• Title/Summary/Keyword: Technical package

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Moderating Effect of Individualism/Collectivism on the Association between Service Quality, Corporate Reputation, Perceived Value and Consumer Behavioural Intention

  • Maiyaki, Ahmed Audu
    • Journal of Distribution Science
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    • v.11 no.7
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    • pp.39-45
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    • 2013
  • Purpose - The paper aims at testing the moderating effect of individualism dimension of culture on consumer behavioural intention about bank services in Nigeria. Research design, data, and methodology - A survey was conducted with a sample of five hundred and fifty five bank customers drawn from various retails banks. Using Statistical Package for Social Sciences and Analysis of Moment Structure, combinations of descriptive and inferential statistics were performed. Invariance test and multiple-group analysis were conducted in order to assess the moderating effect. The invariance test was necessary to confirm the equivalence of constructs so that any difference detected thereafter could be related to moderating effect. Results - The results show that individualism has a significant moderating effect on the relationship between technical quality, perceived value and corporate image on the one hand, and behavioural intention on the other. However, individualism does not moderate the association between functional quality and behavioral intention. Conclusions - It is recommended that the bank policy makers should take necessary step to enhance the customer perception of technical quality, perceived value and corporate image with respect the retail bank services.

An Efficiency Analysis of Takaful Insurance Industry: A Comparative Study

  • COSKUN, Ali;HABIBNIYA, Houshang;KECELI, Yavuz
    • The Journal of Asian Finance, Economics and Business
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    • v.8 no.7
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    • pp.111-120
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    • 2021
  • Takaful, which is an Islamic insurance instrument, manages risks in business, according to Shariah (Islamic law) principles and offers risk protection and savings assets. The study analyzes the comparative efficiency of takaful insurance companies by implementing empirical research. The study also provides a comprehensive literature review on the efficiency analysis of the takaful industry. The empirical part presents a wide range of efficiency comparisons of 41 takaful insurance companies in 16 countries between 2009 and 2014. The data enveloping analysis technique is utilized using the rDEA package in the R environment to compute the efficiency score. In the study, the technical efficiency, overall technical efficiency, and pure technical efficiency are calculated and compared per year and per country. The findings of the study suggest that the overall average efficiency scores of takaful companies are considerably high. The study results also indicate that the excess in the consumption of inputs decreases while the deficit in achieved outputs has been declining in the covered period. The study suggests the managers of the takaful companies can use the target efficiency scores, which are calculated by using the DEA analysis, as an ideal reference benchmark for planning their inputs and outputs.

Studies on the Shelf-life of the Grain Shape Improved Meju (낱알형 개량메주의 품질수명에 관하여)

  • Park, Choong-Kyun;Nam, Joo-Hyun;Song, Hyung-Ik;Park, Hak-Yong
    • Korean Journal of Food Science and Technology
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    • v.21 no.6
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    • pp.876-883
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    • 1989
  • In order to investigate the index component and basis for the shelf-life of the grain share improved Meju, the effect of the storage time and package on the quality of Meju and soy sauce were studied during 90 days storage at $30^{\circ}C$. Also, sensory evaluation for the soy sauces from Meju with various storage time were carried out. During the storage period, moisture content, amylase and protease activity were decreased, on the other hand, the contents of amino-nitrogen and ammonia-nitrogen were increased. Among these components, protease activity was found the major index component for quality control because it was the most important component for soy sauce fermentation and the most changeable component of Meju during the storage period. According to the sensory test, the quality of soy sauce was agreed well with the protease activity of Meju, and the soy sauce from longer storage Meju was inferior organoleptic quality to that from shorter Meju. By the storage quality test, protease activity showed the highest value in 15 days storage Meju and decreased gradually with storage time passed. The basis of protease activity for quality control was 200 (O.D. at 660 nm/g). which was 50% of the initial activity And it was known that the shelf-life of the grain shape improved Meju was about 90 days . It was also shown that the storage in package did not affect noticeably to prolong the shelf-life of Meju on this study.

