• Journal of Powder Materials
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• v.28 no.6
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• pp.478-482
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• 2021

The effect of the process conditions of high-velocity oxygen fuel (HVOF) thermal spray coating on the porosity of the coating layer is investigated. HVOF coating layers are formed by depositing amorphous FeMoCrBC powder. Oxygen pressure varies from 126 to 146 psi and kerosene pressure from 110 to 130 psi. The Microstructural analysis confirms its porosity. Data analysis is performed using experimental data. The oxygen pressure-kerosene pressure ratio is found to be a key contributor to the porosity. An empirical model is proposed using linear regression analysis. The proposed model is then validated using additional test data. We confirm that the oxygen pressure-kerosene pressure ratio exponentially increases porosity. We present a porosity prediction model relationship for the oxygen pressure-kerosene pressure ratio.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.6
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.153-156
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• 2003

Thermal annealing of a polymer light-emitting diode (PLED) is shown to result in a remarkable improvement in the long-term stability of the device. The best half-life is obtained at an annealing temperature above the $T_g$ of emitting polymer. It is shown that the annealing of the emitting polymer layer results in a more than an order of magnitude increase in the half-life in spite of a decrease in the efficiency of the device as the annealing temperature increases.$^1$

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.825-828
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• 2007

This paper presents a thermally adaptive driving (TAD) technology for response time compensation of LCD with integrated sensor. The TAD is comprised of analog sensor signal conditioning and a digital feedback algorithm. Utilizing with a digital feedback system, TAD reduces response time of nearly 50% over the temperature range $0^{\circ}C-60^{\circ}C$.

• ETRI Journal
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• v.42 no.1
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• pp.118-128
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• 2020

A semitransparent photovoltaic-thermal (PV/T) air collector can produce electricity and heat simultaneously. To maximize the thermal and overall efficiency of the semitransparent PV/T air collector, its availability should be maximum; this can be determined through a Markov analysis. In this paper, a Markov model is developed to select an optimized number of semitransparent PV modules in service with five states and two states by considering two parameters, namely failure rate (λ) and repair rate (μ). Three artificial neural network (ANN) models are developed to obtain the minimum cost, minimum temperature, and maximum thermal efficiency of the semitransparent PV/T air collector by setting its type appropriately and optimizing the number of photovoltaic modules and cost. An attempt is also made to achieve maximum thermal and overall efficiency for the semitransparent PV/T air collector by using ANN after obtaining its minimum temperature and available solar radiation.

• Journal of Mechanical Science and Technology
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• v.14 no.2
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• pp.251-258
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• 2000

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

• Journal of Mechanical Science and Technology
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• v.17 no.5
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• pp.668-678
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• 2003

For the purpose to facilitate development of high-speed spindle units (SUs) running on rolling bearings, we have developed a beam element model, algorithms, and software for computer analysis of thermal characteristics of SUs. The thermal model incorporates a model of heat generation in rolling bearings, a model of heat transfer from bearings, and models for estimation of temperature and temperature deformations of SU elements. We have carried out experimental test and made quantitative evaluation of the effect of operation conditions on friction and thermal characteristics of the SUs of grinding and turning machines of typical structures. It is found out that the operation conditions make stronger effect on SU temperatures when rpm increases. A comparison between the results of analysis and experiment proves their good mutual correspondence and allows us to recommend application of the models and software developed for design and research of high-speed SUs running on rolling bearings.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.19-22
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• 2020

The thermal evaporation source is used to prepare thin films by physical vapor deposition. Materials of metals, organic materials, were tested and explained for thermal evaporation experiments. The developed effusion cell performance depends on the type of deposition material, the size of the crucible, the performance of the reflector, etc. and the proper conditions were found by producing, comparing and analyzing several sets of effusion cell to quantitatively evaluate the performance of the cell. The effusion cell for thermal evaporation source is used to prepare thin films of Ag, Cu, Mg.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.36-40
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• 2002

The development of feed drive system with high speed and accuracy has been a major issue in the machine tool industry. Linear motors can be used as the efficient tool to achieve fast feed mechanism and high accuracy. However. a high speed feed drive system with linear motors can generate heat problems such as the variation of temperature distribution and the resultant thermal stress. In this paper, the important heat sources and the resultant thermal errors are presented. The thermal deformation characteristics of the machine tool with linear motors were identified, which are thermal expansion of linear scale, shrinkage, expansion and bending in the machine tool structure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.5 no.4
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• pp.90-97
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• 1996

The thermal deformation of a machine tool spindle influences the performance of the manufacturing systems for precision products. In this research, thermal analysis of a high speed machine tool spindle with the rolling bearing and the built-in motor is carried out by using Finite Difference Method. The thermal boundary conditions describing the heat generation in the bearing and built-in motor are considered in the simulation. And various convective boundary conditions are assumed with the empirical formula in the references. From the simulation results, the characteristics of each element affecting the dynamic thermal behaviour of the machine tool spindle system have been clarified. Therefore, this model can be well applied to the future development of the high speed spindle systems.