• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.69-73
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• 2010

Finite-element analyses were conducted to investigate the thermal stress in 3-dimensional stacked wafers package containing through-silicon-via (TSV), which is being widely used for 3-Dimensional integration. With finite element method (FEM), thermal stress was analyzed with the variation of TSV diameter, bonding diameter, pitch and TSV height. It was revealed that the maximum von Mises stresses occurred at the edge of top interface between Cu TSV and Si and the Si to Si bonding site. As TSV diameter increased, the von Mises stress at the edge of TSV increased. As bonding diameter increased, the von Mises stress at Si to Si bonding site increased. As pitch increased, the von Mises stress at Si to Si bonding site increased. The TSV height did not affect the von Mises stress. Therefore, it is expected that smaller Cu TSV diameter and pitch will ensure mechanical reliability because of the smaller chance of plastic deformation and crack initiation.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.6
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• pp.688-697
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• 2014

In this study, electrode bonding technology needed for high density of rechargeable battery is studied, which is recently researched for electric vehicle, the small leisure vessel. For the alternative overcoming the limit of stacking amount able to be stacked by conventional ultrasonic welding, the low temperature bonding method, eligible for minimum of degeneration of chemical activator on the electrode surface which is generated by thermal effect as well as the increase of conductivity and tension strength caused by electrode bonding using filler metal, not using conventional direct heating on the electrode material method, is studied. Specifically to say, recently used more generally the ultrasonic welding and spot welding method are not usable for satisfying stable electric conductivity and bonding strength when much electrode is stacking bonded. If the electrical power is unreasonably increased for the welding, due to the effect of welding temperature, deformation of electrode and activating material degeneration are caused, and after the last packaging, decline of electrical output and generating heat cause to reduce stability of battery. Therefore, in this study, induction heating system bonding method using high frequency heating and differentiated electrode method using filler metal pre-treatment of hot dipping are introduced.

• Elastomers and Composites
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• v.34 no.3
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• pp.247-252
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• 1999

Rubber related geosynthetics(GS) as reinforcement and water barrier materials were manufactured by thermal bonding method and examined the their performance for applications to civil and environmental engineering fields. The spunbonded polyester nonwoven, fiber glass mat and fabric type geogrid of a high tenacity polyester filament were used as matrix and polyester film, elastomeric bitumen with SBS polymer and asphalt were used as reinforcements to manufacture the rubber related geosynthetics. A fiber glass mat and geogrid matrix GS showed more excellent mechanical properties and nonwoven and elastomeric bitumen matrix showed the more excellent permittivity. Softening points of rubber and asphalt mixture showed no difference and dimensional stability at high temperature, $120^{\circ}C$, represented no significant shrinkage. Resistance to ultraviolet of rubber related geosynthetics showed no visible alteration.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1988-1990
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• 1996

In this work, we have grown or evaporated thermal oxide and E-beam oxide on the (100) oriented n-type silicon wafers, respectively and they were directly bonded with another silicon wafer after hydrophilization using solutions of three types of $HNO_3$, $H_{2}SO_{4}$ and $NH_{4}OH$. Changes of average surface roughness after hydrophilizations of the single crystalline silicon wafer, thermal oxide and E-beam evaporated silicon oxide were studied using atomic force microscope. Bonding interfaces of the bonded pairs were inspected using scanning electron microscope. Void and non-contact area of the bonded pairs were also inspected using infrared transmission microscope.

• Structural Engineering and Mechanics
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• v.62 no.5
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• pp.595-606
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• 2017

During their life span, post-tensioned concrete structures may be exposed to thermal loads. Therefore, there has been a growing interest in research on the advanced analysis and design of post-tensioned concrete slabs subjected to thermal loads. This paper investigates the structural behaviour of post-tensioned one-way spanning concrete slabs. A nonlinear finite element model for the analysis of post- tensioned unbonded and bonded concrete slabs at elevated temperatures was developed. The interface between the tendon and surrounding concrete was also modelled, allowing the tendon to retain its profile shape during the deformation of the slab. The load-deflection behaviour, load-force behaviour in the tendon, and the failure modes are presented. The numerical analysis was conducted by the finite element ANSYS software and was carried out on two different one-way concrete slabs chosen from literature. A parametric study was conducted to investigate the effect of several selected parameters on the overall behavior of post-tensioned one-way concrete slab. These parameters include the effect of tendon bonding, the effect of thermal loading and the effect of tendon profile. Comparison between uniform thermal loading and nonuniform thermal loading showed that restrained post tensioned slab with bottom surface hotter has smaller failure load capacity.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.162-167
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• 2013

