• 한국세라믹학회지
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• 제41권6호
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• pp.435-438
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• 2004

MOCVD is one of the major deposition techniques for Cu thin films and Ta-Si-N is one of promising barrier metal candidates for Cu with high thermal stability. Effects of hydrogen plasma pretreatment of the underlying Ta-Si-N film surface on the Cu nucleation in Cu MOCVD were investigated using scanning electron microscopy, X-ray photoelectron spectroscopy and Auger electron emission spectrometry analyses. Cu nucleation in MOCVD is enhanced as the rf-power and the plasma exposure time are increased in the hydrogen plasma pretreatment. The optimal plasma treatment process condition is the rf-power of 40 Wand the plasma exposure time of 2 min. The hydrogen gas flow rate in the hydrogen plasma pretreatment process does not affect Cu nucleation much. The mechanism through which Cu nucleation is enhanced by the hydrogen plasma pretreatment of the Ta-Si-N film surface is that the nitrogen and oxygen atoms at the Ta-Si-N film surface are effectively removed by the plasma treatment. Consequently the chemical composition was changed from Ta-Si-N(O) into Ta-Si at the Ta-Si-N film surface, which is favorable for Cu nucleation.

• 대한화학회지
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• 제35권6호
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• pp.653-658
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• 1991

Sol-gel법을 통하여 만들어진 비정질 Ta-IPA 괴상과 박막을 $25^{\circ}C$와 $340^{\circ}C$로 열처리한 구조의 차이점과 구조수와의 관계를 TG-DTA, IR과 X-선회절 강도측정으로부터 구한 동경분포곡선 등을 이용하여 알아보았다. 각 시편들을 L-$Ta_2O_5$ 결정의 물성 및 동경분포곡선(calc-RDF)과 비교하였다. 박막은 8면체-$TaO_6$로 괴상보다 작은 cluster로 구성되어 있었다.

• 한국자기학회지
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• 제3권4호
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• pp.314-319
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• 1993

Co-12at%Cr-2at%Ta/Cr-X 자성박막의 자기적성질과 미세구조에 미치는 첨가원소 X(X=Si, Mo, Cu, Gd)의 영향에 대해 조사하였다. Cr-X 하지층 및 CoCrTa 자성층의 두께는 각각 $1000~2000\AA$과 $200~800\AA$이었으며, 기판온도는 $100~200^{\circ}C$로 변화시켰다. Cr-X 하지층은 순수한 Cr 하지층에 비하여 보자력이 100 Oe~200 Oe 이상 증가하였다. Cu는 Gd, Mo, Si보다 높은 보자력 을 나타내는 Cr-X 하지층의 첨가원소 였으며 CoCrTa/Cr-Cu 자성박막은 하지층두께 $1500\AA$과 자성층두께 $600\AA$에서 높은 보자력을 나타내었다.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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• pp.14-19
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• 2002

In this study, as Cu diffusion barrier, tantalum nitrides were successfully deposited on Si(100) substrate and SiO2 by plasma assisted atomic layer deposition(PAALD) and thermal ALD, using pentakis (ethylmethlyamino) tantalum (PEMAT) and $NH_3$ as precursors. The TaN films were deposited on $250^{\circ}$C by both method. The growth rates of TaN films were $0.8{\AA}$/cycle for PAALD and $0.75{\AA}$/cycle for thermal ALD. TaN films by PAALD showed good surface morphology and excellent step coverage for the trench with an aspect ratio of h/w - $1.8 : 0.12 \mu\textrm{m}$ but TaN films by thermal ALD showed bad step coverage for the same trench. The density for PAALD TaN was $11g/\textrm{cm}^3$ and one for thermal ALD TaN was $8.3g/\textrm{cm}^3$. TaN films had 3 atomic % carbon impurity and 4 atomic % oxygen impurity for PAALD and 12 atomic % carbon impurity and 9 atomic % oxygen impurity for thermal ALD. The barrier failure for Cu(200nm)/TaN(l0nm)/$SiO_2(85nm)$/Si structure was shown at temperature above $700^{\circ}$C by XRD, Cu etch pit analysis.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.82-85
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• 2002

In recent years, the tantalum nitride(TaN) thin-film has been developed for the electronic resistor and capacitor. In this papers, this study presents the surface profile and sheet-resistance property relationship of reactive-sputtered TaN thin film resistor processed by buffer of Ti and Cr on alumina substrate. The TCR properties of the TaN films were discussed in terms of reactive gas ratio, ratio of nitrogen, crystallization and thin films surface morphology due to annealing temperature. It is clear that the TaN thin-films resistor electrical properties are low TCR related with it's buffer layer condition. Ti buffer layer thin film resistor having a good thermal stability and lower TCR properties then Cr buffer expected for the application to the dielectric material of passive component.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.537-540
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• 2001

