• Journal of Welding and Joining
• /
• 제19권1호
• /
• pp.49-57
• /
• 2001

In this study, the residual stress fields of multi-pass welded were analyzed by FEA under various geometrical conditions. In order to estimate the effects of pipe geometries on residual stress distribution, welding processes of each model were performed under the same heat cycles. And then, the influence of cutting off the weld bead on the residual stress redistribution was also estimated. From the results, in the range of t/D=0.05, axial residual stresses on the outer surface of the welded pipe were linearly decreased with pipe diameter increase. On the other hand, hoop residual stresses were not influenced by them. And both axial and hoop residual stresses on the outer surface of the welded pipe were increased with pipe diameter increase. But, when t/D was smaller than 0.05, they were converged in the nearly same value. The maximum residual stresses were generated at around HAZ. It in therefore necessary to consider them in welding design, strength evaluation, and analysis of fracture characteristics.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 제6회 학술대회 논문집 일렉트렛트 및 응용기술연구회
• /
• pp.9-12
• /
• 2004

In this study, we investigated about electrooptics characteristic of three kind of TN cell on the polyimide surface. Monodomain alignments of thermal stressed TN cell over temperature of liquid crystal isotropic phase were almost same that of no thermal stressed TN cells. However, the thermal stressed TN cell have many defects. Also, threshold voltage and response time of thermal stressed TN cells show same performances of no thermal stressed TN cells. There were little changes of value in these TN cells. However, transmittances of TN cells on the polyimide surface decrease with increasing thermal stress time. Finally, the residual DC voltage of the thermal stressed TN cell on the polyimide surface show decrease of characteristics as increasing thermal stress time. Therefore, thermal stability of TN cell was decreased by high thermal stress for the long times.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 춘계학술대회 논문집 디스플레이 광소자 분야
• /
• pp.177-180
• /
• 2005

We have investigated electro-optical characteristics in three kinds of TN cells on the polyimide surface. Transmittance of no thermal stressed TN cells were better than that of thermal stressed TN cells. Also. the threshold voltage and the response time of thermal stressed TN cells were same that of no thermal stressed TN cells. There were little change of value in these TN cells. On the other hand. transmittances of TN cells on the polyimide surface decreased by increasing thermal stress time. Moreover. the residual DC of the thermal stressed TN cells on the polyimide surface showed the characteristics of thermal stressed TN cells were weakened as increasing thermal stress temperature and time. Therefore. thermal stability of TN cells were decreased gradually by giving high thermal stress for a long time.

• 한국정밀공학회지
• /
• 제33권7호
• /
• pp.529-534
• /
• 2016

During the past few years, several incidents of freight car wheel failure during operation have occurred due to fatigue crack and overheating from braking. Tensile residual stress on the wheel tread creates an environment conducive to the formation of thermal cracks that may threaten the safety of train operations. It is important to investigate the residual stress on wheels in order to prevent derailment. In the present paper, the residual stress on wheels is measured using the x-ray diffraction system and the residual stress is analyzed using FEM. The result shows that the residual stress on the wheel rim is lower than that on the wheel tread center and the stress on over-braked wheels changes from compression residual stress to tensile residual stress.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.451-452
• /
• 2005

In this study, the threshold voltage and the response time of thermal stressed TN-LCDs showed the same performances on none thermal stressed TN-LCDs. There was little change in TN cells. Also, while increasing thermal stress time, the transmittances of TN-LCDs on the rubbed PI surface were almost the same, But the thermal stability of TN cell was deteriorated.

• 동력기계공학회지
• /
• 제18권4호
• /
• pp.85-90
• /
• 2014

In this paper, the transient thermal and residual stress analysis of the welding of 9% Ni steel plates using the FEA software ABAQUS are presented. The 9% Ni steel plates are welded manually with welding consumables of 70% Ni based Inconel type super-alloys (YAWATA WELD B (M)), producing a multi-pass/multi-layer butt weld. For these materials, temperature dependant mechanical and thermal material properties are used in the analysis. The back gouging is considered in welding process simulation. The FE thermal results are validated by comparing the real fusion profile and heat affected zone (HAZ). In addition, the continuous indentation test was conducted to measure the strength of base metal, HAZ and weld metal.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
• /
• pp.245-247
• /
• 2002

The paper represents the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film. For the quantitative determination of the residual stress profiles, the test samples are doped via the fixed boron diffusion process and four types of the thermal oxidation processes and consecutively etched by the improved process. The residual stress measurement structures with the different thickness are simultaneously fabricated on the same silicon wafer. Since the residual stress profile is not uniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All of the coefficients of the polynomial are determined from the deflections of cantilevers and the displacement of a rotating beam structure. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Also, near the surface of the p+ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1998년도 추계학술대회 논문집
• /
• pp.121-124
• /
• 1998

It is well known that during the oxygen cutting residual thermal stresses are produced in weldment. Surface compressive residual stress is one of reasons for improvement on fatigue durability. To reduce the residual stress and improve the fatigue strength applied the impact loading in oxygen cutting frame. After applying the impact loading, redistribution of residual stress was measured by cutting method and tested fatigue tests.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2023년도 봄 학술논문 발표대회
• /
• pp.145-146
• /
• 2023

In this study, the effect of hybrid fiber reinforcement on the residual strength and impact resistance of high-strength cementitious composites exposed to high temperatures was investigated. A cementitious composites was manufactured in which 0.15 vol% of polypropylene fiber (PP) and 1.0 vol% of smooth steel fiber (SSF) were double-mixed, and a residual strength test was conducted while thermal stress was applied by heating test, and then a high-velocity impact test was performed. In the case of general cementitious composites, the rear surface is damaged due to explosion and low tensile strength during high temperature or impact, while hybrid fiber reinforced cementitious composites can repeatedly absorb and distribute stress until multiple fibers are damaged to suppress the propagation of impact and resistance to explosion. Therefore, this study analyzed the residual strength of cementitious composites exposed to high temperatures depending on whether hybrid fibers were mixed or not, and collected research data on fracture behavior through high-speed impact tests to evaluate impact resistance and mechanical properties.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2002년도 추계학술발표대회 논문집
• /
• pp.261-264
• /
• 2002

Interfacial evaluation, damage sensing and cure monitoring of single carbon fiber/thermosetting composite with different curing processes was investigated using electro-micromechanical test. After curing, residual stress was monitored by measurement of electrical resistance (ER) and then it was compared to correlate with various curing processes. In thermal curing, curing shrinkage appeared significantly by matrix shrinkage and residual stress due to the difference in thermal expansion coefficient (TEC). The change in electrical resistance (ΔR) on thermal curing was higher than that on ultraviolet (UV) curing. For thermal curing, apparent modulus was the highest and reaching time until same strain was faster. So far thermal curing shows strong durability on the IFSS after boiling test.