• 한국세라믹학회지
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• 제30권3호
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• pp.229-235
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• 1993

Thermal history and thermal stress of alumina specimen, which occured from thermal shock process, were calculated by finite difference method. Stress intensity factor and crack growth in cyclic thermal fatigue were calculated from single thermal shock temperature history and thermal stress. Cyclic thermal life were estimated by bending strength after cyclic thermal shock under critical thermal shock temperature. Calculated stress intensity factor was compared with real experimental thermal fatigue life of specimen. Fatigue life until critical stress intensity factor and real experimental result were comparable.

• Journal of Welding and Joining
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• 제21권3호
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• 대한기계학회논문집
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• 제18권5호
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• pp.1192-1202
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• 1994

Fatigue behavior and life prediction were presented for thermal-mechanical and isothermal low cycle fatigue of 12Cr forged steel used for high temperature applications. In-phase and out-of-phase thermal-mechanical fatigue test at 350 to 600.deg. C and isothermal low cycle fatigue test at 600.deg. C were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. Cyclic softening behavior was observed regardless of thermal-mechanical and isothermal fatigue tests. The phase difference between temperature and strain in thermal-mechanical fatigue resulted in significantly shorter fatigue life for out-of-phase than for in-phase. The difference in fatigue lives was dependent upon the magnitudes of inelastic strain ranges and mean stresses. Increase in inelastic strain range showed a tendency of intergranular cracking and decrease in fatigue life, especially for out-of-phase thermal-mechanical fatigue. Thermal-mechanical fatigue life prediction was made by partitioning the strain ranges of the hysteresis loops and the results of isothermal low cycle fatigue tests which were performed under the combination of slow and fast strain rates. Predicted fatigue lives for out-of-phase using the strain range partitioning method showed an excellent agreement with the actual out-of-phase thermal-mechanical fatigue lives within a factor of 1.5. Conventional strain range partitioning method exhibited a poor accuracy in the prediction of in-phase thermal-mechanical fatigue lives, which was quite improved conservatively by a proposed strain range partitioning method.

• Journal of Welding and Joining
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• 제19권4호
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• 한국세라믹학회지
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• 제36권8호
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• pp.871-875
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• 1999

Theoretical equation to calculate thermal fatigue life was derived in which slow crack growth theory was adopted. The equation is function of crack growth exponent n. Cyclic thermal fatigue tests were performed at temperature difference of 175, 187 and 200$^{\circ}C$ respectively. At each temperature difference critical thermal fatigue life cycles of the alumina ceramics were 180,37 and 7 cycles. And theoretical thermal fatigue life cycles were calculated as 172, 35 and 7 cycles at the same temperature difference conditions. Therefore thermal fatigue behavior of alumina ceramics can be represented by derived equation. Also theoretical single cycle critical thermal shock temperature difference can be calculated by this equation and the result was consistent with the experimental result well.

• 한국정밀공학회지
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• 제11권4호
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• pp.114-125
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• 1994

Fatigue behavior and life prediction method were presented for themal-mechanical and isothermal low cycle fatigue of 12 Cr forged steel used for high temperature applications. In-phase and out-of-phase thermal-mechanical fatigue test from 350 .deg. C to 600 .deg. C and isothermal low cycle fatigue test at 600 .deg. C, 475 .deg. C, 350 .deg. C were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. The phase difference between temperature and strain in thermal-mechanical fatigue resulted in significantly shorter fatigue life for out-of-phase than for in-phase. Thermal-mechanical fatigue life predication was made by partitioning the strain ranges of the hysteresis loops and the results of isothermal low cycle fatigue tests which were performed under the combination of slow and fast strain rates. Predicted fatigue lives for out-of-phase using the strain range partitioning method showed an excellent agreement with the actual out-of-phase thermal-mechanical fatigue lives within a factor of 1.5. Conventional strain range partitioning method exhibited a poor accuracy in the prediction of in-phase range partitioning method in a conservative way. By the way life prediction of thermal-mechanical fatigue by Taira's equivalent temperature method and spanning fartor method showed good agreement within out-of-phase thermal-mechanical fatigue.

• Journal of Welding and Joining
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• 제22권6호
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• pp.36-42
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• 2004

Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed. However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstic FE model with Darveaux method was very desirable and useful to predict the thermal fatigue life of solder joint for flip chip package under $208{\~}423K$ thermal cycling condition such as steep slope of temperature(JEDEC standard condition C). Thermal fatigue life was 1075 cycles as a result of viscoplatic model. It was a good agreement compared to the experimental. And also, it was found from the experimental that probability of the thermal fatigue life was $60{\%}$ at 1500 cycles.

• Journal of Welding and Joining
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• 제17권6호
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• 한국자동차공학회논문집
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• 제3권1호
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• pp.1-12
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• 1995

Isothermal and thermal-mechanical fatigue characteristics of 12Cr heat resisting steel used for high temperature applications were investigated including hold time effects. Isothermal low cycle fatigue test at $600^{\circ}C$ and in-phase, out-of-phase thermal-mechanical fatigue test at 350 to $600^{\circ}C$ were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. Regardless of thermal-mechanical and isothermal fatigue tests, cyclic softening behavior was observed and much more pronounced in the thermal-mechanical fatigue tests with hold times due to the stress relaxation during the hold time. The phase difference between temperature and strain in thermal-mechanical fatigue tests resulted in significantly shorter fatigue life for out-of-phase compared to in-phase. The differences in fatigue lives were dependent upon the magnitudes of plastic strain ranges and mean stresses. During the hold time in the strain-controlled fatigue tests, the increase in the plastic strain range and the stress relaxation were observed. It appeared that the increase in plastic strain range per cycle and the introduction of creep damage made important contributions to the reduction of thermal-mechanical fatigue life with hold time, and the life reduction tendency was more remarkable in the in-phase than in the out-of-phase thermal-mechanical fatigue. Isothermal fatigue tests performed under the combination of fast and slow strain rates at $600^{\circ}C$ showed that the fatigue life decreased as the strain rate and frequency decreased,especially for the low strain ranges.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.27-32
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• 2002

In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.