• Title/Summary/Keyword: Thermal conductance

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A study on interface heat transfer coefficient in hot forging of Al6061 by experiments and FE analysis (Al6061 열간단조시 계면열전달계수에 관한 연구)

  • Kwon J. W.;Lee Y. S.;Kwon Y. N.;Lee J. H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.05a
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    • pp.219-222
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    • 2005
  • The temperature difference between die and workpiece has frequently caused various surface defects. The non-homogeneous temperature distribution of forged part should be analyzed to prevent the generation of various defects related with the temperature. The surface temperatures were mainly affected by the coefficient of thermal contact conductance. The precise coefficient is necessary to predict accurately the temperature changes of die and workpiece. The experiment is preformed to measure the temperature distribution of die and workpiece in closed die upsetting. And then, the coefficient is classified into function of pressure and confirmed by the comparison between experiments and FE analyses using the other model. The FE analysis to predict the temperature distribution is performed by commercial software $DEFORM-3D^{TM}$. However, it might be impossible to measure directly the temperature distribution of forged part. Therefore, the comparisons between measured temperature and predicted values are performed with the hardness of Al6061-forged part.

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An Application of Realistic Evaluation Model to the Large Break LOCA Analysis of Ulchin 3&4

  • C. H. Ban;B. D. Chung;Lee, K. M.;J. H. Jeong;S. T. Hwang
    • Proceedings of the Korean Nuclear Society Conference
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    • 1996.05b
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    • pp.429-434
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    • 1996
  • K-REM[1], which is under development as a realistic evaluation model of large break LOCA, is applied to the analysis of cold leg guillotine break of Ulchin 3&4. Fuel parameters on which statistical analysis of their effects on the peak cladding temperature (PCT) are made and system parameters on which the concept of limiting value approach (LVA) are applied, are determined from the single parameter sensitivity study. 3 parameters of fuel gap conductance, fuel thermal conductivity and power peaking factor are selected as fuel related ones and 4 parameters of axial power shape, reactor power, decay heat and the gas pressure of safety injection tank (SIT) are selected as plant system related ones. Response surface of PCT is generated from the plant calculation results and on which Monte Carlo sampling is made to get plant application uncertainty which is statistically combined with code uncertainty to produce the 95th percentile PCT. From the break spectrum analysis, blowdown PCT of 1350.23 K and reflood PCT of 1195.56 K are obtained for break discharge coefficients of 0.8 and 0.5, respectively.

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The Electrical Characteristics of Pentacene Thin-Film for the active layer of Organic TFT deposited at the Various Evaporation conditions and the Annealing Temperatures (증착조건 및 열처리 온도에 따른 유기 TFT의 활성층용 펜타센 박막의 전기적 특성 연구)

  • 구본원;정민경;김도현;송정근
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.80-83
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    • 2000
  • In this work we deposited Pentacene thin film by OMBD at the various substrate temperatures, deposition rate and the various annealing temperatures for the fabrication of organic TFT and investigated the electrical and film surface characteristics such as sheet resistance, contact resistance and conductance Film thickness were measured by $\alpha$-step and the sheet resistance, contact resistance and conductance were extracted from the relation between the distance of the contacts and the resistance. During the film deposition the substrate temperature was held at 3$0^{\circ}C$, 4$0^{\circ}C$, 5$0^{\circ}C$, 6$0^{\circ}C$, 8$0^{\circ}C$ and 10$0^{\circ}C$, respectively. After the film deposition, Au contact was deposited by thermal evaporation. For the effect of annealing, the thin film was annealed in the nitrogen environment at 10$0^{\circ}C$ and 14$0^{\circ}C$ for 10 seconds, respectively. Film surface characteristics at the vatious substrate temperatures were measured by AFM. The crystallization of thin film was improved as the substrate temperatures were increased and the maximum gram size was 4${\mu}{\textrm}{m}$. The conductivity of thin film was found to be 7.40 $\times$10$^{-7}$ ~ 7.78$\times$10$^{-6}$ S/cm and the minimum contact resistance was 2.5324 ㏁.

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Simulation and analysis of DC characteristics in AlGaN/GaN HEMTs on sapphire, SiC and Si substrates (Sapphire SiC, Si 기판에 따른 AlGaN/GaN HEMT의 DC 전기적 특성의 시뮬레이션과 분석)

  • Kim, Su-Jin;Kim, Dong-Ho;Kim, Jae-Moo;Choi, Hong-Goo;Hahn, Cheol-Koo;Kim, Tae-Geun
    • Journal of IKEEE
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    • v.11 no.4
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    • pp.272-278
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    • 2007
  • In this paper, we report on the 2D (two-dimensional) simulation result of the DC (direct current) electrical and thermal characteristics of AlGaN/GaN HEMTs (high electron mobility transistors) grown on Si substrate, in comparison with those grown on sapphire and SiC (silicon carbide) substrate, respectively. In general, the electrical properties of HEMT are affected by electron mobility and thermal conductivity, which depend on substrate material. For this reason, the substrates of GaN-based HEMT have been widely studied today. The simulation results are compared and studied by applying general Drift-Diffusion and thermal model altering temperature as 300, 400 and 500 K, respectively. With setting T=300 K and $V_{GS}$=1 V, the $I_{D,max}$ (drain saturation current) were 189 mA/mm for sapphire, 293 mA/mm for SiC, and 258 mA/mm for Si, respectively. In addition, $G_{m,max}$ (maximum transfer conductance) of sapphire, SiC, Si was 38, 50, 31 mS/mm, respectively, at T=500 K.

