• International Journal of Air-Conditioning and Refrigeration
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• v.6
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• pp.1-13
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• 1998

The basic heat transfer process that occurs in a building can best be illustrated by an electrical circuit network. Present paper reports the dynamic simulation of annual energy consumption in an office building by the thermal resistance capacitance network method. Unsteady thermal behaviors and annual energy consumption in an office building were examined in detail by solving the simultaneous circuit equations of thermal network. The results are used to evaluate the accuracy of the modified BIN method for the energy consumption analysis of a large building. Present thermal resistance-capacitance method predicts annual energy consumption of an office building with the same accuracy as that of response factor method. However, the modified BIN method gives 15% lower annual heating load and 25% lower cooling load than those from the present method. Equipment annual energy consumptions for fan, boiler and chiller in the HVAC system are also calculated for various control systems as CAV, VAV, FCU+VAV and FCU+CAV. FCU+CAV system appears to consume minimum annual energy among them.

• Journal of Electrical Engineering and Technology
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• v.9 no.3
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• pp.893-898
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• 2014

Recently, the interior permanent synchronous motor (IPMSM) has been applied to an integrated starter and generator (ISG) for hybrid electric vehicles. In the design of such a motor, thermal analysis is necessary to maximize the power density because the loss is proportional to the power of a motor. Therefore, a cooling device as a heat sink is required internally. Generally, a cooling system designed with a water jacket structure is widely used for electric motors because it has advantages of simple structure and cooling effectiveness. An effective approach to analyze an electric machine with a water jacket is a thermal equivalent network. This network is composed of thermal resistance, a heat source, and thermal capacitance that consider the conduction, convection, and radiation. In particular, modeling of the cooling channel in a network is challenging owing to the flow of the coolant. In this paper, temperature prediction using a thermal equivalent network is performed in an ISG that has a water cooled system. Then, an experiment is conducted to verify the thermal equivalent network.

• Proceedings of the KIEE Conference
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• 2001.04a
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• pp.84-86
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• 2001

This paper deals with the characteristic and thermal analysis of brushless motors for Rack assist type Electric Power Steering(REPS). The performance of permanent magnet is under the influence of temperature. To predict the motor performance, the thermal analysis is necessary. The equivalent thermal network is composed of the thermal resistance and the temperature of major parts is calculated according to the operating condition.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2276-2283
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• 2018

A 50kW-4000rpm interior permanent magnet synchronous machine (IPMSM) applied to the high-performance electric vehicle (EV) is introduced in this paper. The main work of this paper is that a 2-D T-type lumped-parameter thermal network (LPTN) model is presented for IPMSM temperature rise calculation. Thermal conductance matrix equation is generated based on calculated thermal resistance and loss. Thus the temperature of each node is obtained by solving thermal conductance matrix. Then a 3-D liquid-solid coupling model is built to compare with the 2-D T-type LPTN model. Finally, an experimental platform is established to verify the above-mentioned methods, which obtains the measured efficiency map and current wave at rated load case and overload case. Thermocouple PTC100 is used to measure the temperature of the stator winding and iron core, and the FLUKE infrared-thermal-imager is applied to measure the surface temperature of IPMSM and controller. Test results show that the 2-D T-type LPTN model have a high accuracy to predict each part temperature.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.6 no.2
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• pp.78-92
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• 1994

Thermal performance of pipe network of continuous heating system controlled by thermostat and flow control valve was simulated in consideration of radiation heat transfer and solved by linear analysis method. Thermal performance of real apartment building with radiant floor heating system was simulated by equivalence heat resistance-capacity method. This method enables to simulate the unsteady variation of temperature or each element of building. Heat transfer characteristics of each element were also investigated.

• Journal of the Society of Naval Architects of Korea
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• v.60 no.4
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• pp.222-230
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• 2023

In the present work, the scale effect on the Boil-Off Rate (BOR) was investigated based on an analytical method to systematically evaluate the thermal performance of a Liquefied Natural Gas (LNG) Cargo Containment System (CCS). A two-dimensional thermal resistance network model was developed to accurately estimate the heat ingress into the CCS from the outside. The analysis was performed for the KC-1 LNG membrane tank under the IGC and USCG design conditions. The ballast compartment of both the LNG tank and cofferdam was divided into six sections and a thermal resistance network model was made for each section. To check the validity of the developed model, the analysis results were compared with those from existing literature. It was shown that the BOR values under the IGC and USCG design conditions were agreed well with previous numerical results with a maximum error of 1.03% and 0.60%, respectively. A SDR, the scale factor of the LNG CCS was introduced and the BOR, air temperature of the ballast compartment, and the surface temperature of the inner hull were obtained to examine the influence of the SDR on the thermal performance. Finally, a correlation for the BOR was proposed, which could be expressed as a simple formula inversely proportional to the SDR. The proposed correlation could be utilized for predicting the BOR of a full-scale LNG tank based on the BOR measurement data of lab-scale model tanks.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.6
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• pp.421-429
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• 2011

Experimental and theoretical studies on cooling performance of two-channel thermoelectric air-cooling system in parallel flow are conducted. The effects of operating temperature to physical properties of thermoelectric module (TEM) are experimentally examined and used in the analysis of an air-cooling system considering thermal network and energy balance. The theoretical predicted temperature variation and cooling capacity are in good agreement with measured data, thereby validating analytic model. The heat absorbed rate increases with increasing the voltage input and decreasing thermal resistance of the system. The power consumption of TEM is linearly proportional to mean temperature differences due to variations of the physical properties on operation temperature of TEM. Furthermore thermal resistance of hot side has greater effects on cooling performance than that of cold side.

• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.342-346
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• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.3
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• pp.457-472
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• 1997

We studied the temperature distribution and heat transfer characteristics of TEFC induction motor with thermal network program for more efficient design and better cooling performance of it. We knew the characteristics and the windage loss of outer cooling fan from fan test experiments. Frame axial and peripheral heat transfer coefficients and endwinding heat transfer coefficient were measured by various model experiments and then, compared with other experimental results. Frame was the main heat transfer surface, load-side and fan-side surface were not thermally symmetric from the heat flux distribution analysis. Steady and unsteady temperature distributions were measured by real motor experiments. From the results, we knew that rotor surface temperature was higher than coil temperature and the hottest spot in the coil was loadside endwinding outside surface. We compared the simulation results with those of real motor test and the two results showed a good agreement.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.