• 제목/요약/키워드: Ta-N thin film

검색결과 93건 처리시간 0.028초

ULSI용 Electroplating Cu 박막의 미세조직 연구 (Microstructural investigation of the electroplating Cu thin films for ULSI application)

  • 박윤창;송세안;윤중림;김영욱
    • 한국진공학회지
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    • 제9권3호
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    • pp.267-272
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    • 2000
  • electroplating(EP)법을 이용하여 ULSI용 Cu 박막을 제조하였다. seed Cu는 sputtering으로 증착하였으며, 확산방지막으로 TaN를 사용하였다. 제작된 EP Cu 박막은 seed Cu의 영향으로 열처리 조건에 관계없이 Cu(111)방향으로 강하게 우선 배향 하였다. 열처리 온도와 시간이 증가함에 따라 Cu박막의 미세조직이 non-columnar structure에서 약 2배 이상 결정립 성장하여 columnar structure로 바뀌었으며, 또한 as-deposit시 관찰되었던 stacking fault, twin, dislocation들이 상당히 줄어드는 것이 관찰되었다. Cu의 확산에 의하여 생기는 copper-silicide는 관찰할 수 없었으며, 이것은 두께 45nm의 TaN막이 $450^{\circ}C$, 30분 열처리시 확산방지막으로 충분한 역할을 한 것으로 판단된다. Cu(111)우선 배향과 열처리에 의한 결정립 성장 및 defect감소는 Cu 박막의 결정립계에서 발생하는 electromigration 현상을 상당히 줄일 수 있을 것으로 판단된다.

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HF-CVD법에 의한 세라믹스 기판에의 다이아몬드박막 합성과 그 밀착성 평가 (Diamond Film Deposition on Ceramic Substrates by Hot-Filament CVD and Evaluation of the Adhesion)

  • 신순기
    • 한국재료학회지
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    • 제10권8호
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    • pp.575-580
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    • 2000
  • Ta(TaC) 필라멘트를 이용한 HF-CVD 법에 의하여 $Si_3N_4$, SiC, WC, $Al_2O_3$를 기판으로 다이아몬드 박막을 증착하고, 그 밀착특성을 평가하였다. 로내의 $CH_4$농도를 10%로 높게 하였을 경우에는 막중에 graphitic(amorphous) carbon이 생성됨을 확인할 수 있었다. 박막을 $12\mu\textrm{m}$ 정도까지 두껍게 하면, WC기판에서는 부분적 박리형상이 관찰되었으나, $Si_3N_4$를 기판으로 하였을 경우에는 안정한 박막을 얻을 수 있었다. Indentation test 결과로부터 grainding에 의한 기판표 처리가 밀착성 향상에 효과적이라는 것을 알 수 있었다. 또 compression topple test에서는 박막의 두께는 밀착성과 반비례의 관계를 가지는 것을 알 수 있었다. 수 있었다.

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The Effect of the Oxygen Flow Rate on the Electronic Properties and the Local Structure of Amorphous Tantalum Oxide Thin Films

  • Denny, Yus Rama;Lee, Sunyoung;Lee, Kangil;Kang, Hee Jae;Yang, Dong-Seok;Heo, Sung;Chung, Jae Gwan;Lee, Jae Cheol
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.398-398
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    • 2013
  • The electronic properties and the local structure of tantalum oxide thin film with variation of oxygen flow rate ranging from 9.5 to 16 sccm (standard cubic centimeters per minute) have been investigated by X-ray photoelectron spectroscopy (XPS), Reflection Electron Energy Loss Spectroscopy (REELS), and X-ray absorption spectroscopy (XAS). The XPS results show that the Ta4f spectrum for all films consist of the strong spin-orbit doublet $Ta4f_{7/2}$ and $Ta4f_{5/2}$ with splitting of 1.9 eV. The oxygen flow rate of the film results in the appearance of new features in the Ta4f at binding energies of 23.2 eV, 24.4 eV, 25.8, and 27.3 eV, these peaks attribute to $Ta^{1+}$, $Ta^{2+}$, $Ta^{4+}$/$Ta^{2+}$, and $Ta^{5+}$, respectively. Thus, the presence of non-stoichiometric state from tantalum oxide ($TaO_x$) thin films could be generated by the oxygen vacancies. The REELS spectra suggest the decrease of band gap for tantalum oxide thin films with increasing the oxygen flow rate. The absorption coefficient ${\mu}$ and its fine structure were extracted from the fluorescence mode of extended X-ray absorption fine structure (EXAFS) spectra. In addition, bond distances (r), coordination numbers (N) and Debye-Waller factors (${\sigma}^2$) each film were determined by a detailed of EXAFS data analysis. EXAFS spectrapresent both the increase of coordination number of the first Ta-O shell and a considerable reduction of the Ta-O bond distance with the increase of oxygen flow rate.

