• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.778-783
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• 1994

In operating automated manufacturing system, the long term stability and reliability of NC machine tools become most critical issues. Especially the machining accuracy is dominated by the thermal deformation of machine tools which remains still unsolved and causes troubles in manufacturing operations. Although researches have been carried out on the thermal behavior of a machine tools to minimize or control the thermal deformation of machine tools, the computer models for an analysis of the thermal behacior in machine tools has yet to appear in the open literature. The object of the paper is to present a method of modeling the thermal behavior of a machine tool. The method will make use of finite elements ad be capable of modeling whole machine structures as well as of heat generation processes in the kinematic system components. And temperature distributions and thermal deformations of a CNC lathe are analyzed using the finite element method and are compared with those measured in practice.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

• Steel and Composite Structures
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• v.19 no.6
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• pp.1467-1481
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• 2015

This paper presents a contribution to improving an analytical thermo-mechanical modeling of Oxley's machining theory of orthogonal metals cutting, which objective is the prediction of the cutting forces, the average stresses, temperatures and the geometric quantities in primary and secondary shear zones. These parameters will then be injected into the developed model of Karas et al. (2013) to predict temperature distributions at the tool-chip-workpiece interface. The amendment to Oxley's modified model is the reduction of the estimation of time-related variables cutting process such as cutting forces, temperatures in primary and secondary shear zones and geometric variables by the introduction the constitutive equation of Johnson-Cook model. The model-modified validation is performed by comparing some experimental results with the predictions for machining of 0.38% carbon steel.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.12
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• pp.2970-2981
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• 1993

In hot closed-die forging the load increases rapidly near the final stage. Preforming operation is important to both the sound final forging and die-service life. In this study, the material flows during preforming and final forging are investigated. The physical modeling with Plasticine as a model material showed clear flow patterns. The forging process were numerically simulated by the finite element method with the isothermal and the non-isothermal models. The flow patten of the isothermal simulation showed good agreements with the experiments. Temperature changes and pressure distributions on the die surfaces during one cycle of the forging process were obtained from the non-isothermal simulation. High pressure and temperature were developed at certain areas of the die surfaces. It was concluded that those areas usually coincide with each other and should be distributed by the preforming operations to enhance the die life.

• Transactions on Electrical and Electronic Materials
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• v.7 no.3
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• pp.145-148
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• 2006

In this study, the response surface modeling of the pretilt angle control using in-situ photoalignment method with oblique UV exposure .on plastic substrate is investigated. The pretilt angle is the main factor to determine the alignment of the liquid crystal display. The response surface model is used to analyze the variation of the pretilt angle on the various process conditions. Heating temperature and UV exposure time are considered as input factors. The liquid crystal (LC) pretilt angle increased with increasing heating temperature and UV exposure time. The analysis of variance is used to analyze the statistical significance and the effect plots are also investigated to examine the relationship between the process parameters and the response.

• ETRI Journal
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• v.28 no.3
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• pp.347-354
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• 2006

The characteristic variation of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. Four different structures of a 3-D inductor are fabricated by using a low-temperature co-fired ceramic (LTCC) process, and their s-parameters are measured between 50 MHz and 5 GHz. The circuit model parameters of each building block are optimized and extracted using the partial element equivalent circuit method and an HSPICE circuit simulator. Based on the model parameters, the characteristics of the test structures such as self-resonant frequency, inductance, and quality (Q) factor are analyzed, and predictive modeling is applied to the structures composed of a combination of the modeled building blocks. In addition, characteristic variations of the 3-D inductors with different structures using extracted building blocks are also investigated. This approach can provide a characteristic estimation of 3-D solenoid embedded inductors for structural variations.

• Transactions on Electrical and Electronic Materials
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• v.4 no.5
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• pp.33-37
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• 2003

This study was performed to investigate the deposition mechanism of SiO$_2$ by ArF excimer laser(l93nm) CVD with Si$_2$H$\_$6/ and N$_2$O gas mixture and evaluate laser CVD quantitatively by modeling. With ArF excimer laser CVD, thin films can be deposited at low temperature(below 300$^{\circ}C$), with less damage and good uniformity owing to generation of conformal reaction species by singular wavelength of the laser beam. In this study, new model of SiO$_2$ deposition process by laser CVD was introduced and deposition rate was simulated by computer with the basis on this modeling. And simulation results were compared with experimental results measured at various conditions such as reaction gas ratio, chamber pressure, substrate temperature and laser beam intensity.

• Journal of the Korean Institute of Gas
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• v.7 no.1 s.18
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• pp.41-46
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• 2003

The Phase and temperature changes of large clusters formed in a free jet expansion of acetylene in 14atm and 233K has been studied. The cluster has been treated as a sphere composed of many shells. A mean diameter of 4.88 microns was obtained by modeling the experimental cooling curve of clusters based on evaporation and heat conduction theory.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1098-1100
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• 1993

In this paper, We found the thermal characterstic of impulsed magnetizing fixture system through the SPICE modeling and investigated the applied possibility in application aspects. As the detailed thermal characteristic of magnetizing fixure can be obtained, the efficient design of the magnetizing fixture which produce desired magnet will be possible using our thermal modeling. The purpose of this work is to compute the temperature increasing for different magnetizing conditions. The method uses multi-lumped model with equivalent thermal resistance and thermal capacitance. The model ing and experimental results are in close agreement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.57-58
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• 2005

The properties such as capacitance and resonant frequency are important in embedded capacitors. Accurate equivalent model is required to find these properties of embedded capacitor. In this paper, we investigate to analyze the properties of high-K embedded capacitor which was fabricated by Low Temperature Co-fired Ceramic (LTCC). Modeling based on partial element equivalent circuit (PEEC) method is performed using HSPICE circuit simulation. This modeling methodology can provide the good inspection of embedded capacitor to device engineer.