• Transactions of the Korean Society of Automotive Engineers
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• v.17 no.5
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• pp.1-6
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• 2009

The temperature of exhaust gas was raised by increasing of engine movement on developing engine. Thermal of high temperature and pressure reverse in bellows, because of increasing of engine movement and the thermal performance of converter in combustion. As a result, thermal loss is increased and thermal efficiency is decreased rapidly in bellows, it can occur to damage in mechanical structure. In this study, it was necessary to analyze back pressure performance and thermal characteristic on driving condition in exhaust system. It was adapted braid type bellows and straight type exhaust pipe. It was compared with curve type exhaust pipe for lay-out on considering to design of exhaust system. It was necessary to improve thermal characteristic and back pressure performance so that expansion cavity pipe(ECP) was installed between bellows and catalyst convert. Not only decreasing back pressure was solved but also thermal characteristic problems in exhaust pipe because of increasing capacity. According to this study, the basis of data is presented when new exhaust system is designed.

• Journal of Ocean Engineering and Technology
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• v.19 no.6 s.67
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• pp.64-71
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• 2005

The welding methods have been applied to the most structural products used in the automobile, ship construction, and construction. The structure steel must have sufficient strength of structure; However, the mechanical properties of the welded part changes when it is welded. Therefore, the stability or life of the structure may be affected by the changed mechanical properties. The mechanical properties of the welded part must be examined in order to ensure the safety of structure. In this research, the SS400 steel and the STS304 steel were used to estimate the mechanical properties of the HAZ by weld thermal cycle simulation. In this study, the materials were used to examine the weld thermal cycle simulation characteristic, under two conditions: the drawing with diameter of $\Phi$10 and the residual stress removal treatment. To examine the mechanical properties by the weld thermal cycle simulation, the tensile test was carried out in room temperature. The crosshead speed was lmm/min.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.75-80
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• 2012

Polymer composites which have electrical properties have been studied in various industries. The Multi-walled carbon nanotube (MWCNT) are thought to be reinforcements for polymers because of their high aspect ratio and specially mechanical, thermal and electrical properties. We introduced MWCNT and impact modifier in order to improve thermal and mechanical properties of Polyphenylene sulfide (PPS) and give electric characteristic to PPS. The thermal properties were investigated by Differential scanning calorimeter (DSC) and Thermogravimetric analysis (TGA). The morphology, mechanical properties and electrical characteristic were performed by Field emission scanning electron microscopy (FE-SEM), Izod impact tester and surface resistance meter. As a result, we could find that the PPS/MWCNT composites have high conductivity and good mechanical properties than neat PPS resin.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.2
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• pp.438-444
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• 1993

The circuit board of an electronic equipment were simulated with a vertical channel which had thermal blocks protruded from one of the channel walls. A rought front plate was made of a circuit board attached with short wires to simulate the back side of a printed circuit board. Natural convection experiments were carried out to study the effects of channel space and rough front plate and to find the suitable characteristic value after the fourth row. The effect of a rough front plate was negligble. There were negligible effects of the channel space on the first and second heaters. Heat transfer coefficients after the third row decreased as the channel space decreased. Heat transfer coefficients were almost constant for larger than 20 mm channel space. A characteristic length was suggested to non-dimensionalize Nu and Ra numbers in a vertical channel with protruded heaters. A correlation was obtained using the new characteristic lengths.

• Journal of the Korean Society of Industry Convergence
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• v.22 no.6
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• pp.767-773
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• 2019

The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

• Journal of Aerospace System Engineering
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• v.10 no.4
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• pp.26-34
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• 2016

In a number of industries, porous insulations have been frequently used, reducing thermal insulation space through excellent performance of the thermal insulation's characteristics. This paper suggests an effective thermal conductivity prediction model. Firstly, we perform a literature review of traditional effective thermal conductivity prediction models and compare each model with experimental heat transfer results. Furthermore, this research defines the effectiveness of thermal conductivity prediction models using experimental heat transfer results and the Zehner-Schlunder model. The newly defined effective thermal conductivity prediction model has been verified to better predict performance than other models. Finally, this research performs a transient heat transfer analysis of a thermal protection system with a porous insulation in a high speed vehicle using the finite element method and confirms the validity of the effective thermal conductivity prediction model.

• Journal of Mechanical Science and Technology
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• v.14 no.3
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• pp.298-305
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• 2000

The functionally graded material (FGM) is the new concept for a heat resisting material. FGM consists of ceramics on one side and metal on the other. A composition and microstructure of an intermediate layer change continuously from ceramics to metal at the micron level. This study is carried out to analyze the thermal shock characteristics of functionally graded PSZ/ metal composites. Heat-resistant property was evaluated by gas burner heating test using $C_2H_2/O_2$ combustion flame. The ceramic surface was heated with burner flame and the bottom surface cooled with water flow. Also, the composition profile and the thickness of the graded layer were varied to study the thermo mechanical response. Furthermore, this study carried out the thermal stress analysis to investigate the thermal characteristics by the finite element method. Acoustic emission (AE) monitoring was performed to detect the microfracture process in a thermal shock test.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.108-111
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• 2007

It's important to measure quantitative properties about thermal-nano variation conduct of polymer for producing high quality components using NIL process. NanoScale indents can be used ad cells for molecular electronics and drug deliver, slots for integration into nanodevices, and defects for tailoring the structure and properties. In this study, it's to evaluate mechanical characteristic of polymer such as PMMA and PC at high temperature for manufacture of nano/micro size of polymer using indenter at high temperature. At high temperature mechanical properties of polymer have extreme variation. Because heating the polymer, it becomes softer than room temperature. In this case it is especially important to study for mechanical properties of polymer at high temperature.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• International Journal of Air-Conditioning and Refrigeration
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• v.16 no.3
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• pp.83-88
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• 2008

A geometrically asymmetric trapezoidal fin is analyzed using the one-dimensional analytic method. Heat loss and thermal resistance are represented as a function of the fin base thickness, base height, fm shape factor, inside fluid convection characteristic number, convection characteristic numbers ratio, fm length and ambient convection characteristic number. The relationship between the fin base height and the shape factor for equal amounts of heat loss is presented. One of the results shows that the variations of the fm base thickness and the inside fluid convection characteristic number give no effect on the thermal resistance.