• Title/Summary/Keyword: Thermal analyses

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Thermal Stress Calculations Using Enhanced Green's Function Considering Temperature-dependent Material Properties (온도 의존적 재료물성치를 고려한 개선된 그린함수 기반 열응력 계산)

  • Han, Tae-Song;Huh, Nam-Su;Jeon, Hyun-Ik;Ha, Seung-Woo;Cho, Sun-Young
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.5
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    • pp.535-540
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    • 2015
  • We propose an enhanced Green's function approach to predict thermal stresses by considering temperature-dependent material properties. We introduce three correction factors for the maximum stress, the time taken to reach maximum stress, and the time required to attain steady state based on the Green's function results for each temperature. The proposed approach considers temperature-dependent material properties using correction factors, which are defined as polynomial expressions with respect to temperatures based on Green's functions, that we obtain from finite-element (FE) analyses at each temperature. We verify the proposed approach by performing detailed FE analyses on thermal transients. The Green's functions predicted by the proposed approach are in good agreement with those obtained from FE analyses for all temperatures. Moreover, the thermal stresses predicted using the proposed approach are also in good agreement with the FE results, and the proposed approach provides better predictions than the conventional Green's function approach using constant, time-independent material properties.

Analyses of Energy Savings and Night Heating Performance of a Movable Thermal Insulation Shuttered Window (단열셔터를 적용한 구동창호의 에너지 절감 및 야간 난방성능 분석)

  • Lee, Jang-Man;Cho, Soo;Lim, Sang-Hoon;Song, Kyoo-Dong
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.25 no.3
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    • pp.150-155
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    • 2013
  • Usually, a window tends to have a lower thermal performance, than that of an ordinary wall. This study analyzes the enhancement of thermal performance of a window, when a Thermal Insulation Shutter is installed. The analyses were conducted at the laboratory, and with a full-scale mockup house, and the U-factor and heating load were examined. The laboratory results show that the U-factor increased by approximately 28%, when a Thermal Insulation Shutter was installed. The temperature difference was about $5^{\circ}C$, and this shows that the Thermal Insulation Shutter enhances the thermal performance of the window, when installed. The mockup house was used to calculate the heating load; the heating load was reduced by more than 41%, and shows that the installation of a Thermal Insulation Shutter is an effective way to reduce heating energy consumption.

Analyses Thermal Stresses for Microaccelerometer Sensors using SOI Wafer(I) (SOI웨이퍼를 이용한 마이크로가속도계 센서의 열응력해석(I))

  • Kim, O.S.
    • Journal of Power System Engineering
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    • v.5 no.2
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    • pp.36-42
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    • 2001
  • This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a microaccelerometer sensors. The paddle of the micro accelerometer sensor is designed symmetric with respect to the direction of the beam. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional beam up to 80 degree and get it through the cooling process. We learn the thermal internal stresses of each shape and compare the results with each other, after heating the tunnel gap up to 400 degree during the Pt deposition process. Finally we find the optimal shape which is able to minimize the internal stresses of microaccelerometer sensor. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensor by electrostatic force.

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Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

Evaluation of Thermal Characteristics of a Direct-Connection Spindle Using Finite Element Co-Analysis (유한 요소 해석을 활용한 직결 주축의 열적 특성 평가)

  • Kim, Tae-Won;Choi, Jin-Woo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.2
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    • pp.228-234
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    • 2013
  • This study focuses on development of a finite element model for analysis of thermal characteristics of a direct-connection spindle of a machining center by joint simulation of heat transfer and thermal deformation. Two finite element analyses were carried out procedurally for heat transfer, first, to identify temperature distribution of components of the spindle and then for thermal deformation to identify their structural behavior based on the temperature distribution. It was assumed that the heat transfer between a component revolving and the surrounding air is identical to that between a flat plate and the running air on it and the heat transfer is based on a uniform surface heat flux for turbulent flow. The results from the analyses were compared with those from experiments to validate the finite element model.

SURGE LINE STRESS DUE TO THERMAL STRATIFICATION

  • Jhung, Myung-Jo;Choi, Young-Hwan
    • Nuclear Engineering and Technology
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    • v.40 no.3
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    • pp.239-250
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    • 2008
  • If there is a water flow with a range of temperature inside a pipe, the wanner water tends to float on top of the cooler water because it is lighter, resulting in the upper portion of the pipe being hotter than the lower portion. Under these conditions, such thermal stratification can play an important role in the aging of nuclear power plant piping because of the stress caused by the temperature difference and the cyclic temperature changes. This stress can limit the lifetime of the piping, even leading to penetrating cracks. Investigated in this study is the effect of thermal stratification on the structural integrity of the pressurizer surge line, which is reported to be one of the pipes most severely affected. Finite element models of the surge line are developed using several element types available in a general purpose structural analysis program and stress analyses are performed to determine the response characteristics for the various types of top-to-bottom temperature differentials due to thermal stratification. Fatigue analyses are also performed and an allowable environmental correction factor is suggested.

