• Title/Summary/Keyword: Thermal Behavior model

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Digitalization of the Nuclear Steam Generator Level Control System (증기발생기 수위조절 시스템의 디지탈화)

  • Lee, Yoon-Joon;Lee, Un-Chul
    • Nuclear Engineering and Technology
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    • v.25 no.1
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    • pp.125-135
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    • 1993
  • The safe and efficient operation of nuclear plants is recognized to be accomplished through the application of plant automation using digital technology, which is one of main targets of the next generation nuclear plants. For plant level automation, it is first required that each major subsystem be digitalized, and the steam generator water level control system is discussed in this study. The transfer functions between inputs and the level are derived by employing the thermal hydraulic model of the steam generator and are applied to the analysis of the current three-element control system. Since the control scheme in this study includes the steam generator itself as a process plant, the system order is high and the numerical instability arises in digitalizing. Together with this, the unreliability of the feedwater feedback signal at low power level leads to the proposal of a two-element control system with a proper digital controller. The digital PI controller developed for this system has the initial power adaptive gain and integration time constant. And it makes the overall system response satisfy the stability and other necessary control specifications simultaneously. Since the two-element control system using this controller depends on the initial power only, it is simple to define and it shows a similar level response behavior to that of its corresponding analog system.

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Time-Dependent Warpage Analysis for PCB Considering Viscoelastic Properties of Prepreg (Prepreg의 점탄성 특성을 고려한 PCB의 Time-Dependent Warpage 분석)

  • Chanhee Yang;Chang-Yeon Gu;Min Sang Ju;Junmo Kim;Dong Min Jang;Jae Seok Jang;Jin Woo Jang;Jung Kyu Kim;Taek-Soo Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.2
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    • pp.23-27
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    • 2024
  • In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.