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Electronic and Optical Properties of amorphous and crystalline Tantalum Oxide Thin Films on Si (100)

  • Kim, K.R.;Tahir, D.;Seul, Son-Lee;Choi, E.H.;Oh, S.K.;Kang, H.J.;Yang, D.S.;Heo, S.;Park, J.C.;Chung, J.G.;Lee, J.C.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.382-382
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    • 2010
  • $TaO_2$ thin films as gate dielectrics have been proposed to overcome the problems of tunneling current and degradation mobility in achieving a thin equivalent oxide thickness. An extremely thin $SiO_2$ layer is used in order to separate the carrier in MOSFETchannel from the dielectric field fluctuation caused by phonons in the dielectric which decreases the carrier mobility. The electronic and optical properties influenced the device performance to a great extent. The atomic structure of amorphous and crystalline Tantalum oxide ($TaO_2$) gate dielectrics thin film on Si (100) were grown by utilizing atomic layer deposition method was examined using Ta-K edge x-ray absorption spectroscopy. By using X-ray photoelectron spectroscopy and reflection electron energy loss spectroscopy (REELS) the electronic and optical properties was obtained. In this study, the band gap (3.400.1 eV) and the optical properties of $TaO_2$ thin films were obtained from the experimental inelastic scattering cross section of reflection electron energy loss spectroscopy (REELS) spectra. EXAFS spectra show that the ordered bonding of Ta-Ta for c-$TaO_2$ which is not for c-$TaO_2$ thin film. The optical properties' e.g., index refractive (n), extinction coefficient (k) and dielectric function ($\varepsilon$) were obtained from REELS spectra by using QUEELS-$\varepsilon$(k, $\omega$)-REELS software shows good agreement with other results. The energy-dependent behaviors of reflection, absorption or transparency in $TaO_2$ thin films also have been determined from the optical properties.

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$SiN_x$유전 보호막이 이동통신용 고주파 SAW필터의 특성에 미치는 영향 (The Effects of $SiN_x$ Dielectric Thin Films on SAW Properties of the High Frequency SAW Filter for Cellular Communication System)

  • 이용의;이재빈;김형준;김영진;양형국;박종철
    • 한국재료학회지
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    • 제5권6호
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    • pp.650-656
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    • 1995
  • 이동통신용 고주파 표면탄성파(SAW) 필터를 36$^{\circ}$Y-X LiTaO$_3$압전기판과 IIDT 전극구조를 이용하여 제작하였다. 제작한 SAW 필터의 중심주파수는 주파수 응답 특성 측정 결과 설계한 중심주파수보다 낮아짐이 관찰되었다. 이러한 단점을 보완하고 미세한 주파수의 조절을 가능하게 하기 위해 SiN$_{x}$ 유전박막을 보호막으로 증착하여 이에 따른 주파수 특성 변화를 관찰하였다. SAW파장에 대한 SiN$_{x}$ 유전 박막의 두께비를 증가시킬수록 SAW 진행 속도가 증가하여, 제조한 필터의 중심주파수를 높게 이동시킬 수 있었다. 그러나 유전박막의 두께가 증가할수록 필터의 삽입손실이 증가하는 문제점이 존재하였다.

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열처리 조건이 PECVD 방식으로 증착된 $Ta_2$$O_5$ 박막 특성에 미치는 영향 (Effect of Annealing Conditions on $Ta_2$$O_5$ Thin Films Deposited By PECVD System)

  • 백용구;은용석;박영진;김종철;최수한
    • 전자공학회논문지A
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    • 제30A권8호
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    • pp.34-41
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    • 1993
  • Effect of high temperature annealing conditions on Ta$_{2}O_{5}$ thin films was investigated. Ta$_{2}O_{5}$ thin films were deposited on P-type silicon substrates by plasma-enhanced chemical vapor deposition (PECVD) using tantalum ethylate. Ta(C$_{2}H_{5}O)_{5}$, and nitrous oxide. N$_{2}$O. The microstructure changed from amorphous to polycrystalline above 700.deg. C annealing temperature. The refractive index, dielectric onstant and leakage current of the film increased as annealing temperature increased. However, annealing in oxygen ambient reduced leakage currents and dielectric constant due to the formation of interfacial SiO$_{2}$ layer. By optimizing annealing temperature and ambient, leakage current lower than 10$^{-8}$ A/cm$^{2}$ and maximum capacitance of 9 fF/${\mu}m^{2}$ could be obtained.