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A Study on the Establishment Case of Technical Standard for Electronic Record Information Package (전자문서 정보패키지 구축 사례 연구 - '공인전자문서보관소 전자문서 정보패키지 기술규격 개발 연구'를 중심으로-)

  • Kim, Sung-Kyum
    • The Korean Journal of Archival Studies
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    • no.16
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    • pp.97-146
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    • 2007
  • Those days when people used paper to make up and manage all kinds of documents in the process of their jobs are gone now. Today electronic types of documents have replaced paper. Unlike paper documents, electronic ones contribute to the maximum job efficiency with their convenience in production and storage. But they too have some disadvantages; it's difficult to distinguish originals and copies like paper documents; it's not easy to examine if there is a change or damage to the documents; they are also prone to alteration and damage by the external influences in the electronic environment; and electronic documents require enormous amounts of workforce and costs for immediate measures to be taken according to the changes to the S/W and H/W environment. Despite all those weaknesses, however, electronic documents increasingly account for more percentage in the current job environment thanks to their job convenience and efficiency of production costs. Both the government and private sector have made efforts to come up with plans to maximize their advantages and minimize their risks at the same time. One of the methods is the Authorized Retention Center which is described in the study. There are a couple of prerequisites for its smooth operation; they should guarantee the legal validity of electronic documents in the administrative aspects and first secure the reliability and authenticity of electronic documents in the technological aspects. Responding to those needs, the Ministry of Commerce, Industry and Energy and the Korea Institute for Electronic Commerce, which were the two main bodies to drive the Authorized Retention Center project, revised the Electronic Commerce Act and supplemented the provisions to guarantee the legal validity of electronic documents in 2005 and conducted researches on the ways to preserve electronic documents for a long term and secure their reliability, which had been demanded by the users of the center, in 2006. In an attempt to fulfill those goals of the Authorized Retention Center, this study researched technical standard for electronic record information package of the center and applied the ISO 14721 information package model that's the standard for the long-term preservation of digital data. It also suggested a process to produce and manage information package so that there would be the SIP, AIP and DIP metadata features for the production, preservation, and utilization by users points of electronic documents and they could be implemented according to the center's policies. Based on the previous study, the study introduced the flow charts among the production and progress process, application methods and packages of technical standard for electronic record information package at the center and suggested some issues that should be consistently researched in the field of records management based on the results.

Geotechnical field investigation on giresun hazelnut licenced warehause and spot exchange

  • Angin, Zekai
    • Geomechanics and Engineering
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    • v.10 no.4
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    • pp.547-563
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    • 2016
  • This paper describes a geotechnical field investigation in Giresun hazelnut licenced warehause and spot exchange during twelve months to determine the soil profile and static project applicability. It is also aimed to determine the superstructure loads and evaluate the relevance of foundation filling materials of the main, laboratory, package and admin buildings. The main building has $88.50{\times}63.20(5593.2)m^2$ site area. It has a big raft foundation. Eleven geotechnical reports were prepared between 2 December 2014 and 25 May 2015. Maximum settlements and safe bearing capacities were calculated to decide to be able to proceed to the next step. Also, the detail observations and evaluations were presented from October 2014 to December 2014. It has been seen that the foundation is designed as a single foundation one. But, in the light of observations, it has been evaluated that the foundation project for package building is not adequate, and after these excavations it must be revised as a raft foundation. The thickness of foundation and structural details should be defined/drawn after analyzing the details by using a special software. Construction joints should be designed between different buildings interfaces to avoid damages and cracks with in different settlements. The environmental drainage must be projected and applied to avoid the probable damage of surface waters on foundations.

