the evaporation water is secured. At the inlet condition of $32^{\circ}C$ and 50%RH, the outlet temperature was measured at $22^{\circ}C$ which is well below the inlet wet-bulb temperature of $23.7^{\circ}C$.