• 대한기계학회논문집A
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• 제31권1호
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• pp.113-120
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• 2007

Design optimization of layered plates bonding process is conducted by considering uncertainties in a manufacturing process, in order to reduce the crack failure arising due to the residual stress at the surface of the adherent which is caused by different thermal expansion coefficients. Robust optimization is peformed to minimize the mean as well as its variance of the residual stress, while constraining the distortion as well as the instantaneous maximum stress under the allowable reliability limits. In this optimization, the dimension reduction (DR) method is employed to quantify the reliability such as mean and variance of the layered plate bonding. It is expected that the DR method benefits the optimization from the perspectives of efficiency, accuracy, and simplicity. The obtained robust optimal solution is verified by the Monte Carlo simulation.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2007년도 춘계학술대회 논문집
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• pp.798-803
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• 2007

The brake system of railway plays an important role to enhance the speed of train, and the brake disc is one of major components relating to frictional braking. The performance enhancement of brake disc directly affects the braking performance of train. It is required to understand and investigate the factors need to be considered for the development of new brake disc with improved materials and performance. In this study, through the literature reviews of previous study, several factors including thermal crack phenomena, friction coefficient, materials and durability of disc, temperature characteristics, etc., were introduced for the design of improved brake disc. Moreover, based on the review results, the design direction of new brake disc was suggested. Eventually, a new brake disc with improved performance would be developed based on this investigation.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• 한국전기전자재료학회논문지
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• 제22권3호
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• pp.210-217
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• 2009

Insulated methods of compact bus duct has been applied a way of coating Epoxy powder. The problem which is caused by degradation during operation is very important in severe environment. Therefore, this study compared and verified many kind of properties ; electrical breakdown by thermal and water aging, v-t characteristic, arc discharge, mechanical properties, bending test and cross cut. Sample D was stable before the $T_g$ to be about $7{\sim}10 %$ decrease in the breakdown test according to temperature change. In case of V-t and arc discharge, it had been kept up suitable characteristic. Also, in case of electrical and mechanical characteristic, both sample D and A have excellent capacity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.220-223
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• 1996

Mechanical properties of Plasma-Enhanced Chemical Vapor Deposited (PECVD) silicon nitride thin film was studied to determine the feasibility of the film as a passivation layer over the aluminum bonding areas of integrated circuit chips. Ultimate strain of the films in thicknesses of about 5 k${\AA}$ was measured using four-point bending method. The ultimate strain of these films was constant at about 0.2% regardless of residual stress. Intrinsic and residual stresses of these films were measured and compared with thermal shock and cycling test results. Comparison of the results showed that more tensile films were more susceptible to crack- induced failure.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.73-78
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• 1994

Wear and fracture mode of ceramic tool for hardened SKD11 steel was investigated by face milling in this study. The cutting force and Acoustic Emission(AE) signal were utilized to detect the wear and fracture of ceramic tool. The following conclusions were obtained : (1) The wear and fracture modes of ceramic tool are characterized by three types: \circled1wear which has normal wear and notch wear, \circled2 wear caused by scooping on the rake face, \circled3 large fracture caused by thermal crack in the rake face. (2) The wear behaviour of ceramic tool can be detected by the increase of mean cutting force and the variation of the AE RMS voltage. (3) The catastrophic fracture of ceramic tool can be detected by the cutting force(Fz-component). (4) As the hardness of work material increased, Acoustic Emission RMS value and mean cutting force(Fz) increased linearly, but the tool life decreased.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.156-160
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• 1994

Use of engineering ceramics has been increasing due to the outstanding physical and chemical properties. Conventional machining processes, however, are not applicable due to their hardness and brittleness. Laser cutting is a promising alternative for these ceramics. In this study, experimental data of CO $_{2}$ laser cutting of $Al_{2}$ $O_{3}$ and Si $_{3}$ N $_{4}$ are obtained to give a guide in the industry. Results of $Al_{2}$ $O_{3}$ cutting showed extreme weakness to thermal crack and it was found that pulsed beam has to be used for thick $Al_{2}$ $O_{3}$ specimen. Si $_{3}$ N $_{4}$ showed good results for both CW and pulsed beams. Using pulsed beam resulted narrower kerf width with increased surface roughness a nd reduced cutting speed. It was also found that a parameter call path energy is useful for representing minimum threshold value for possible cutting range with pulsed beam.

• 한국재료학회지
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• 제10권2호
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• pp.138-143
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• 2000

화력발전설비의 주요 손상 요인 중의 하나인 응력부식 균열 성장에 대한 확률론적 잔존 수명평가에 대하여 연구하였으며, 손상해석 및 수명평가에 확률해석 기법을 도입한 확률론적 수명평가 프로그램을 개발하였다. 확률론적 수명평가는 재료물성치, 형상, 하중조건, 운전조건 등과 같은 불확실성과 변동 가능성을 고려하여 해석을 수행하며, 일정 시간 운전후 구조물의 손상이 일어날 확률을 예측하는 것이다. 응력부식 균열 성장에 대한 확률론적 잔존 수명평가 연구를 통하여 확률론적 수명평가 기술의 기반을 구축하였으며, 다른 손상기구에 대한 확률론적 수명평가를 수행하여 발전설비에 발생하는 모든 손상에 대하여 확률론적 수명평가가 가능하도록 확대할 계획이다.

• 열처리공학회지
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• 제10권4호
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• pp.219-231
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• 1997

Inconel alloys used as nuclear power plant components have experienced intergranular stress corrosion cracking problems inspite of their good corrosion characteristics. In order to investigate the effects of heat treatments on carbide precipitation and intergranular stress corrosion cracking(IGSCC) in Inconel alloys, DSC(Differential Scanning Calorimeter), TEM, EDXS and static potential corrosion tests were carried out. Thermal treatment at $750^{\circ}C$ for 15hours in Inconel alloys increased the density of intergranular carbide. The carbides are mainly $Cr_7C_3$ in Inconel 600, and $Cr_{23}C_6$ in Inconel 690. The Cr depletion around grain boundary is not crucial factor on IGSCC. The carbides in grain boundary play an important role as acting dislocation source, and as decreasing stress around growing crack.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.