• 한국항공운항학회지
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• 제16권4호
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• pp.26-34
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• 2008

This article provides a comprehensive treatment of cracks in non-homogeneous structural materials such as functionally graded materials (FGMs). It is assumed that the material properties depend only on the coordinate perpendicular to the crack surfaces and vary continuously along the crack faces. By using laminated composite plate model to simulate the material non-homogeneity, we present an algorithm for solving the system based on Laplace transform and Fourier transform techniques. Unlike earlier studies that considered certain assumed property distributions and a single crack problem, the current investigation studies multiple crack problem in the FGMs with arbitrarily varying material properties. As a numerical illustration, transient thermal flow intensity factors for a metal-ceramic joint specimen with a functionally graded interlayer subjected to sudden heating on its boundary are presented. The results obtained demonstrate that the present model is an efficient tool in the fracture analysis of non-homogeneous material with properties varying in the thickness direction.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• 대한기계학회논문집A
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• 제33권9호
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• pp.949-956
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• 2009

The C(t)-integral describes amplitude of stress and strain rate field near a tip of stationary crack under transient creep condition. Thus the C(t)-integral is a key parameter for the high-temperature crack assessment. Estimation formulae for C(t)-integral of the cracked component operating under mechanical load alone have been provided for decades. However, high temperature structures usually work under combined mechanical and thermal load. And no investigation has provided quantitative estimates for the C(t)-integral under combined mechanical and thermal load. In this study, 3-dimensional finite element analyses were conducted to calculate the C(t)-integral of elastic-creep material under combined mechanical and thermal load. As a result, redistribution time for the crack under combined mechanical and thermal load is re-defined through FE analyses to quantify the C(t)-integral. Estimates of C(t)-integral using this proposed redistribution time agree well with FE analyses results.

• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.127-131
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• 2008

In the disk braking of the railway trains, kinetic energy of the vehicles is converted into thermal energy by friction between a brake disk and the pad materials. This can be cause of the iterative thermal shock and generates thermal cracks on the brake disk surface. In this study, we show the comparative thermal fatigue test procedures and thermal crack analysis process to evaluate the thermal fatigue characteristics of candidate materials designed for development of heat-resistant brake disk material. We carried out tests on the conventional brake disk materials used for Saemaul and Mugunghwa trains, then we comparatively analyzed the thermal crack initiation and propagation on the surface of a specimen. A thermal fatigue test procedure and a crack analysis process were suggested to evaluate the heat resistance of the developed materials at later studies.

• 대한기계학회논문집
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• 제18권12호
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• pp.3136-3148
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• 1994

This paper proposed the method of fracture integrity evaluation for semi-elliptical crack. Plane strain fracture toughnesses are used to compare with the thermal shock stress intensity factors for semi-elliptical crack obtained by Vainshtok weight function method. The method is applied to the finite Cr Mo V and 2.25Cr Mo steel plates with semi-elliptical crack under the thermal shock. For the purpose, tensile property and fracture toughness with respect to the temperature are measured. To verify the method, thermal shock experiments are carried. The theoretical predictions are in good agreement with the experiments.

• 전기학회논문지
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• 제61권3호
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• pp.407-412
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• 2012

This study investigated the process of thermal-induced growth of micro-crack developed at the crystalline solar cell using EL image, determined the output characteristic according to the pattern of micro-crack, analyzed the I-V characteristic according to the pattern of crack growth, and predicted the output value using simulation. The purpose of this study was, therefore, to investigate the process of thermal-induced growth of micro-crack developed at the early stage of PV module completion using EL image, to analyze the resulting decrement of output and predict the output value using simulation. It was observed that the crack grew increasingly by the thermal condition, and accordingly the lowering of output was accelerated. The output values of crack patterns with various direction were predicted using simulation, resulting in close I-V curve with only around 4% of error rate. It is considered that it is possible to predict the electric characteristic of solar cell module using only pattern of micro-crack occurred at solar cell based on our results.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2001년도 봄 학술발표회 논문집
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• pp.521-526
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• 2001

Box-culvert is very important structure used almost every road construction. However this is treated very simple structure in design and construction. So many crack such as nonstructural crack has been occurred. This crack is very harmful on durability of concrete. In this study, thermal crack, one of the nonstructural crack, of box-culvert controled by using rapid-strength belite cement concrete. In this process, not only heat of hydration and thermal stress but also material mechanics properties and characteristics of durability were tested. and same model box-culvert using OPC concrete is constructed in same condition for comparison.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.643-647
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• 2003

Power plant Piping operating at elevated temperature often fails prematurely by the growth of microcracks under creep conditions. Therefore, the life assessment of high temperature components that contain cracks is an important technological problem. The mechanisms of crack growth in simple metals and alloys have been investigated using both mechanical and microstructural approaches. In this study, life prediction accounting for creep, crack growth and thermal stress is analyzed.

• 대한기계학회논문집
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• 제14권1호
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• pp.130-137
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• 1990

본 연구에서는 Bueckner의 가중함수법을 열충격 문제에 도입하여 열충격 응력 세기계수를 구하고, 평면변형을 파괴인성치와 비교하여 재료가 열충격을 받은 후 파괴 되는 시간을 이론적으로 계산한다. 또한 음향 방출법을 이용하여 파괴시간을 측정하 고 이론치와 비교한다.