A study on the interfacial reactions between electroless Ni-P UBM and 95.5Sn-4.0Ag-0.5Cu solder bump (무전해 Ni-P UBM과 95.5Sn-4.0Ag-0.5Cu 솔더와의 계면반응 및 신뢰성에 대한 연구)
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- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2002.05a
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- pp.85-91
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- 2002