• 한국전기전자재료학회논문지
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• 제29권6호
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• pp.380-385
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• 2016

Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and $2.82kg/m^2$, thermal conductivity is 20 and $92W/(m{\cdot}K)$ for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was $3^{\circ}C$ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.

• Journal of Welding and Joining
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• 제31권5호
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

• 한국정밀공학회지
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• 제17권2호
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• Elastomers and Composites
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• 제52권1호
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• pp.22-26
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• 2017

The thermal conductivity and the adhesive properties were measured, after synthesis of thermal conductive composite which was obtained as a result of mixing alumina or graphite with acrylic adhesive synthesized by UV polymerization. The adhesive properties of the composite were evaluated measuring the peel strength at 180 degrees, the retention, and the initial tack;the thermal conductivity was estimated using laser flash analysis. As the filler contents increased, a decrease in peel strength and initial tack and an increase in retention and thermal conductivity were observed. When compared to alumina, the adhesion of graphite showed a dramatic decrease, whereas the thermal conductivity was further enhanced. It was found out that the small size of graphite increased the mechanical interlocking between the polymer and the filler, and it was easier for graphite to come into contact with other graphite in the matrix.

• 한국안전학회지
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• 제28권3호
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• pp.63-68
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• 2013

This paper is aimed to make an analysis on characteristics of the parallel arc waveform and RMS of current at the electrical tracking state by conductive powder. In order to achieve the goal in this paper, field state investigation at metal processing companies in Chung-Nam province area was conducted. With the field state investigation, conductive powder were collected from metal processing companies. By experiment on electrical connector(breaker, connector) over which the conductive powder were scattered, arc waveform and RMS of current were measured. The measured waveform and RMS(root-mean-square) of current were analyzed to describe characteristics and patterns of electrical arc by the conductive powder. It was proved that conductive powder on electrical connector can flow electrical current enough to make electrical fire with high thermal energy. Also the change of sine waveform and RMS of current can be used to find out relationship between electrical fire and fault signal by conductive powder. The results obtained in this paper will be very helpful for the prevention of electrical fires occurred at the metal processing companies.

• ETRI Journal
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• 제33권6호
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• 폴리머
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• 제37권4호
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• pp.513-517
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• 2013

고내열성 고분자인 폴리벤족사진(PBZ)과 전도성 그래핀을 혼성화시켜 새로운 전도성 복합박막을 제조하는 연구를 처음으로 수행하였다. 단순한 열처리 공정에 의해 동시에 그래핀 옥사이드와 벤족사진 단량체를 환원 및 경화를 시켜 기계적/전기적 특성이 크게 향상된 그래핀/PBZ 복합 박막을 제조하였다. 그래핀/PBZ 복합 박막의 화학/결정 구조 및 형태학적 미세구조 분석으로부터 약 3 wt%의 그래핀이 복합 박막에 들어가더라도 그래핀이 비교적 균일하게 분산된다는 것을 알 수 있었다. 본 연구를 통하여 PBZ박막의 기계적 물성 향상과 동시에 도전성을 부여하는 효과적인 경로를 제공할 수 있었다.

• 한국전기전자재료학회논문지
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• 제33권6호
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• pp.500-504
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• 2020

Heating films were prepared with composites of poly (methyl methacrylate) and conductive graphite. The as-prepared composite was deposited on a PET film and then fabricated using a bar coater to produce a film with uniform thickness. Copper electrodes were attached to both ends of the as-prepared film, and the heating characteristics of the film were analyzed while applying a DC voltage. The electrical conductivity and heating temperature of the heating films depended on the size, structure, content, and the dispersion characteristics of the graphite in the composite. The thermal energy was adjusted by controlling the electrical energy, based on the Joule heating theory. The electrical resistance of the film was altered in proportion to Ohm's law, and the heating temperature was changed according to the structure of the film (interelectrode spacing or electrode length) and the conductive graphite content. When the content of conductive graphite in the film increases, the electrical resistance decreases, and the heating temperature increases; however, there is no significant change above a certain content (50%).

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• 한국연소학회지
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• 제11권3호
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• pp.8-17
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• 2006

When a flame is stabilized in a tube of a finite thickness, a conductive heat transfer through the tube significantly changes the wall temperature and affects the flame characteristics. Thus the tube length and thermal boundary conditions affect on the structure of the flame in a conductive tube. A one-dimensional analytical study was conducted by employing two energy equations for tubes and mixtures and a species equation for the mixture. Variation of the maximum temperatures and indicating displacements were observed. A parametric study on the effects of inner Peclet numbers, normalized wall conductivities, and heat transfer conditions of the tube was conducted. This study provides essential data for a more efficient computational simulation of the flame stabilized in conductive tubes.