• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.5
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• pp.426-431
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• 2007

When a high-energy ultrasound propagates through a solid body that contains a crack or a delamination, the two faces of the defect do not ordinarily vibrate in unison, and dissipative phenomena such as friction, rubbing and clapping between the faces will convert some of the vibrational energy to heat. By combining this heating effect with infrared imaging, one can detect a subsurface defect in material in real time. In this paper a realtime detection of the brazing defect of thin Inconel plates using the UIR (ultrasonic infrared imaging) technology is described. A low frequency (23 kHz) ultrasonic transducer was used to infuse the welded Inconel plates with a short pulse of sound for 280 ms. The ultrasonic source has a maximum power of 2 kW. The surface temperature of the area under inspection is imaged by an infrared camera that is coupled to a fast frame grabber in a computer. The hot spots, which are a small area around the bound between the two faces of the Inconel plates near the defective brazing point and heated up highly, are observed. And the weak thermal signal is observed at the defect position of brazed plate also. Using the image processing technology such as background subtraction average and image enhancement using histogram equalization, the position of defective brazing regions in the thin Inconel plates can be located certainly.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Journal of the Korean Solar Energy Society
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• v.37 no.2
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• pp.77-85
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• 2017

Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> $250^{\circ}C$), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and $175^{\circ}C$). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at $120^{\circ}C$ decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at $150^{\circ}C$, $175^{\circ}C$. The peel test indicates that the unstable performance of sample laminated at $120^{\circ}C$ is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is $150^{\circ}C$, considering stability and energy consumption during the fabrication.

• Journal of Conservation Science
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• v.29 no.3
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• pp.249-259
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• 2013

This study was experimented on accelerated weathering test using salt and freeze-thaw to prove effects of consolidants and consolidation for stone cultural heritage. The samples used four kinds of stones (Gyeongju Namsan Granite, Iksan Granite, Yeongyang Sandstone and Jeongseon Marble) which to distributed by three type of weathering grade (Fresh, Weathered Stone and Highly Weathered Stone) added for thermal treatment. The samples were treated with three consolidants (Wacker OH 100, Remmers KSE 300 and 1T1G), and tested by 500 cycles with freezing-thawing and 50 cycles of salt weathering test. As a results of freezing-thawing test, the crack and destruction occurred from some samples. And total immersed samples maintained effect of consolidation to 200 cycles. Also, The rock particle was fall off and gradually destructed by salts weathering test. The consolidated sample relatively had fewer changes by the weathering than not treated sample. The sprayed sample had not continuous effect on weathering.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.100-100
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• 2009

This paper is concerned with numerical analyses of residual stresses in welds and material's susceptibility to stress corrosion cracking (SCC) for the primary piping system in nuclear power plants: Both the dissimilar metal weld (DMW) for stainless steel to low alloy steel joints and the similar metal weld (SMW) for forged stainless steel to cast stainless steel joints are considered. Thermal elasto-plastic analyses using the finite element method (FEM) are performed to predict residual stresses generated in fabrication welding and its related processes for both the DMW and SMW, including effects of quenching for cast stainless steel piping, machining of the DMW root, and grinding of the SMW root. As a result, the effect of quenching should be included in the evaluation of residual stresses in the SMW for the cast stainless steel piping. It is deemed that residual stresses in both the DMW and SMW would not affect the SCC susceptibility of the welds providing that the welding processes are completed without any weld repair on the inside wall of the joint. However, the grinding process if performed on the safe-end to piping weld, would produce a high level of residual stresses in the inner surface region and thus a stress improvement process (e.g. buffing) should be considered to reduce susceptibilities to SCC.

• International Journal of Highway Engineering
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• v.17 no.3
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• pp.85-95
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• 2015

PURPOSES : Recently, bonded concrete overlay has been used as an alternative solution in concrete pavement rehabilitation since its material properties are similar to those of the existing concrete pavements. Deteriorated concrete pavements need rapid rehabilitation in order to prevent traffic jams on Korean expressways. Moreover, speedy and effective repair methods are required. Therefore, the use of bonded concrete overlay with ultra-rapid hardening cement has increased in an effort to reopen promptly the expressways in Korea. However, mobile mixer is required for ultra-rapid hardening cement concrete mixing in the construction site. The use of mobile mixer causes various disadvantages aforementioned such as limitation of the construction supply, open-air storage of mixing materials, increase in construction cost, and etc. In this study, therefore, hydration accelerator in-situ mixing on polymer modified concrete produced in concrete plant is attempted in order to avoid the disadvantages of existing bonded concrete overlay method using ultra-rapid hardening cement. METHODS : Bonded concrete overlay materials using ultra-rapid hardening cement should be meet all the requirements including structural characteristics, compatibility, durability for field application. Therefore, This study aimed to evaluate the application of hydration accelerator in-situ mixing on polymer modified concrete by evaluating structural characteristics, compatibility, durability and economic efficiency for bonded concrete overlay. RESULTS : Test results of structural characteristics showed that the compressive, flexural strength and bond strength were exceed 21MPa, 3.15MPa and 1.4MPa, respectively, which are the target strengths of four hours age for the purpose of prompt traffic reopening. In addition, tests of compatibility, such as drying shrinkage, coefficient of thermal expansion and modulus of elasticity, and durability (chloride ions penetration resistance, freezing-thawing resistance, scaling resistance, abrasion resistance and crack resistance), showed that the hydration accelerator in-situ mixing on polymer modified concrete were satisfied the required criteria. CONCLUSIONS : It was known that the hydration accelerator in-situ mixing on polymer modified concrete overlay method was applicable for bonded concrete overlay and was a good alternative method to substitute the existing bonded concrete overlay method since structural characteristics, compatibility, durability were satisfied the criteria and its economic efficiency was excellent compare to the existing bonded concrete overlay methods.

