• Composites Research
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• 제27권5호
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• pp.196-200
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• 2014

A novel, simple and totally recyclable method has been developed for the synthesis of nontoxic, biocompatible and biodegradable bio-composite films from soy protein and silk protein. Bio films are defined as flexible films prepared from biological materials such as protein. These materials have potential application in medical and food as a packaging material. Their use depends on various parameters such as mechanical (strength and modulus), thermal, among others. In this study, prepare and characterization of bio films made from Soy Protein Isolate (SPI) (matrix) and Silk Fiber (SF) (reinforcement) through solution casting method by the addition of plasticizer and crosslinking agent. The obtained SPI and SPI/SF composites were subsequently subjected to evaluate their mechanical and thermal properties by using Universal Testing Machine and Thermal Gravimetric Analyzer respectively. The tensile testing showed significant improvements in strength with increasing amount of SF content and the % elongation at break of the composites of the SPI/SF was lower than that of the matrix. Though the interfacial bonding was moderate, the improvement in tensile strength and modulus was attributed to the higher tensile properties of the silk fiber.

• 콘크리트학회논문집
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• 제19권4호
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• pp.483-490
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• 2007

현재 콘크리트 교량의 보강 공법으로 주로 사용되는 외부 강봉을 이용한 후 인장 공법은 적용 범위가 넓고 교량의 극한 및 항복에 대한 강성을 증가시켜 휨보강 효과가 뛰어나지만, 모재 접합부의 응력집중, 비효율적인 하중 분배, 고정앵커부 설치, 유지관리의 어려움 등의 단점이 있다. 본 연구는 기존의 외부 강봉을 이용한 후 인장 공법이 가지는 단점을 보완하고 강판 접합 공법의 장점을 접목한 새로운 개념의 보강 공법으로 온도 프리스트레싱 보강 공법을 제안하고자 한다. 온도 프리스트레싱 보강 공법은 프리스트레싱 보강 강판을 다단계로 가열하여 가열 단계별로 콘크리트 교량의 하부에 접합한 뒤, 열원을 제거하여 발생하는 다단계 수축력을 보강에 필요한 프리스트레싱력으로 이용하는 보강 공법이다. 본 연구에서 제안된 온도 프리스트레싱 보강 공법의 적용을 위한 기초적인 연구로 프리스트레싱 보강 강판을 콘크리트 교량에 설치하기 위한 고정장치의 마찰저항 강도 실험과 온도 프리스트레싱에 의하여 콘크리트 교량에 도입되는 프리스트레싱 효과의 확인을 위한 응력 도입 실험을 실시하여 제안된 공법을 검증하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 추계학술대회 논문집
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.352-355
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• 2007

We have developed tight bonding of plastic LCD with new rigid spacer. For tight bonding of two plastic substrates, we designed structures to collect UV or thermal epoxy placed on the top of rigid spacer spontaneously by capillary effect. We confirmed that tight bonded plastic LCD has a good adhesion without induced defects and a high mechanical stability against the various external deformations. This method can be applicable to the fabrication of large plastic LCDs using stamping process.

• 비파괴검사학회지
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• 제15권4호
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• pp.540-548
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• 1996

전자 부품의 일종인 LSI 패키지의 제조 과정에서 절연 방진 방습 등을 목적으로 수지 몰딩이 널리 사용되고 있는데, 냉각과정에서 금속과 수지의 계면에 접합 잔류열응력이 발생하여 파괴의 원인이 되고 있다. 접합 잔류열응력의 측정에는 X선 회절법등이 사용되지만 측정상의 어려움과 계면단 응력특이성에 대한 해석의 곤란함 때문에 적절한 모델링에 따른 수치해석적 연구가 새로이 주목을 받고 있다. 본 연구에서는 Al/Epoxy를 몰딩 접합한 세가지의 대표적인 계면 형상을 선정하여 계면에서의 잔류열응력을 경계요소 수치해석 및 스트레인 게이지를 이용한 실험을 통하여 각각 해석하였다. 수치해석과 실험결과는 정성적으로 잘 일치하였으며, 서브 요소를 사용하므로써 계면단 응력 특이성의 해석 정밀도를 향상시킬 수 있었다. 또한 접합 잔류열응력의 해석결과로부터 수직응력에 의한 계면 박리가 예상되고, 피착체의 두께가 증가할수록 응력 특이성이 강하게 나타남을 확인하였다.

• 한국표면공학회지
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• 제28권2호
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• pp.67-76
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• 1995

The microstructure of 95wt.%Pb/5wt.%Sn and 63wt.%Sn/37wt.%Pb solders for flip chip bonding process has been characterized. Solders were deposited by thermal evaporation and reflowed in the conventional furnace or by rapid thermal annealing(RTA) process. As-deposited films show columnar structure. The microstructure of furnace cooled 63Sn/37Pb solder shows typical lamellar form, but that of RTA treated solder has the structure showing an uniform dispersion of Pb-rich phase in Sn matrix. The grain size of 95Pb/5Sn solder reflowed in the furnace is about $5\mu\textrm{m}$, but the grain size of RTA treated solder is too small to be observed. The microstructure in 63Sn/37Pb solder bump shows the segregation of Pb phase in the Sn rich matrix regardless of reflowing method. The 63Sn/37Pb solder bump formed by RTA process shows more uniform microstructure. These result are related to the heat dissipation in the solder bump.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.183-188
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• 2002

Co-cured composite materials has its own characteristics, so its thermal expansion is different each other. The selection of tool material for co-cured composite part in high temperature more over $350^{circ}F$ and 50 Psi pressure have to consider part thermal expansion, size, shape, and economic aspect in production line. So it is important choose tooling material in manufacturing composite parts. We called the tool for airplane composite parts as BAJ (Bonding Assembly Jig). Composite parts are cured on the BAJ in autoclave. BAJ have to stable at high temperature over $350^{circ}F$ and 50 Psi pressure, Considering composite parts' dimensional tolerance compare to heat up in autoclave. This paper come from the results of the experiment at the composite parts production line and review other aircraft company's method for tooling This is for the engineer engaged in composite parts manufacturing.

• 한국산업융합학회 논문집
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• 제15권1호
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• pp.37-42
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• 2012

Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.

• 한국세라믹학회지
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• 제28권8호
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• pp.654-660
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• 1991

Stabilized Zirconia (3 mol % Yttria, 3Y-TZP) was joined with intermetallic compound NiTi which has similar thermal expansion coefficient. The optimum bonding condition was determined by the Taguchi Method. Under the optimum bonding condition, the 4-point bending strength was as high as 400 MPa. bonding interfaces were examined by optical microscope, SEM, and TEM; reaction products were identified by XRD and TEM, The relationship between products and strength was examined.

• 마이크로전자및패키징학회지
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• 제13권2호
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• pp.21-26
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• 2006

NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$와 $100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.