Heat transfer analysis of closed-loop vertical ground heat exchangers using 3-D fluid flow and heat transfer numerical model (3차원 열유체 수치해석을 통한 현장 시공된 수직 밀폐형 지중열교환기의 열전달 거동 평가)

  • Park, Moon-Seo;Lee, Chul-Ho;Min, Sun-Hong;Kang, Shin-Hyung;Choi, Hang-Seok
    • Proceedings of the Korean Geotechical Society Conference
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    • 2010.09a
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    • pp.800-807
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    • 2010
  • In this study, a series of numerical analyses has been performed in order to evaluate the performance of a full-scale closed-loop vertical ground heat exchanger constructed in Wonju. The circulation pipe HDPE, borehole and surrounding ground were modeled using FLUENT, a finite-volume method (FVM) program, for analyzing the heat transfer process of the system. Two user-defined functions (UDFs) accounting for the difference in the temperatures of the circulating inflow and outflow water and the change of the surrounding ground temperature with depth were adopted in the FLUENT model. The thermal properties of materials estimated in laboratory were used in the numerical analyses to compare the thermal efficiency of the cement grout with that of the bentonite grout used in the construction. The results of the simulation provide a verification of the in situ thermal response test data. The numerical model with the ground thermal conductivity of 4W/mK yielded the simulation result closer to the in-situ thermal response test than with the ground thermal conductivity of 3W/mK. From the results of the numerical analyses, the effective thermal conductivities of the cement and bentonite grouts were obtained to be 3.32W/mK and 2.99 W/mK, respectively.

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Thermal Cycling Screening Criteria to RCS Branch Lines in Domestic Nuclear Power Plant (국내 원전 RCS 분기배관에 대한 열피로 선정기준)

  • Park, Jeong Soon;Choi, Young Hwan;Lim, Kuk Hee;Kim, Sun Hye
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.6 no.2
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    • pp.54-60
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    • 2010
  • Piping failures due to thermal fatigue have been widely reported in normally stagnant non-isolable reactor coolant branch lines. Since the thermal fatigue due to thermal stratification was not considered in the piping fatigue design in old NPPs, it is important to evaluate the effect of thermal stratification on the integrity of branch lines. In this study, geometrical screening criteria for Up-horizontal branch lines in MRP-132 were applied to SI(Safety Injection) lines of KSNP 2-loop and WH 3-loop. Some computational fluid dynamic(CFD) analyses on the Reactor Coolant System(RCS) branch lines were also performed to develop the regulatory guidelines for screening criteria. As a result of applying MRP-132 screening criteria, KSNP 2-loop and WH 3-loop SI lines are determined to need further detailed evaluation. Results of CFD analyses show that both valve isolation and amount of leakage through valve can be used as technical bases for the screening criteria on the thermal fatigue analysis.

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A COUPLED CFD-FEM ANALYSIS ON THE SAFETY INJECTION PIPING SUBJECTED TO THERMAL STRATIFICATION

  • Kim, Sun-Hye;Choi, Jae-Boong;Park, Jung-Soon;Choi, Young-Hwan;Lee, Jin-Ho
    • Nuclear Engineering and Technology
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    • v.45 no.2
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    • pp.237-248
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    • 2013
  • Thermal stratification has continuously caused several piping failures in nuclear power plants since the early 1980s. However, this critical thermal effect was not considered when the old nuclear power plants were designed. Therefore, it is urgent to evaluate this unexpected thermal effect on the structural integrity of piping systems. In this paper, the thermal effects of stratified flow in two different safety injection piping systems were investigated by using a coupled CFD-FE method. Since stratified flow is generally generated by turbulent penetration and/or valve leakage, thermal stress analyses as well as CFD analyses were carried out considering these two primary causes. Numerical results show that the most critical factor governing thermal stratification is valve leakage and that temperature distribution significantly changes according to the leakage path. In particular, in-leakage has a high possibility of causing considerable structural problems in RCS piping.

Transient Heat Transfer and Structural Analyses for the Turbopump Turbine of a Liquid Rocket Engine (액체 로켓 터보 펌프 터빈의 천이 열전달 및 구조 해석)

  • Yoo, Jae-Han;Choi, Ji-Hoon;Lee, In;Han, Jae-Hung;Jeon, Seong-Min;Kim, Jin-Han
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.32 no.3
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    • pp.58-65
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    • 2004
  • Thermal and structural finite element analyses were performed for the turbopump turbine bladed disk model with shroud of a liquid rocket engine. The only 1/80 part model was analyzed which consists of 3D eight node isoparametric solid elements. The applied loading history consists of a startup condition with a thermal spike and a steady state. Heat transfer coefficient on the blade was predicted using the commercial Navier-Stokes solver, Fluent. Transient thermal responses during startup and steady states were calculated using a 3D finite element code developed. Maximum stress and shroud tip displacement under the influence of centrifugal and thermal loading were also determined.