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Characterization of Water-Filled Ag/AgCl Reference Electrode

  • Bahn Chi Bum;Oh Sihyoung;Hwang Il Soon;Chung Hahn Sup;Jegarl Sung
    • Journal of the Korean Electrochemical Society
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    • v.4 no.3
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    • pp.87-93
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    • 2001
  • Pressure-balanced external Ag/AgCl electrode has been extensively used for both Pressurized Water Reactor (PWR) and Boiling Water Reactor (PWR) environments. The use of KCI-based buffer solution often becomes the source of electrode potential drift due to slow leakage through its porous plug, typically made of zirconia. It is reported that results of our effort to improve the stability of electrode potential by using high purity water as the filling solution in which $Cl^-$ ion activity can be established and maintained at the solubility of AgCl even with the sustained leakage for a long period. Stability tests have been made in boron and lithium mixture solution at $288^{\circ}C$. The electrode potential remained stable within 10 mV over one week period. And after a thermal cycle between 288 to $240^{\circ}C$ the potential shift of Ag/AgCl electrodes did not exceed 15 mV By using the limiting equivalent ionic conductances and Agar's hydrodynamic theory, the thermal liquid junction potential (TLJP) of the electrode has been predicted. The calculated values for the water-fiued Ag/AgCl electrode potential, in which the chlorine concentration in the filling solution was derived from the measured data at ambient temperature, had a good agreement with the experimental values.

Recent Progress in Air-Conditioning and Refrigeration Research: A Review of Papers Published in the Korean Journal of Air-Conditioning and Refrigeration Engineering in 2008 (설비공학 분야의 최근 연구 동향: 2008년 학회지 논문에 대한 종합적 고찰)

  • Han, Hwa-Taik;Choi, Chang-Ho;Lee, Dae-Young;Kim, Seo-Young;Kwon, Yong-Il;Choi, Jong-Min
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.21 no.12
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    • pp.715-732
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    • 2009
  • This article reviews the papers published in the Korean Journal of Air-Conditioning and Refrigeration Engineering during 2008. It is intended to understand the status of current research in the areas of heating, cooling, ventilation, sanitation, and indoor environments of buildings and plant facilities. Conclusions are as follows. (1) Research trends in thermal and fluid engineering have been surveyed in the categories of general fluid flow, fluid machinery and piping, new and renewable energy, and fire. Well-developed CFD technologies were widely applied in developing facilities and their systems. New research topics include fire, fuel cell, and solar energy. Research was mainly focused on flow distribution and optimization in the fields of fluid machinery and piping. Topics related to the development of fans and compressors had been popular, but were no longer investigated widely. Research papers on micro heat exchangers using nanofluids and micro pumps were also not presented during this period. There were some studies on thermal reliability and performance in the fields of new and renewable energy. Numerical simulations of smoke ventilation and the spread of fire were the main topics in the field of fire. (2) Research works on heat transfer presented in 2008 have been reviewed in the categories of heat transfer characteristics, industrial heat exchangers, and ground heat exchangers. Research on heat transfer characteristics included thermal transport in cryogenic vessels, dish solar collectors, radiative thermal reflectors, variable conductance heat pipes, and flow condensation and evaporation of refrigerants. In the area of industrial heat exchangers, examined are research on micro-channel plate heat exchangers, liquid cooled cold plates, fin-tube heat exchangers, and frost behavior of heat exchanger fins. Measurements on ground thermal conductivity and on the thermal diffusion characteristics of ground heat exchangers were reported. (3) In the field of refrigeration, many studies were presented on simultaneous heating and cooling heat pump systems. Switching between various operation modes and optimizing the refrigerant charge were considered in this research. Studies of heat pump systems using unutilized energy sources such as sewage water and river water were reported. Evaporative cooling was studied both theoretically and experimentally as a potential alternative to the conventional methods. (4) Research papers on building facilities have been reviewed and divided into studies on heat and cold sources, air conditioning and air cleaning, ventilation, automatic control of heat sources with piping systems, and sound reduction in hydraulic turbine dynamo rooms. In particular, considered were efficient and effective uses of energy resulting in reduced environmental pollution and operating costs. (5) In the field of building environments, many studies focused on health and comfort. Ventilation. system performance was considered to be important in improving indoor air conditions. Due to high oil prices, various tests were planned to examine building energy consumption and to cut life cycle costs.

