• Proceedings of the KSR Conference
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• 2003.10c
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• pp.73-78
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• 2003

The residual stresses and. distortions of structures by welding exert negative effect on the safety of railroad structures. This investigation performs a thermal elasto-plastic analysis using finite element techniques to evaluate residual stresses in butted-welded joint. Considering this initial residual stresses, local stress and strain at the critical location (weld toe) during the loading were analyzed by elastic plastic finite element analysis. Fatigue crack initiation life and fatigue crack propagation life of butt-welded specimen were predicted by local strain approach and Neuber's role and Paris law. It is demonstrated that fatigue life estimates by local strain approach closely approximate the experimental results.

• Journal of Ocean Engineering and Technology
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• v.17 no.3 s.52
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• pp.46-51
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• 2003

Acoustic emission (AE) signals, emanated during local failure of aluminum alloys, have been the subject of numerous investigations. It is well known that the characteristics of AE are strongly influenced by the previous thermal and mechanical treatment of the sample. Possible sources of AE during deformation have been suggested as the avalanche motion of dislocations, fracture of brittle particles, and debonding of these particles from the alloy matrix. The goal of the present study is to determine if AE occurring as the result of fatigue crack propagation could be evaluated by the joint time-frequency analysis method, short time Fourier transform (STFT), and Wigner-Ville distribution (WVD). The time-frequency analysis methods can be used to analyze non-stationary AE more effectively than conventional techniques. STFT is more effective than WVD in analyzing AE signals. Noise and frequency characteristics of crack openings and closures could be separated using STFT. The influence of various fatigue parameters on the frequency characteristics of AE signals was investigated.

• Journal of Mechanical Science and Technology
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• v.20 no.1
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• pp.59-65
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• 2006

A half-scaled large test model for the main components of the real annular structure was built and the thermal behaviors were experimented and obtained by thermal cyclic loads. The model design and the test conditions for the thermal loads were determined to take into consideration the thermal and mechanical loads acting on the real annular structure by finite element analyses. Temperature profiles and strains of the main components of the model were measured at an early stage of the test and periodically throughout the test in the given test conditions. After completion of the thermal cyclic tests, no evidence of crack initiation and propagation were identified by a dye penetration test. The measured strains at the critical parts were slightly increased proportionally with the increase in the number of the thermal cycles.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.322-327
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• 2001

The internal leaks of RCS pressure boundary valves may cause thermal fatigue crack because of the TASCS in RCS branch line. After experienced unisolable piping failures in several PWR plants, many studies have peformed to understand these phenomena and various methods were applied to ensure the structural integrity of piping. In this paper, the cause of unisolable piping failures and the alternatives to prevent recurrence of failure were reviewed. Also, the severity of piping failure including susceptibility of valve leaks was evaluated for the Westinghouse 2-loop plant. The length of turbulent penetration on RHR inlet piping was measured and, thermal fluid analysis and fatigue analysis was performed for this piping. As a means of ensuring the structural integrity, temperature monitoring and specialized UT and other alternatives were compared for the further application.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.17 no.2
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• pp.126-136
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• 2021

During operation of nuclear power plants, the fatigue assessment should be conducted repeatedly, considering changes of operating environments. For the case that cumulative usage factors (CUFs) may exceed the acceptance limit, flaw tolerance evaluation can be an alternative method to meet the regulatory requirements. In this respect, this paper analyzes the effects of the input variables for flaw tolerance evaluation based on ASME BPVC Section XI Appendix L. The reference analysis is performed for the example problem in NUREG/CR-6934. Then effects of the crack orientation, stress intensity factor solutions, thermal stress profiles, fatigue stress decomposition and fatigue crack growth curves are considered for the sensitivity analysis. The results show that the stress analysis considering the actual environment plays a crucial role in flaw tolerance evaluation.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2003.10a
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• pp.167-170
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• 2003

Thermal elastic-plastic analysis was performed to assess the initial residual stress distribution of welded joints considering temperature dependent material properties. The test model was the idealized boxing fillet specimen, frequently appeared in the joints of longitudinal and transverse members of ship structure. Residual stress relaxations due to external loads were analyzed by subsequent elastic-plastic analysis considering loading and unloading steps, and the characteristics of residual stress relaxations were discussed with the levels of external loads. Additionally, to define the fatigue life of crack initiation and propagation, the S-N data for each crack length were appraised.

• Journal of the Korean Society for Heat Treatment
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• v.28 no.2
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• pp.68-74
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• 2015

The low cycle fatigue (LCF) and creep-fatigue (hold time tension fatigue, HTTF) tests were performed on the modified 25Cr-13Ni cast stainless steel, which was selected as a candidate material for exhaust manifold in automotive engine. The exhaust manifold is subjected to an environment in which heating and cooling cycle occur due to the running pattern of automotive engine. Several types of fatigue behaviour such as thermal fatigue, thermal mechanical fatigue and creep-fatigue are belong to the main failure mechanisms. High temperature tensile test was firstly carried out to compare the sample with the traditional cast steel for the component. The low cycle fatigue and HTTF tests were carried out under the strain controlled condition with the total strain amplitude from ${\pm}0.6%$ to ${\pm}0.7%$ at $800^{\circ}C$. The hysteresis loops of HTTF tests showed significant stress relaxation during tension hold time. With the increase of tension hold time, the fatigue life was remarkably deceased which caused from the formation of intercrystalline crack by the creep failure mechanism.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1617-1621
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• 2005

In this study, as a basic research to improve braking efficiency of a ventilated disk brake, we carried out a thermal stress analysis. From analysis result, we knew that a maximum mechanical stress by braking pressure and friction force is applicable to 5 percent of yield strength and has no effect on a fatigue life's decrease for brake disk material. While, a maximum thermal stress by frictonal heat is applicable to 43 percent of yield strength and locates on a friction surface. So, we have found that a thermal stress is the primary factor of crack initiation on a friction surface of disk brake