The New Smart Power Modules for up to 1kW Motor Drive Application

  • Kwon, Tae-Sung;Yong, Sung-Il
    • Journal of Power Electronics
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    • v.9 no.3
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    • pp.464-471
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    • 2009
  • This paper introduces a new Motion-$SPM^{TM}$ (Smart Power Modules) module in Single In-line Package (SIP), which is a fully optimized intelligent integrated IGBT inverter module for up to 1kW low power motor drive applications. This module offers a sophisticated, integrated solution and tremendous design flexibility. It also takes advantage of pliability for the arrangement of heat-sink due to two types of lead forms. It comes to be realized by employing non-punch-through (NPT) IGBT with a fast recovery diode and highly integrated building block, which features built-in HVICs and a gate driver that offers more simplicity and compactness leading to reduced costs and high reliability of the entire system. This module also provides technical advantages such as the optimized cost effective thermal performances through IMS (Insulated Metal Substrate), the high latch immunity. This paper provides an overall description of the Motion-$SPM^{TM}$ in SIP as well as actual application issues such as electrical characteristics, thermal performance, circuit configurations and power ratings.

Factors Influencing the Successful Implementation of the ERP System (ERP 시스템의 성공적 구현에 영향을 미치는 요인)

  • Kim, Byung-Gon;Oh, Jay-In
    • Asia pacific journal of information systems
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    • v.12 no.2
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    • pp.137-162
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    • 2002
  • As the ERP system become recognized as a strategic weapon of a firm, the way how to implement the system successfully has been an important issue for both practitioners and the academic community. The objective of this research is to identify the critical success factors influencing the implementation of the ERP system and to suggest the tasks to be considered first for the effective implementation of the system. The results from the analysis of data collected from the 169 firms among those which have implemented either the Oracle package or the SAP package in Korea are as follows. The important factors for the successful implementation of the ERP system include the strength of rivalry among competing firms; the degree to which information systems are matured; the information systems strategy of a firm; the support and concern from the top; and the technical openness between the ERP system and the legacy system such as network, hardware, and software. The tasks to be considered first for the effective implementation of the ERP system cover the same degree of feeling between labor and management on the threat to survive; the formulation of information systems strategy at the strategic level; CEO's strong will and resolution; the process automation and informatization of a firm; and the infrastructure including intranet and databases.

WLP and New System Packaging Technologies

  • WAKABAYASHI Takeshi
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.53-58
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    • 2003
  • The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

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Generation Tool of Learning Object Sequencing based on SCORM (SCORM 기반 학습객체 시퀀싱 생성 도구)

  • Kuk, Sun-Hwa;Park, Bock-Ja;Song, Eun-Ha;Jeong, Young-Sik
    • The KIPS Transactions:PartA
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    • v.11A no.2
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    • pp.207-212
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    • 2004
  • In this paper, based on SCORM Sequencing Model, we propose the learning content structure which has structure informations of learning object and decision rules how to transfer learning object to learner. It is intended to provide the technical means for learning content objects to be easily shared and reused across multiple learning delivery environment. We develop the generation tool of learning object sequencing, for processing the learning with variable teaching methodologies. The teaming objects also are automatically packaged the PIE(Package Interchange File) to transmit with SCORM RTE(Run-Time Environment) and attached SCO(Sharable Content Object) function for tracking learner information.

Recent Technical Trend and Properties on Raw Materials of Substrates for Microelectronic Packages (마이크로 전자패키지용 Substrates 원자재에 대한 기술동향 및 특성)

  • 이규제;이효수;이근희
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.3
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    • pp.43-55
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    • 2003
  • As the development of If industries and their electronic device manufacturing technology have been accelerated recently, the request for electronic devices with small size, light weight, and high performance has been inducing that electronic package and substrate (PCB) companies have to develop substrates with low cost, high dense I/O, excellent thermal properties and electrical properties. Therefore, world-wide chip makers have been setting their own severe reliability standards and requiring their suppliers to keep specification and to develop green, high frequency and high-performing substrates. Because properties of substrates are dependent mainly on their constituent materials, the application of them showing superior properties is expected to satisfy the customer's requirement. Therefore, substrate companies should ensure the superiority of materials and assure their competitive capability of substrates by analyzing the latest trends of technology and properties of the materials.

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