• Title/Summary/Keyword: Thermal Transient

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Study on the Thermal Transient Response of TSV Considering the Effect of Electronic-Thermal Coupling

  • Li, Chunquan;Zou, Meng-Qiang;Shang, Yuling;Zhang, Ming
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.3
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    • pp.356-364
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    • 2015
  • The transmission performance of TSV considering the effect of electronic-thermal coupling is an new challenge in three dimension integrated circuit. This paper presents the thermal equivalent circuit (TEC) model of the TSV, and discussed the thermal equivalent parameters for TSV. Si layer is equivalent to transmission line according to its thermal characteristic. Thermal transient response (TTR) of TSV considering electronic-thermal coupling effects are proposed, iteration flow electronic-thermal coupling for TSV is analyzed. Furthermore, the influences of TTR are investigated with the non-coupling and considering coupling for TSV. Finally, the relationship among temperature, thickness of $SiO_2$, radius of via and frequency of excitation source are addressed, which are verified by the simulation.

A Study on Heat Transfer of an Induction Motor with Cooling Channels under Transient Operation Condition (냉각채널을 지닌 유도전동기의 비정상상태 운전시 열전달)

  • Lee, Jeong-Ho;Park, Sung-Hoon;Kauh, S.-Ken
    • Proceedings of the KSME Conference
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    • 2000.04b
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    • pp.205-212
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    • 2000
  • Induction motors. having axial cooling channels in stator and rotor are designed for better cooling performance. Traction motors are one of those examples. And, thermal analysis gain more attention with the Increased demand of the motors, for reliable operation and life prolongation. was Induced to effective thermal conductivity through modeling. Through. fundamental comparison experiment, heat source experiment and transient state experiment, the induction motor using inverter was examined to produce heat source with frequency level and traced to thermal variation at starting and stopping. And thermal analysis using thermal network was compared with a transient state experiment.

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An Experimental Measurement on Transient Thermal Response in a PI-Controlled VAV System

  • Kim, Seo-Young;Moon, Jeong-Woo;Kim, Won-Nyun
    • International Journal of Air-Conditioning and Refrigeration
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    • v.11 no.1
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    • pp.10-16
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    • 2003
  • The present study performs an experimental measurement on transient thermal response of an air-conditioned space by a variable air volume (VAV) system with a PI(pro-portional-integral) control logic. A thermal chamber with a PI controlled VAV unit is constructed to verify the previously suggested stratified multi-zone model. The effects of thermal parameters and control parameters such as supply air temperature and PI control factor are investigated by implementing the thermal chamber test. The experimental results obtained show that transient behavior of the air-conditioned space-temperature is in good accordance with the simulation results of the stratified thermal model.

Effect of Thermal Contact Resistance on Transient Thermoelastic Contact for an Elastic Foundation (탄성기반에서 과도 열탄성 접촉에 대한 열 접촉 저항의 영향)

  • Jang Yong-Hoon;Lee Seung-Wook
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.30 no.7 s.250
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    • pp.833-840
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    • 2006
  • The paper presents a numerical solution to the problem of a hot rigid indenter sliding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed, regardless of the thermal contact resistance. However the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady state, the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient, the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger numbers of small contact areas are established, unlit eventually the accuracy of the algorithm is limited by the discretization used.

Effects of Thermal Contact Resistance on Transient Thermoelastic Contacts for an Elastic Foundation (시간에 따른 탄성지지 열탄성 접촉에 대한 열접촉저항의 영향)

  • Jang, Yong-Hoon
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2005.05a
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    • pp.330-333
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    • 2005
  • The paper presents a numerical solution to the problem of a hot rigid indenter siding over a thermoelastic Winkler foundation with a thermal contact resistance at constant speed. It is shown analytically that no steady-state solution can exist for sufficiently high temperature or sufficiently small normal load or speed regardless of the thermal contact resistance. However, the steady state solution may exist in the same situation if the thermal contact resistance is considered. This means that the effect of the large values of temperature difference and small value of force or velocity which occur at no steady state can be lessened due to the thermal contact resistance. When there is no steady-state the predicted transient behavior involves regions of transient stationary contact interspersed with regions of separation regardless of the thermal contact resistance. Initially, the system typically exhibits a small number of relatively large contact and separation regions, but after the initial transient the trailing edge of the contact area is only established and the leading edge loses contact, reducing the total extent of contact considerably. As time progresses, larger and larger number of small contact areas are established, until eventually the accuracy of the algorithm is limited by the discretization used.

