• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.35 no.4
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• pp.421-427
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• 1999

The critical fracture energy and failure mechanisms of GF/PP composites are investigated in the temperatures range of the ambient temperature to $-50^{\circ}C$ The critical fracture energy increase as fiber volume fraction ratio increased The critical fracture energy shows a maximum at ambient temperature and it tends to decrease as temperature goes up. Major failure mechanisms can be classfied such as fiber matrix debonding, fiber pull-out and/or delamination and matrix deformation.

• Journal of the Korean Geophysical Society
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• v.8 no.2
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• pp.97-103
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• 2005

It is necessary, in the light of the importance of long-term slope stability problem, to develop a simple method or tool which can figure out the possible failure zone resulted from weathering effect and other factors. The FBG sensor system is used to estimate the correlations between the temperature and the slope in Yunhwajae, and to find a failure zone in slopes effectively. This research is to seek for the correlation between the soil temperature distribution and the strain distribution in a active zone by analyzing the data from the in-situ measurement so that the possible failure zone should be well defined based on the correlation. The zone of high temperature fluctuation can be regarded as one of the possible sliding zone due to the weathering effect while the constant temperature depth of the ground, if exists, would not be relatively affected by the weathering process.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.322-324
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• 2004

Up to the present, digital replantation patients has appealed different symptoms due to blood circulatory failure. But, the level of blood circulatory failure has been evaluated only by clinical symptoms, or angiography. According to the cases of digit replantation is increasing, then objective evaluation methods of the level of blood circulation failure is needed other than patient's subjective symptoms and complaints. Although angiography, doppler, electromagnetic flowmeter, laser blood flowmeter, mechanical blood flowmeter has been used for the evaluation of the blood circulatory failure, the result was affected by time, place, surrounding temperature, patient's body temperature, and even emotion. Therefore, it is pointed out with lack of availability, feasibility and reproducibility. Thus, we compared digital blood flow of dominant hand to non dominant hand, and replanted fingers to opposite normal fingers from developed photo-plethysmography. The average digital blood flow showed no difference in normal digits each other, but, replanted digits showed average of 53% (9 - 100 %) compare to opposit normal digits. As it measure relative blood flow for circulatory failure of tissue such as fingers and toes more sensitively, reliably. In conclusion, it is expected that photo- plethysmography will be very useful for diagnosis, curative effect, prognosis of blood circulatory failure in digital replantation patient.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.2
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• pp.122-129
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• 2004

There is an increasing need for large flat panel display devices. PDP (Plasma Display Panel) is one of the most promising candidates for this need. Thermal shock failure of PDP glass during manufacturing process is a critical issue in PDP industry since it is closely related to the product yield and the production speed. In this study, thermal shock resistance of PDP glass is measured by water quenching test and an analysis scheme is described for estimating transient temperature and stress distributions during thermal shock. Based on the experimental data and the analysis results, a simple procedure for predicting the thermal shock failure of PDP glass is proposed. The fast cooling process for heated glass plates can accelerate the speed of PDP production, but often leads to thermal shock failure of the glass plates. Therefore, a design guideline for preventing the failure is presented from a viewpoint of high speed PDP manufacturing process. This design guideline can be used for PDP process design and thermal -shock failure prevention.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.4134-4145
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• 2023

This paper proposes strain-based failure model of A533B1 pressure vessel steel to simulate failure, followed by application to OECD lower head failure (OLHF) test simulation for experimental validation. The proposed strain-based failure model uses simple constant and linear functions based on physical failure modes with the critical strain value determined either using the lower bound of true fracture strain or using the average value of total elongation depending on the temperature. Application to OECD Lower Head Failure (OLHF) tests shows that progressive deformation, failure time and failure location can be well predicted.

• Journal of the Korean Ceramic Society
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• v.28 no.6
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• pp.437-442
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• 1991

Temperature and atmosphere dependence of electrical conduction of the metal Cu, Ag, Au films, vaccum evaporated on glass, was investigated. The structural changes of the metal films were examined by SEM and high temperature XRD. The electrical resistance slightly increased with initial temperature increase up to the inflection point and decreased to minimum value, after this rapidly increased with further temperature increased below minimum. These phenomena were caused by the thermally induced film failure as a result of the mass transport. The temperature for the film failure increased in the order of O2, Air, Vacuum, N2, Ar in Cu, Ag films and Air, Vacuum, N2, Ar in Au film. The increase of resistance at the lower temperature range was attributed to the lattice distortion by disordered crystal structure, while the decreasing resistance was attributed to the removal of structural defects and film densification.

• Computers and Concrete
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• v.27 no.1
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• pp.13-20
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• 2021

In this paper, the elevated temperature on a concrete-galvalume composite beam's flexural strength based on the numerical and experimental methods is investigated. The strategy is to perform modeling and simulation of the flexural test based on finite element method (FEM) at room temperature and validate its results to experimental data at the same temperature. When the numerical model was proven valid, the model was utilized to simulate the effect of elevated temperatures on the composite element. The study concludes that the flexural strength of the beam decreases at higher temperature. Additionally, it was shown that cracking moments is susceptible to temperature fluctuation and the failure modes are sensitive concerning the elevated temperature.

• Tunnel and Underground Space
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• v.7 no.2
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• pp.130-135
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• 1997

When crystalline rocks are heated, thermal stress is induced by the differences in thermal expansion of the mineral composition and its orientation. In this study, high temperature uniaxial compressive tests were carried out for Iksan and Hwangdeung granites to study the deformation and failure behavior due to thermal loading. Compressive and tensile strength of Hwangdeung granite for 20$0^{\circ}C$ decreased to 80% and 82% of the room temperature strength, and those of Iksan granite decreased to 90% and 92% for 20$0^{\circ}C$, respectively. Elastic moduli of both granites were decreased sharply at the stress level of 80% of ultimate failure strength. Elastic moduli of both granites by variation of temperature at 50% of ultimate failure strength was decreased as almost linearly.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.53-59
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• 2014

The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous issue since the material was applied to the industry. Various shock test methods were developed and standardized tests are used in the industry worldwide. Although it is applied for several years, the detailed mechanism of the shock induced failure mechanism is still under investigation. In this study, the effect of external temperature was observed on large Flip-chip BGA components. The weight and size of the large package produced a high strain region near the corner of the component and thus show full fracture at around 200G level shock input. The shock performance at elevated temperature, at $100^{\circ}C$ showed degradation based on board pad designs. The failure mode and potential failure mechanisms are discussed.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1265-1270
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• 2008

Electromigration is a one of a critical failure mechanism in microelectronic devices. Minimizing the thin film interconnections in microelectronic devices make high current densities at electrrical line. Under high current densities, an electromigration becomes critical problems in a microelectronic device. This phenomena under DC conditions was investigated with high temperature. The current density of 1.5MA/cm2 was stressed in interconnections under DC condition, and temperature condition $150^{\circ}C,\;175^{\circ}C,\;200^{\circ}C$. By increasing of thin film interconections, microelectronic devices durability is decreased and it gets more restriction by temperature. Electromigration makes electronic open by void induced, and hillock induced makes electronic short state.