• Bulletin of the Korean Chemical Society
• /
• v.19 no.3
• /
• pp.354-358
• /
• 1998

The effect of thermal conditions on the clustering of sulfonated polystyrene ionomers was investigated. It was found that when the zinc-sulfonated ionomer was dried above a matrix glass transition temperature (Tg), the cluster Tg was observed at ca. 310 ℃, which is ca. 45 ℃ higher than that for the ionomer dried below the matrix Tg. This difference is believed to be the result of the increase in chain mobility at higher temperatures, which improves the multiplet formation and clustering; thus the cluster Tg increases. In the lithium ionomer case, however, the increase in the cluster Tg was ca. 6 ℃ upon annealing. From the results, it was suggested that in the zinc ionomer, the zinc ion is soft and divalent, which results in weaker interactions in multiplets, and thus decreases the stability of the multiplets. Therefore, the thermal effect is more significant for the zinc ionomers than for the lithium ionomers.

• Bulletin of the Korean Chemical Society
• /
• v.29 no.6
• /
• pp.1167-1172
• /
• 2008

We investigated the glass transition temperatures ($T_g$) of dendrons consisting of conformationally mobile aliphatic polyether dendritic cores plus glassy peripheral polystyrenes (PSs), and linear PSs in the molecular weight range of 1000-8500 g/mol. We compared their $T_g$ behavior depending on their polymeric architecture. The linear PSs show a typical growth of $T_g$ up to 92.5 ${^{\circ}C}$ as the molecular weight increases to 8300 g/mol, while the dendrons display nearly constant $T_g$ values of 58-61 ${^{\circ}C}$, despite the increase of molecular weight with each generation. The striking contrast of Tg behavior would be mainly attributed to the fact that the dendrons keep the ratio of $N_e$/M ($N_e$: number of peripheral chain ends, M: molecular weight) over all the generations. Additionally, for the influence of dendritic spacers on glass transition temperature we prepared dimeric PSs with different linkage groups such as aliphatic ether, ester and amide bonds. We found that the dimer with the ether spacer exhibited the lowest glass transition at 55.4 ${^{\circ}C}$, while the amide linked dimer showed the highest glass transition temperature at 74.2 ${^{\circ}C}$. This indicates that the peripheral PS chains are effectively decoupled by the conformationally flexible ether spacer. The results from this study demonstrated that polymeric architecture and dendritic core structures play a crucial role in the determination of glass transition behavior, providing a strategy for the systematic engineering of polymer chain mobility.

• Bulletin of the Korean Chemical Society
• /
• v.17 no.7
• /
• pp.607-612
• /
• 1996

A series of new NLO-active poly(4-nitrophenylallylamine) derivatives was synthesized by the nucleophilic substitution reaction of several substituted 4-nitrohalobenzenes and poly(allylamine hydrochloride). All polymers obtained were amorphous and their glass transition temperatures (Tg) were observed around 148-160 ℃. For each of these polymers, their specific Tg values were dependent on characteristic electronic structures. UV-visible absorption spectra showed maximum absorption intensity at 355-393 nm for π-π* transition of alkylaminonitrophenyl groups. The χ(2)value of poly(4-nitrophenylallylamine), as determined by the second harmonic generation at 1064 nm, for a thin polymer film poled at an elevated temperature, was 1.4x10-8esu. The third-order NLO properties of poly(4-nitrophenylallylamine) derivatives were evaluated through measurement of degenerate four-wave mixing technique and χ(3) coefficient in the range of 2.7~3.2x10-12 esu at 602 nm was found with 400 fs laser pulses.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.55 no.12
• /
• pp.570-575
• /
• 2006

In this paper, we have investigated thermal properties by changing the content of carbon nanotube, which is component part of semiconductive shield in underground power transmission cable. Heat capacity (${\Delta}H$), glass transition temperature (Tg) and melting temperature (Tm) were measured with the samples of eight, through DSC (Differential Scanning Calorimetry), and the measurement ranges of temperature selected from $-100[^{\circ}C]\;to\;100[^{\circ}C]$ with heating temperature selected per $4[^{\circ}C/min]$ Also, high temperature, heat degradation initiation temperature, and heat weight loss were measured by TGA (Thermogravimetric Analysis) in the temperature from $0[^{\circ}C]\;to\;700[^{\circ}C]$ with rising temperature of $10[^{\circ}C/min]$. As a result, the Glass transition temperatures of the sample were showed near $-20[^{\circ}C]{\sim}25[^{\circ}C]$, and the heat capacity and melting temperature from the DSC was increased according to increasing the content of carbon nanotube, while, thermal diffusivity was increased according to increasing the content of carbon nanotube. Also, heat degradation initiation temperature from the TGA results was increasing according to increasing the content of carbon nanotube with CNT/EEA. Therefore, heat stabilities of EVA, which contained the we VA (vinyl acetate), showed the lowest.

