• The Korean Journal of Archival Studies
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• no.78
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• pp.79-151
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• 2023

The purpose of this study is to analyze the current state of long-term preservation policy for electronic records in Korea and to present future tasks. Although the current electronic record long-term preservation policy is not clearly codified, it can be said to consist of technical elements such as digital signature, hash, preservation format, and long-term preservation package. Each technological element was considered in order, and the limitations of the current policy and technology in the changing digital environment were analyzed and alternatives were presented.

• Fashion & Textile Research Journal
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• v.18 no.5
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• pp.658-667
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• 2016

The purpose of this study is 1) to research how practitioners in fashion industry in South Korea perceive concepts of Technical Design/Designer, 2) to compare and analyze issues at work by occupation, 3) to research specific works in garment development process, and 4) to compare and analyze work involvement by occupation, type of a company and etc, and 5) to propose the role of Technical Designers in apparel companies in South Korea. There were two methods to conduct this study, which were in-depth interview and survey. Both methods were conducted to designers, merchandisers, pattern makers, technical designers, and production coordinators. Frequency analysis, ANOVA, Duncan test, and Factor analysis were performed to get results by using SPSS 18.0 program. The results are following. There were 50 works during garment development process from the result of in-depth interview, and 6 factors were obtained from the result of Factor analysis, which were 'Works about Sample in Sample Development Process', 'Works about Product's Pattern and Size Spec', 'Works about Development of Garment's Design', 'Works about Planning of Product Development and Management of Product in Stock', 'Works about Production Process', and 'Preparation Works for Sample Development'. In conclusion, technical designer in apparel companies in South Korea should be in charge of works about sample in sample development process and decision making of product' size spec, which is included in works about product's pattern and size spec. Also, they should complete technical package after product is developed by designers.

• Journal of Engineering Education Research
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• v.5 no.2
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• pp.22-35
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• 2002

The main purpose of this study is to prepare an outline for developing the Contents Systems that achieve self-study systems to make the students adopt themselves into new study atmosphere and maximize the result of study on technical college in Electric-Electronic field. Questionnaire posed to analyze the demand of teaching materials to the students, and professors and also to find characteristics of students in technical college. The SPSSWIN/PC+ statistics Package was used to assay the collected answers. And simple frequency with percentage, average, and standard deviation were calculated to check the entire trend and actual state of each question. The primary outcomes of this study are as follows i) The students in the technical college prefer self-directed learning to lecturer-oriented teaching. ii) It is difficult to offer the technical college students normal education systems since the students?interest and motivation towards study are very low. iii) The lack of capability of foreign language and basic mathematics are considered as obstacles for many students technical college to study. iv) The professors in technical college still depend on traditional method to teach the students without organized research of the intellectual levels and attitude the students. v) Teaching materials in currently use are not appropriated to induce the motivation and interest of study from the students. Also, the teaching materials in use now were discovered not to have enough originality, practical application, andwere text based. Therefore, the improvement of the existing teaching materials was demanded while the fundamental ability to study of general students is declining. Consequently, it is necessary to introduce new teaching materials which are simple, easy, and organized to offer the studen ts study desire and interest.

• Korean Journal of Materials Research
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• v.22 no.11
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• pp.587-590
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• 2012

Recently, the demand for the miniaturization of package substrates has been increasing. Technical innovation has occurred to move package substrate manufacturing steps into CMP applications. Electroplated copper filled trenches on the substrate need to be planarized for multi-level wires of less than $10{\mu}m$. This paper introduces a chemical mechanical planarization (CMP) process as a new package substrate manufacturing step. The purpose of this study is to investigate the effect of surfactant on the dishing and erosion of Cu patterns with the lines and spaces of around $10/10{\mu}m$ used for advanced package substrates. The use of a conventional Cu slurry without surfactant led to problems, including severe erosion of $0.58{\mu}m$ in Cu patterns smaller than $4/6{\mu}m$ and deep dishing of $4.2{\mu}m$ in Cu patterns larger than $14/16{\mu}m$. However, experimental results showed that the friction force during Cu CMP changed to lower value, and that dishing and erosion became smaller simultaneously as the surfactant concentration became higher. Finally, it was possible to realize more globally planarized Cu patterns with erosion ranges of $0.22{\mu}m$ to $0.35{\mu}m$ and dishing ranges of $0.37{\mu}m$ to $0.69{\mu}m$ by using 3 wt% concentration of surfactant.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.835-838
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• 1998

본 연구에서는 칼라 CCD 센서를 제어하여, shading과 .gamma. correction 된 데이터를 읽어 들여, 이를 이진레벨 데이터로 바꾼후, 원래의 다치레벨 또는 이진레벨 데이터를 SCSI나 DMA I/F를 통해 전달하는 ASIC을 설계하였다. 본 ASIC에서는 이진화를 위하여 문자 모드에서는 simple threshold와 LAT(local adaptive threshold) 알고리즘을, 그림모드에서는 stucki error diffusion 알고리즘을 적용하였다. 그리고, 구성은 CCD센서 제어블락, 스텝 모타 제어제어블락, 이미지 축소블락, 데이터 이진화 블락, 그리고 DATA I/F 블락 등으로 이루어져 있다. 또한 사용된 technology는 삼성 0.5um CMOS standard cell이며, 크기는 45K gates(내부 메모리 제외)이고, 160QFP package로 구현되었다. ㅎㅁㅅㄷㄴ (soqn apa

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2011.10a
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• pp.335-343
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• 2011

We examined the effect of the acidic liquid from carbonized rice hull(ALCRH) treatments to molded fiber packages(MFP) on weight, Haugh unit, pH and microbial activity of egg to extend the shelf life in egg packaging. Higher concentration and surface spray treatment of the acidic liquid extended the shelf life of egg. ALCRH treatment to MFP improved the performance of the packaging for egg in terms of decreased weight loss and retarded microorganism growth of eggs during storage.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.965-967
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• 1993

In this paper, Take two perment magnets and three iron bars and wind copper wire around one or the bars. This paper demonstrate that the method or calculation yields the right results with MAXWELL-2D program package for computing magnetic field, also indicate the value to which the current in the coil has to be limited to prevent saturation of the iron or the cores. The Finally procedures for design of LDM are discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.