The Substitution of Inkjet-printed Gold Nanoparticles for Electroplated Gold Films in Electronic Package

  • Jang, Seon-Hui;Gang, Seong-Gu;Kim, Dong-Hun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.10a
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    • pp.25.1-25.1
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    • 2011
  • Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

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Electrical and Magnetic Properties of Tunneling Device with FePt Magnetic Quantum Dots (FePt 자기 양자점 터널링 소자의 전기적 특성과 자기적 특성 연구)

  • Pak, Sang-Woo;Suh, Joo-Young;Lee, Dong-Uk;Kim, Eun-Kyu
    • Journal of the Korean Vacuum Society
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    • v.20 no.1
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    • pp.57-62
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    • 2011
  • We have studied the electrical and magnetic transport properties of tunneling device with FePt magnetic quantum dots. The FePt nanoparticles with a diameter of 8~15 nm were embedded in a $SiO_2$ layer through thermal annealing process at temperature of $800^{\circ}C$ in $N_2$ gas ambient. The electrical properties of the tunneling device were characterized by current-voltage (I-V) measurements under the perpendicular magnetic fields at various temperatures. The nonlinear I-V curves appeared at 20 K, and then it was explained as a conductance blockade by the electron hopping model and tunneling effect through the quantum dots. It was measured also that the negative magneto-resistance ratio increased about 26.2% as increasing external magnetic field up to 9,000 G without regard for an applied electric voltage.

Effects of Low-Dose Aspirin Therapy on Thermoregulation in Firefighters

  • McEntire, Serina J.;Reis, Steven E.;Suman, Oscar E.;Hostler, David
    • Safety and Health at Work
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    • v.6 no.3
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    • pp.256-262
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    • 2015
  • Background: Heart attack is the most common cause of line-of-duty death in the fire service. Daily aspirin therapy is a preventative measure used to reduce the morbidity of heart attacks but may decrease the ability to dissipate heat by reducing skin blood flow. Methods: In this double-blind, placebo-controlled, crossover study, firefighters were randomized to receive 14 days of therapy (81-mg aspirin or placebo) before performing treadmill exercise in thermal-protective clothing in a hot room [$38.8{\pm}2.1^{\circ}C$, $24.9{\pm}9.1%$ relative humidity (RH)]. Three weeks without therapy was provided before crossing to the other arm. Firefighters completed a baseline skin blood-flow assessment via laser Doppler flowmetry; skin was heated to $44^{\circ}C$ to achieve maximal cutaneous vasodilation. Skin blood flow was measured before and after exercise in a hot room, and at 0 minutes, 10 minutes, 20 minutes, and 30 minutes of recovery under temperature conditions ($25.3{\pm}1.2^{\circ}C$, $40.3{\pm}13.7%\;RH$). Platelet clotting time was assessed before drug administration, and before and after exercise. Results: Fifteen firefighters completed the study. Aspirin increased clotting time before and after exercise compared with placebo (p = 0.003). There were no differences in absolute skin blood flow between groups (p = 0.35). Following exercise, cutaneous vascular conductance (CVC) was $85{\pm}42%$ of maximum in the aspirin and $76{\pm}37%$ in the placebo groups. The percentage of maximal CVC did not differ by treatment before or after recovery. Neither maximal core body temperature nor heart rate responses to exercise differed between trials. Conclusion: There were no differences in skin blood flow during uncompensable heat stress following exercise after aspirin or placebo therapy.

Effect of defects on lifetime of silicon electrodes and rings in plasma etcher (플라즈마 에쳐용 실리콘 전극과 링의 수명에 미치는 결함의 영향)

  • Eum, Jung-Hyun;Chae, Jung-Min;Pee, Jae-Hwan;Lee, Sung-Min;Choi, Kyoon;Kim, Sang-Jin;Hong, Tae-Sik;Hwang, Choong-Ho;Ahn, Hak-Joon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.20 no.2
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    • pp.101-105
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    • 2010
  • Silicon electrode and ring in a plasma etcher those are in contact with harsh plasma suffer from periodic heating and cooling during their lifetime. This causes the silicon components failure due to thermal stress remaining the persistent slip bands (PSBs) on their surfaces. The factors that determine the lifetime of silicon electrode and ring were discussed with respect to silicon ingot. The impurity level and the average defect concentration measured with glow discharge mass spectrometer (GDMS) and microwave photo-conductance decay (${\mu}$-PCD) were compared with the grade of silicon ingots those are divided to slip-free and slip-allowed ingot. Some silp-allowed samples showed planar defects along <110> direction on {001} surface. The role of these defects was suggested from the viewpoint of the lifetime of silicon components.