• Korean Journal of Materials Research
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• v.7 no.10
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• pp.877-883
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• 1997

Ar 및 Ar과 $N_{2}$ 분위기하에서 rf 마그네트론 스퍼터링방법으로 Ta-AI과 Ta-AI-N합금막을 제조하였다. Ta-7.9at.% AI계열, Ta-26.7 at% AI게열과 Ta-45.4at.%AI계열에 Ar에 대한 질서유량비로 26%까지 질소를 첨가하여 Ta-AI-N박막을 증착한후, 300-$600^{\circ}C$온도 구산에서 열처리 전후의 구조 및 전기적 특성과 열적안정성을 통하여 레지스터의 적용가능성을 조사하였다. 구조 및 조성 분석은 X-선 회절과 Rutherford Backscattering Spectrometry(RBS)로 관찰하였고 열적안정성은 4단자법(four point probe method)을 이용한 저항변화를 통하여 측정하였다. 순수 Ta에 AI을 첨가하면 확장된 $\beta$($\beta$-Ta)N 합금박막에서 가장 열적안정성이 우수하게 나타났던 질소첨가 범위는 Ta $N_{hcp}$또는 TaN/ sub fcc/또는 Ta $N_{fcc}$와 비정질과의 혼합상순으로 상천이를 나타내었다. Ta-AI-N 합금박막에서 가장 열적안정성이 우수하게 나타났던 질서첨가 범위는 Ta-26.7at. % AI계열의 경우 19-36at.% $N_{2}$구간이었고, Ta-45.5at.% AI계열의 경우는 30-45at.%구간이었다. Ta-AI합금박막은 질소가 첨가되지 않아도 열처리 온도 및 시간에 따라 약 10% 이내의 비교적 작은 저항변화를 보여 열적안정성이 우수하지만 질소를 첨가하여 Ta-AI-N합금박막을 형성시킬경우, 증착된 상태에서 이미 큰 비저항을 나타내었고 열처리 동안 3%이내의 매우 작은 저항변화를 나타내었기 때문에 레지스터용 재료로써 열적안정성에 대한 잠재력이 크다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.10
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• pp.814-820
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• 1991

TaSi$_2$ was formed by rapid thermal annealing(RTA) on BF$_2$ doped single crystalline silicon substrates. The formation and various properties of TaSi$_2$ have been investigated by using 4-point probe, HP414, XRD, and SEM. And the redistribution of boron with RTA has been observed by SIMS. Implanted boron was diffused out into the TaSi$_2$ for RTA temperature but did not significantly affect the formation temperature of TaSi$_2$. Also, the contact resistance for TaSi$_2$/p$^{+}$ region had a low value 22$\Omega$, at contact size of 0.9$\mu$m, and the native oxide formed on Si-substrates by BF$_2$ implantation retarded the formation of TaSi$_2$.

• Korean Journal of Materials Research
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• v.16 no.10
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• pp.614-618
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• 2006

The thermal stability of Cu/Ti(or Ta)/NiSi contacts was investigated. Ti(Ta)-capping layers deposited to form NiSi was utilized as the Cu diffusion barrier. Ti(Ta)/NiSi contacts was thermally stable upto $600^{\circ}C$. However when Cu/Ti(Ta)/NiSi contacts were furnace-annealed at $300{\sim}400^{\circ}C$ for 40 min., the Cu diffusion was found to be effectively suppressed, but NiSi was dissociated and then Ni diffused into the Cu layer to form Cu-Ni solutions. On the other hand, the Ni diffusion did not occur for the Al/Ti/NiSi system. The thermal instability of Cu/Ti(Ta)/NiSi contacts was attributed to the high heat of solution of Ni in Cu.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.65-65
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• 1997

• Proceedings of the Korean Magnestics Society Conference
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• 1995.05a
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• pp.86-87
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• 1995

• Progress in Superconductivity
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• v.13 no.3
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• pp.163-168
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• 2012

The effects of Ta substitution on the superconducting and magnetic properties of the $(Ru_{1-x}Ta_x)Sr_2(Gd_{1.4}Ce_{0.6})Cu_2O_z(0{\leq}x{\leq}0.5)$ system have been investigated. The X-ray diffraction measurements indicate that the Ta ion replaces Ru sites up to x = 0.4. It is found that the Ta substitution for Ru significantly reduces the weak-ferromagnetic component of the field-cooled magnetic susceptibility without an appreciable change of room temperature thermopower at lower Ta doping level below x = 0.2. The resistive transition temperature tends to decrease monotonically from 27 K for the x = 0 sample to 16 K (9 K) for the x = 0.4 (x = 0.5) sample. These results suggest that superconductivity of the $(Ru_{1-x}Ta_x)Sr_2(Gd_{1.4}Ce_{0.6})Cu_2O_z$ compound is not significantly affected by the magnetic state of the Ru sublattice. The experimental results are discussed in connection with previous reports on the effects of Nb substitution.