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Transient thermo-piezo-elastic responses of a functionally graded piezoelectric plate under thermal shock

  • Xiong, Qi-lin;Tian, Xin
    • Steel and Composite Structures
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    • v.25 no.2
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    • pp.187-196
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    • 2017
  • In this work, transient thermo-piezo-elastic responses of an infinite functionally graded piezoelectric (FGPE) plate whose upper surface suffers time-dependent thermal shock are investigated in the context of different thermo-piezo-elastic theories. The thermal and mechanical properties of functionally graded piezoelectric plate under consideration are expressed as power functions of plate thickness variable. The solution of problem is obtained by solving the corresponding finite element governing equations in time domain directly. Transient thermo-piezo-elastic responses of the FGPE plate, including temperature, stress, displacement, electric intensity and electric potential are presented graphically and analyzed carefully to show multi-field coupling behaviors between them. In addition, the effects of functionally graded parameters on transient thermo-piezo-elastic responses are also investigated to provide a theoretical basis for the application of the FGPE materials.

Thermal Transient Analysis of Electric Initiator Used SUS 304 Bridgewire (SUS 304 발열선을 사용한 전기식 착화기의 열특성 분석)

  • Yoon Ki-Eun;Ryu Byung-Tae;Choi Hong-Seok
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2005.11a
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    • pp.184-187
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    • 2005
  • Performing thermal transient test on electric initiator with SUS 304 bridgewire(diameter 2.3mil) and $Zr-KClO_4$ primary charge and analysing the test data using Fitted Wire Model shows that the thermal characteristic parameter related to primary charge is changed sharply around $300^{\circ}C$. It is determined that this phenomenon is due to endothermic reaction from phase transition of $KClO_4$, which is used as primary charge, and to physical change of thermal transient interface between bridgewire and primary charge. With this results, useful temperature range for the parameter obtained from thermal transient test can be suggested.

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Development of an Electric Circuit Transient Analogy Model in a Vertical Closed Loop Ground Heat Exchanger (수직밀폐형 지중열교환기의 회로 과도해석 상사모델 개발)

  • Kim, Won-Uk;Park, Hong-Hee;Kim, Yong-Chan
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.24 no.4
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    • pp.306-314
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    • 2012
  • Several numerical or analytical models have been proposed to analyze the thermal response of vertical ground heat exchangers (GHEX). However, most models are valid only after several hours of operation since they neglect the heat capacity of the borehole. Recently, the short time response of the GHEX became important in system simulation to improve efficiency. In this paper, a simple new method to evaluate the short time response of the GHEX by using an analogy model of electric circuit transient analysis was presented. The new transient heat exchanger model adopting the concept of thermal capacitance of the borehole as well as the steady-state thermal resistance showed the transient thermal resistance of the borehole. The model was validated by in-situ thermal response test and then compared with the DST model of the TRNSYS program.

DETERMINATION OF THERMAL CONDUCTIVITY FROM TRANSIENT REFLECTIVITY MEASUREMENTS OF AMOPHOUS SILICON THIN FILMS (A-Si 박막의 반사율변화에 따른 열전달계수 결정)

  • Ryu, Ji-Hyung;Kim, Hyang-Jung;Moon, Seung-Jae
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2453-2458
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    • 2007
  • The performance of polysilicon thin film transistor (p-Si TFT) has an important role in the operation of active matrix liquid crystal displays. To fabricate the p-Si TFTs that have uniform characteristics, understanding of the recrystallization mechanism of silicon is crucial. Especially, the analysis of the transient temperature variation and the liquid-solid interface motion is required to find the mechanism. The thermal conductivity is one of the most important parameters to understand the mechanism. In this work, a KrF eximer laser beam was irradiated to amorphous silicon thin films. We measured the transient reflectivity at the wavelength of 633 nm. We carried out the numerical simulation of one dimension conduction equation so that we determined the most well-fitted thermal conductivity by comparing the numerically obtained transient reflectivity with the experimentally measured one. The experimentally determined thermal conductivity of amorphous silicon thin films is 1.5 W/mK.

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Numerical Simulation on Startup Transient Performance of a Centrifugal Pump

  • Chen, Gang;Shao, Jie;Wu, Yulin;Liu, Shuhong;Cao, Guangjun
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2008.03a
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    • pp.751-755
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    • 2008
  • During the rapid startup transient of a centrifugal pump, in order to investigate its transient characteristics, the torque equations are deduced. Based on these equations, numerical simulation is carried out with the Large Eddy Simulation(LES) method and UDFs(User Defined Functions) are applied during the simulation. Comparison between simulation and experiment results of pump heads and rotational speed shows that they are in good agreement, indicating that the dynamic characteristics of this pump can be predicted accurate comparatively through simulation with LES method during its startup process.

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