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초고진공 UBM 스퍼터링으로 제조된 라멜라 구조 TaN 박막의 연구 (Lamellar Structured TaN Thin Films by UHV UBM Sputtering)

  • 이기락;;;;이정중
    • 한국표면공학회지
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    • 제38권2호
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    • pp.65-68
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    • 2005
  • The effect of crystal orientation and microstructure on the mechanical properties of $TaN_x$ was investigated. $TaN_x$ films were grown on $SiO_2$ substrates by ultrahigh vacuum unbalanced magnetron sputter deposition in mixed $Ar/N_2$ discharges at 20 mTorr (2.67 Pa) and at $350^{\circ}C$. Unlike the Ti-N system, in which TiN is the terminal phase, a large number of N-rich phases in the Ta-N system could lead to layers which had nano-sized lamella structure of coherent cubic and hexagonal phases, with a correct choice of nitrogen fraction in the sputtering mixture and ion irradiation energy during growth. The preferred orientations and the micro-structure of $TaN_x$ layers were controlled by varing incident ion energy $E_i\;(=30eV\~50eV)$ and nitrogen fractions $f_{N2}\;(=0.1\~0.15)$. $TaN_x$ layers were grown on (0002)-Ti underlayer as a crystallographic template in order to relieve the stress on the films. The structure of the $TaN_x$ film transformed from Bl-NaCl $\delta-TaN_x$ to lamellar structured Bl-NaCl $\delta-TaN_x$ + hexagonal $\varepsilon-TaN_x$ or Bl-NaCl $\delta-TaN_x$ + hexagonal $\gamma-TaN_x$ with increasing the ion energy at the same nitrogen fraction $f_{N2}$. The hardness of the films also increased by the structural change. At the nitrogen fraction of $0.1\~0.125$, the structure of the $TaN_x$ films was changed from $\delta-TaN_x\;+\;\varepsilon-TaN_x\;to\;\delta-TaN_x\;+\;\gamma-TaN_x$ with increasing the ion energy. However, at the nitrogen fraction of 0.15 the film structure did not change from $\delta-TaN_x\;+\;\varepsilon-TaN_x$ over the whole range of the applied ion energy. The hardness increased significantly from 21.1 GPa to 45.5 GPa with increasing the ion energy.

Patterned FeTaN 연자성 박막을 이용한 RF inductor의 제조 (Fabrication of RF Inductor Using FeTaN Patterned Soft Magnetic Films)

  • 배석;김충식;류성룡;남승의;김형준;송재성;마사히로 야마구치
    • 한국자기학회지
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    • 제11권6호
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    • pp.239-244
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    • 2001
  • 최근 연구가 활발히 진행되고 있는 RF 대역에서 사용가능한 인덕터를 제조하여 특성을 평가하였다. 인덕턴스와 Q값을 높이기 위하여 5000 두께의 F $e_{78.81}$T $a_{8.47}$ $N_{12.71}$ 연자성박막을 삽입하였으며, 자성박막의 FMR 공진주파수를 인위적으로 확장시키기 위하여 pattern을 형성시켜 shape anisotropy를 증가시켰다. 또한 코일부분은 lift-off process를 이용하여 제조하였다. 제조된 인덕터의 디자인은 4턴의 rectangular spiral형태였으며, 측정된 특성은 Ti/Ag air-core의 경우 5 GHz까가지 공진이 없었으며 2GHz에서 Q값이 9, 인덕턴스 8.4nH였다. 자성박막을 이용한 경우 9 nH에 공진주파수는 약 700 MHz부근이었다.다.

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Preparation and Characterization of Ultra Thin TaN Films Prepared by RF Magnetron Sputtering

  • ;조현철;이기선
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 추계학술발표대회
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    • pp.32.1-32.1
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    • 2011
  • Ultra thin tantalum nitride (TaNx) films with various thicknesses (10 nm to 40 nm) have been deposited by rf magnetron sputtering technique on glass substrates. The as deposited films were systematically characterized by several analytical techniques such as X-ray diffraction, X-ray photoelectron spectroscopy, field emission scanning electron microscopy, atomic force microscopy, UV-Vis-NIR double beam spectrophotometer and four point probe method. From the XRD results, the as deposited films are in amorphous nature, irrespective of the film thicknesses. The films composition was changed greatly with increasing the film thickness. SEM micrographs exhibited the densely pack microstructure, and homogeneous surface covered by small size grains at lower thickness deposited films. The surface roughness of the films was linearly increases with increasing the films thickness, consequently the transmittance decreased. The absorption edge was shifted towards higher wavelength as the film thickness increases.

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