This paper presents the characteristics of Ta-N thin-film for high precision resistors, which were deposited on Si substrate by DC reactive magnetron sputtering in an argon-nitrogen atmosphere(Ar-(4~16 %)$N_2$). Structural properties studied using X-ray diffraction(XRD) indicate the presence of TaN, $Ta_3N_5$ or a mixture of Ta-N phases in the films depending on the amount of nitrogen in the sputtering gas. The chemical composition are investigated by auger electro spectroscopy(AES). The optimized conditions of Ta-N thin-film resistors were deposited in 4 % $N_2$ gas flow ratio. Under optimum conditions, the Ta-N thin-film resistors are obtained a high resistivity, $\rho=305.7{\mu}{\Omega}cm$, a low temperature coefficient of resistance, TCR=-36 $ppm/^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.578-581
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• 1999

The Co-Cr-Ta films are one of the most suitable candidates for perpendicular magnetic recording media. The facing targets sputtering(FTS) system has a advantage of preparing films over a wide range of working gas pressure on plasma-free substrates. In this study, we investigated the effect underlayers on the growths layers of Co-Cr-Ta recording layers. The Co-Cr-Ta/Ti(CoCr) double layers were deposited with sputter gas pressure$(P_N, 0.3-1mTorr)$ by using FTS apparatus at temperature of$40^{\circ}C~-300^{\circ}C$, respectively. Crystallographic and magnetic characteristics were evaluated by x-ray diffractometry(XRD) and vibrating sample magnetometer(VSM), respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.492-495
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• 2000

In order to develop an ultra-thin CoCr perpendicular magnetic recording layer, we prepared CoCrTa/Ti double layer for perpendicular magnetic recording media by new facing targets sputtering system, Crystallgraphics and magnetic characteristics of CoCrTa on underlayer substrate temperature have been investigated. Crystallgraphic and magnetic characteristic of thin films were evaluated by X-ray diffractometry(XRD), vibrating sample magnetometer(VSM) and atomic force microscopy(AFM). The coercivity and anisotropy field was increased by increasing under layer substrate temperature, c-axis orientation of CoCrTa magnetic recording layer was improved 8$^{\circ}$ to 5.6$^{\circ}$when under layer substrate temperature was 250[$^{\circ}C$]. Also, through annealing effect for CoCrTa/Ti double layer, it was certain that crystallgraphics and magnetic characteristics was improved.

• 한국항행학회논문지
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• 제7권2호
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• pp.211-216
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• 2003

본 논문에서는 오래 전부터 NMOS의 게이트 전극으로 사용된 폴리실리콘을 대체할 수 있는 Ta-Ti 합금의 특성에 대해 연구하였다. 실리콘 기판 위에 열적으로 성장된 $SiO_2$ 위에 Ta과 Ti의 두 타깃을 사용하여 co-sputterring 방법으로 Ta-Ti 합금을 증착하였다. 각각의 타깃은 100W의 sputtering power로 증착하여 시편을 제작하였다. 또한 비교 분석을 위하여 Ta을 100W의 sputtering power로 증착한 시편도 제작하였다. 제작된 Ta-Ti 합금 게이트의 열적/화학적 안정성을 검토하기 위하여 $600^{\circ}C$에서 급속열처리를 수행한 결과 소자의 성능 저하는 나타나지 않았다. 또한 전기적 특성 분석 결과 Ta-Ti 합금은 NMOS에 적합한 일함수인 4.13eV를 산출해 낼 수 있었고, 면저항 역시 폴리실리콘에 비해 낮은 값을 얻을 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.639-643
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• 2004

[ $Ta_2O_5$ ]가 첨가된 $Ba(Zn_{1/3}Ta_{2/3})O_3$[BZT] 세라믹은 1:2 규칙화 정도가 증가하고 $Ba_3Ta_5O_{15}의 이차상이 새롭게 형성된다. $1580^{\circ}C$ 보다 높은 온도에서 소결된 BZT 세라믹은 $Ta_2O_5$를 첨가하면 입자의 성장이 일어나고 액상이 형성된다. 품질계수(Q) 값은 $1580^{\circ}C$ 보다 높은 온도에서 소결할 경우 미량의 $Ta_2O_5$ 첨가만으로도 상당히 증가한다. 상대밀도는 $Ta_2O_5$ 첨가량에 따라 감소하기 때문에 Q값의 증가는 상대밀도와는 무관하다. 반면에, $Ta_2O_5$의 첨가량에 따라 입자의 성장은 증가하였기 때문에 Q값의 향상은 입자크기와 관계가 있음을 알 수 있다. 많은 양의 $Ta_2O_5$ 첨가시 비록 입자 크기가 증가했음에도 불구하고 Q값이 매우 낮은 것을 볼 때, Q값의 감소는 $Ba_3Ta_5O_{15}$ 상의 영향과 낮은 밀도 값에 기인한 것이다.