• Bulletin of the Korean Chemical Society
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• v.15 no.12
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• pp.1098-1103
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• 1994

Atomic force microscopy (AFM) images of two conducting layered transition-metal ditellurides, $TaTe_2$ and $Ta_{0.5}$$V_{0.5}$$Te_2$, were examined and their surface and bulk structural features were compared. All the measured unit cell parameters from AFM image were consistent and in complete agreement with the results of the X-ray diffraction. The microscopic structures of corrugated surface tellurium sheets were strongly affected by the modification of metal double zig-zag chains underneath Te surface. Large difference in the height amplitudes of AFM images in $TaTe_2$ and $Ta_{0.5}$$V_{0.5}$$Te_2$ phases was observed and this reflects large difference in the surface electron densities of two phases. On surface, the shorter intralayer Te…Te contacts in $TaTe_2$ induce more electron transfer from Te p-block bands to Ta d-block bands, thus electron density on surface observed in $TaTe_2$ is much lower than that of $Ta_{0.5}$$V_{0.5}$$Te_2$. However, in bulk, interlayer Te…Te contacts in V substituted phase are shorter than those in $TaTe_2$ phase, thus tellurium-to-metal electron transfer occurs more easily in $Ta_{0.5}$$V_{0.5}$$Te_2$ phase.

• Journal of Acupuncture Research
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• v.20 no.6
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• pp.36-44
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• 2003

Objective: We have various ways in evaluating the level of low back pain as sequelae, general approaches such as neurologic examination, MRI, Radiologic examination and evaluating the effect of psychological stress on the low back pain. Besides We can find another approach to evaluating the sequale of low back pain in TA patients. So, I intend to analyze how much relationship the patients that got low back pain by TA have with Roland Morris Disability Scale(RMS) in 2 months after discharge. Methods: In this article, I will compare two results of TA inpatients and non-TA inpatients, which obtained with the RMS. This study was carried out about 22 TA patients and 18 non-TA patients, who had low back pain and were hospitalized between March 2002 and July 2002. Results & conclusions : 1. RMS point is related with the post-discharge term to a point of time of answering the questionnaire in both TA patients and non-TA patients. 2. In distribution of RMS point, Gr II take most possesion as 41% in TA patients while Gr I take most possesion as 56% in non-TA patients. 3. In distribution of RMS point, patients that correspond to more than Gr III take 27% in TA patients, 16% in non-TA patients. 4. TA patients show higher level of distribution than non-TA patients in RMS point in verifying them by mean value and T-test. 5. Degree of pain score change(${\Delta}$P.S), using mean value and T-test, showed lower level of distribution in TA patients than non-TA patients. 6. We can see that TA patients have more restriction in their life for low back pain.

• Journal of the Korean Ceramic Society
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• v.35 no.10
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• pp.1107-1112
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• 1998

We could obtan c-axis oriented $SrBi_2$$Ta_2$$O_9$ thin films on usual Pt(111)/Ti/$SiO_2$/Si(100) substrate using a r. f. magnetron sputtering technique. According to the increase of sputtering pressure from 250 to 300 mTorr the Bi content and degree of the c-a xis preferred orientation of $SrBi_2$$Ta_2$$O_9$ thin films were increased. By controlling Bi(or $Bi_2O_3$) loss from $SrBi_2$$Ta_2$$O_9$ thin films during post annealing and by inserting $Bi_2O_3$ layer in $SrBi_2$$Ta_2$$O_9$ thin films the effect of Bi content on the c-axis oriented growth of $SrBi_2$$Ta_2$$O_9$ thin films could be investigated without the effect of sputtering pressure. The degree of the c-axis preferred orientation of $SrBi_2$$Ta_2$$O_9$ thin films was increased with increasing with increasing Bi content by control of Bi(or $Bi_2O_3$) loss of $SrBi_2$$Ta_2$$O_9$ thin films. But the c-axis oriented growth of $SrBi_2$$Ta_2$$O_9$ thin films disappeared by the inserting of $Bi_2O_3$ lay-er in $SrBi_2$$Ta_2$$O_9$ thin films.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.847-850
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• 1996

The bi-layered films composed of Co-Cr-Ta layers and paramagnetic $Co_{67}Cr_{33}$ underlayer were deposited by suing Facing Targets Sputtering(FTS). The effects of $Co_{67}Cr_{33}$ underlayer on the crystallographic and magnetic characteristics of the Co-Cr-Ta layer deposited on the underlayer was investigated. The diffraction intensity $I_{p(002)}$ of Co-Cr-Ta layers on the $Co_{67}Cr_{33}$ layer was stronger than that of single layer and Co-Cr-Ta/Ti double layer. Therefore, the crystallinity of Co-Cr-Ta layer was imporved by the $Co_{67}Cr_{33}$ underlayer rather than Ti ones. However, te coercivity H$_{c\bot}$ of Co-Cr-Ta layers deposited on $Co_{67}Cr_{33}$ underlayer was as low as 250 Oe even at substrate temperature of $220^{\circ}C$. This H$_{c\bot}$ decrease seems to be attributed to the effect of the $Co_{67}Cr_{33}$ underlayer as well as interval time between deposition of the underlayer and the Co-Cr-Ta layer.