• Journal of the Korean Ceramic Society
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• v.38 no.9
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• pp.811-816
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• 2001

The influence of the incinerated ash and additives on glass phase formation of lightweight aggregate, weight-lightening, and the bloating mechanism was investigated. Clay was used as base materials and incinerated ash was added from 0 to 30wt%. The additives such as $Na_2CO_3,\;CaCo_3,\;K_2CO_3,\;MgCO_3$, and a little amount of waste oil were added to the mixed body. In clay/incinerated ash/additive system, it turned out that $CaCO_3\;and\;MgCO_3$ were the components for glass phase formation and $Na_2CO_3$ was the component for both glass phase formation and weight-lightening. The small addition of waste oil from 0.5wt% to 3.0wt% affect on the bloating of aggregate. Incinerated ash had a good effect on the glass phase controlling. The most effective condition controlling glass phase and bloating of aggregate was 10wt% incinerated ash, 2wt% waste oil at 1200$^{\circ}$C. The bloating mechanism of lightweight aggregate is as follows; 1) micro-crack formation caused by thermal-shock and gas generation from inside of aggregate, 2) volume expansion by glass phase formation on the aggregate surface and rapid gas bloating inside of aggregate, 3) densification after bloating.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.65-65
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• 2012

Copper zinc tin sulfide ($Cu_2ZnSnS_4$, CZTS) is a very promising material as a low cost absorber alternative to other chalcopyrite-type semiconductors based on Ga or In because of the abundant and economical elements. In addition, CZTS has a band-gap energy of 1.4~1.5eV and large absorption coefficient over ${\sim}10^4cm^{-1}$, which is similar to those of $Cu(In,Ga)Se_2$(CIGS) regarded as one of the most successful absorber materials for high efficient solar cell. Most previous works on the fabrication of CZTS thin films were based on the vacuum deposition such as thermal evaporation and RF magnetron sputtering. Although the vacuum deposition has been widely adopted, it is quite expensive and complicated. In this regard, the solution processes such as sol-gel method, nanocrystal dispersion and hybrid slurry method have been developed for easy and cost-effective fabrication of CZTS film. Among these methods, the hybrid slurry method is favorable to make high crystalline and dense absorber layer. However, this method has the demerit using the toxic and explosive hydrazine solvent, which has severe limitation for common use. With these considerations, it is highly desirable to develop a robust, easily scalable and relatively safe solution-based process for the fabrication of a high quality CZTS absorber layer. Here, we demonstrate the fabrication of a high quality CZTS absorber layer with a thickness of 1.5~2.0 ${\mu}m$ and micrometer-scaled grains using two different non-vacuum approaches. The first solution-processing approach includes air-stable non-toxic solvent-based inks in which the commercially available precursor nanoparticles are dispersed in ethanol. Our readily achievable air-stable precursor ink, without the involvement of complex particle synthesis, high toxic solvents, or organic additives, facilitates a convenient method to fabricate a high quality CZTS absorber layer with uniform surface composition and across the film depth when annealed at $530^{\circ}C$. The conversion efficiency and fill factor for the non-toxic ink based solar cells are 5.14% and 52.8%, respectively. The other method is based on the nanocrystal dispersions that are a key ingredient in the deposition of thermally annealed absorber layers. We report a facile synthetic method to produce phase-pure CZTS nanocrystals capped with less toxic and more easily removable ligands. The resulting CZTS nanoparticle dispersion enables us to fabricate uniform, crack-free absorber layer onto Mo-coated soda-lime glass at $500^{\circ}C$, which exhibits a robust and reproducible photovoltaic response. Our simple and less-toxic approach for the fabrication of CZTS layer, reported here, will be the first step in realizing the low-cost solution-processed CZTS solar cell with high efficiency.

• Journal of the Korean Ceramic Society
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• v.40 no.9
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• pp.874-880
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• 2003

The effect of h-BN content on microstructure, mechanical properties, and machinability of AlN-BN based machinable ceramics were investigated. The relative density of sintered compact decreased with increasing h-BN content. The four-point flexural strength also decreased from 238 MPa of monolith up to 182 MPa by the addition of 30 vol％ h-BN. Both low Young's modulus and residual tensile stress, formed by the thermal expansion coefficient difference between AIN and h-BN, might cause the strength drop in AlN-BN composite. The crack deflection, and pull-out phenomena increased by the plate-like h-BN. However, the fracture toughness decreased with h-BN content. The second phases, consisted of YAG and ${\gamma}$-Al$_2$O$_3$, were formed by the reaction between Al$_2$O$_3$ and Y$_2$O$_3$. During end-milling process, feed and thrust forces measured for AlN-(10～30) vol％ BN composites decreased with increasing h-BN particles, showing excellent machinability. Also, irrespective of h-BN content, relatively good surfaces with roughness less than 0.5 m (Ra) could be achieved within short lapping time.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.