Encapsulation is required since organic materials used in OLED devices are fragile to water vapor and oxygen. Laser sealing method is currently used where IR laser is scanned along the glass-frit coated lines. Laser method is, however, not suitable to encapsulating large-sized glass substrate due to the nature of sequential scanning. In this work we propose a new method of encapsulation using Joule heating. Conductive layer is patterned along the sealing lines on which the glass frit is screen printed and sintered. Electric field is then applied to the conductive layer resulting in bonding both the panel glass and the encapsulation glass by melting glass-frit. In order to obtain uniform bonding the temperature of a conductive layer having a shape of closed loop should be uniform. In this work we conducted simulation for heat distribution according to the structure of a conductive layer used as a Joule-heat source. Uniform temperature was obtained with an error of 5% by optimizing the structure of a conductive layer. Based on the results of thermal simulations we concluded that Joule-heating induced encapsulation would be a good candidate for encapsulation method especially for large area glass substrate.

• Textile Coloration and Finishing
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• v.34 no.3
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• pp.173-184
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• 2022

In this study, the TPU film was laminated on an aramid fabric or circular knits in order to implement an air cushion material that can respond to high impact forces in case of a fall and is easy to expand. To increase the bonding strength between the fabric layer and the film layer, a primer layer was formed in two ways: one for thermally bonding and laminating PET film and two for coating and aging hot melt type PUR adhesive. The tensile strength of the aramid air cushion was 2.5 times higher than that of the circular knits, but the tensile elongation of the aramid air cushion was very low compared to that of the circular knits. The tear strength of the aramid air cushion was about twice or more superior to that of the circular knits, the primer treatment method was good at A, and the peel strength was excellent at method A. The aramid air cushion was the lightest in weight. Summarizing the above results, it was best to combine the air cushion material with aramid woven fabric and primer treatment method A to cope with the high impact force applied when falling.

• Proceedings of the KIEE Conference
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• 2006.11a
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• pp.405-407
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• 2006

The power system analysis based on the accurate impedance of the individual underground cable, which is the inter connected to a large power system, is required. A study on calculation method of impedance allowable current for underground cables. furthermore, various methods of bonding and earthing the sheath have been used for the purpose of eliminating or reducing the sheath losses. the effectes of bonding and earthing must be includied in impedances. therefore, the subject of predicting thermal performance of soil and cable systems has been received increasing attension. for these problems, this paper describes a general formulation of impedance that is based on the effect of crossbonding and earthing of the sheath on the 66kV, 132kV and 220kV underground cable systems. also the work is presented, for calculating the temperature rise of power cable and soil.

• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.312-315
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• 2018

Although the reversibility of 10,12-pentacosadiynoic amino meta-acid(PCDA-mBzA) against temperature and pH was reported, the modulation of reversibility by ion adsorption at terminal functional group has not been investigated. In this work, we developed a simple method for modulating the reversibility of PCDA-mBzA films upon a thermal stimulus by cadmium ion adsorption inducing the breakage of the outer hydrogen bonding of two hydrogen bonds, which are responsible for the reversible properties of PCDA-mBzA. External reflection-Fourier transform infrared (ER-FTIR) analyses revealed that the hydrogen bonding between the carboxylic acid groups was broken through ion adsorption and only a single hydrogen bond between the amide groups remained in the PCDA-mBzA polymer. In addition, PCDA-mBzA films could recover their original property through cadmium ion desorption. These results present that the transition between reversibility and irreversibility can be modulated artificially simply through the adsorption and desorption of metal ions.

• International Journal of Advanced Culture Technology
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• v.3 no.2
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• pp.34-41
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• 2015

Bonding strength of a thermal sprayed coating is difficult to measure using a conventional pull-off test method. Scratch test is a potential alternative testing method. An adhesive and a cohesive bond strength of the coating can be measured by the pull-off test while the scratch test performed on the cross-section of the thermal sprayed coating can only demonstrate the cohesive bond strength of the coating. Nevertheless, it is still beneficial to perform the scratch testing on the cross-section of the coating for the sake of comparison thus providing an alternative to the pull-off test. The scratch test method can reduce testing time and cost in the long run due to a significant cost reduction in consumables and energy and time saving from the curing step of the glue used in the pull-off test. This research investigates the possibility of using the scratch test to measure the cohesive bond strength of Mo/NiCrBSi composite coating. The results from the pull-off test and the scratch test indicate that the cohesive bond strengths of the Mo composite coating show similar trend and that the cohesive bond strength are increased when increasing NiCrBSi content.