• Bulletin of the Korean Chemical Society
• /
• v.29 no.1
• /
• pp.181-186
• /
• 2008

2,5-Di-(2'-hydroxyethoxy)-4'-nitrostilbene (3) was prepared and polycondensed with terephthaloyl chloride, adipoyl chloride, and sebacoyl chloride to yield novel T-type polyesters (4-6) containing the NLO-chromophores dioxynitrostilbenyl groups, which constituted parts of the polymer backbones. Polymers 4-6 are soluble in common organic solvents such as acetone and N,N-dimethylformamide. They showed thermal stability up to 260 oC in thermogravimetric analysis with glass-transition temperatures obtained from differential scanning calorimetry in the range 90-95 oC. The second harmonic generation (SHG) coefficients (d33) of poled polymer films at the 1064 nm fundamental wavelength were around 1.42 ´ 10-9 esu. The dipole alignment exhibited high thermal stability up to 5 oC higher than glass-transition temperature (Tg), and there was no SHG decay below 100 oC due to the partial main-chain character of polymer structure, which is acceptable for NLO device applications.

• Journal of the Korean Ceramic Society
• /
• v.32 no.12
• /
• pp.1424-1432
• /
• 1995

Chalcogenide glasses having IR (8~12${\mu}{\textrm}{m}$) transmittance were prepared and their densities, thermal and mechanical properties, IR-transmittances and chemical durabilities were determined. Glass transition temperatures (Tg) of Ge-As-Se, Ge-As-Se-Te and Ge-SE-Te system glasses were in the range of 280~3$65^{\circ}C$, 210~236$^{\circ}C$ and 210~26$0^{\circ}C$, respectively. Crystallization temperature (Tc) of Ge-Se-Te system glass was in the range of 305~40$0^{\circ}C$. Their thermal expansion coefficients($\alpha$) were in the range of 11.7~15.2$\times$10-6/K, 15.4~16.0$\times$10-6/K and 17.4~27.8$\times$10-6/K, respectively. Their MOR, hardness and fracture toughness were in the range of 15.2~18.6MPa, 36.1~58.2Kg/$\textrm{mm}^2$, 1.0~1.3 MPa.mm1/2, 18.9~24.9 MPa, 40.9~65.1Kg/$\textrm{mm}^2$, 1.3~1.5 MPa.mm1/2, and 24.1~30.8 MPa, 40.9~86.0Kg/$\textrm{mm}^2$, 1.4~1.8 MPa.mm1/2, respectively. IR transmittance of Ge-Se-Te system glass was about 60%. Ge-O extrinsic absorption peaks at 8, 12 ${\mu}{\textrm}{m}$ were significantly eliminated by the addition of Mg. Chemical durabilities in deionizied water of Ge-Se-Te system glass were good and IR-transmittances decreased with leaching time and temperature.

• Korean Journal of Materials Research
• /
• v.3 no.2
• /
• pp.145-150
• /
• 1993

Abstract In order to improve the brittleness of diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA) system, the reactive additive, succinonitrile(SN) was added to DGEBA/MDA system. In this case, thermal properties, glass transition temperature(Tg), thermal decomposition temperature(Td) and 5% weight loss temperature($T_{-5%}$)were investigated according to the different SN contents and cure temperatures. Tg, Td and $T_{-5%}$ decreased as the SN content was increased, but increased as the cure temperature was increased.

• KIEE International Transactions on Electrophysics and Applications
• /
• v.4C no.5
• /
• pp.230-235
• /
• 2004

In this paper, epoxy elasticity factors were investigated by TMA (Thermomechanical Analysis), DMTA (Dynamic Mechanical Thermal Analysis) and FESEM (Field Emission Scanning Electron Microscope) to improve toughness and reduce brittleness of existing epoxy resin. Dumbbell shaped specimens were made and tested at rates of 0, 20 and 35phr (part per hundred resins). TMA temperatures ranged from -2$0^{\circ}C$ to 20$0^{\circ}C$. Tg (glass transition temperature) of elastic epoxy was measured by thermal analysis. Also investigated were thermal expansion coefficient ($\alpha$), modulus and Tan$\delta$ (loss factor). And we analyzed structure through FESEM, could find elastic-factors of elastic epoxy that is not existing-epoxy. In addition, we measured permittivity and Tan$\delta$ for investigation of the electrical properties of elastic epoxy. Permittivity and Tan$\delta$ depend on elastomer composition. Namely, permittivity and Tan$\delta$ increase according to the elastomer contents. For experimental analysis results, 20phr was considered an excellent specimen.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2002.10a
• /
• pp.33-37
• /
• 2002

Recently, composites have been widely applied in the sporting goods, automobile, aerospace industry. As the use of advanced composites increase, specific techniques have been developed to repair damaged composite structures. In order to repair the damaged part, it is required that the material in the damaged area be removed first by utilizing the proper method, and prepreg be laid up in the area and cured under vacuum using the vacuum bagging materials. In curing process, either in an oven or autoclave is to be delamination can be occurred in the sound areas during and/or after the exposure to the elevated curing temperature in case that the repair process is repeated. Therefore, this study was conducted to evaluate the degree of degradation of properties of the cured parts and how it affects to the delamination phenomenon between laminated skin and honeycomb core.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2002.10a
• /
• pp.43-47
• /
• 2002

Weight loss experiments have been performed for unidirectional carbon fiber/epoxy laminates under both isothermal and cyclic thermal conditions. It was found that weight losses were the result of both specimen-geometry dependent oxidative degradation and volumetric geometry dependent thermal degradation. Thermal degradation was found to play a major role in the overall weight loss process, and photomicrographs of cross-sectioned, aged specimens confirmed this fact. A method to predict the effect of isothermal environment on the weight loss was introduced and found to be in good agreement with experimental data at temperatures near Tg (glass transition temperature).