• Carbon letters
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• 제5권4호
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• pp.159-163
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• 2004

The polymer-ceramic hybrid, known as 'ceramer', was synthesized by a sol-gel process by incorporating different amount of alkoxide as source of silicon in resorcinol-formaldehyde in presence of basic catalyst to get different percentage of silicon in ultimate carbonized composites. FTIR of the ceramer confirms that it is a network of Si-O-Si, Si-O-$CH_2$ and Si-OH type groups linked with benzene ring. Different amount of silicon in the ceramer exhibits varying temperature of thermal stability and lower coefficient of thermal expansion as compared to pure resorcinol-formaldehyde resin. The lower value of CTE in ceramer is due to existence of silica and resorcinol -formaldehyde in co-continuous phase. Unidirectional composites prepared with ceramer matrix and high-strength carbon fibers show lower value of flexural strength at polymer stage as compared to those prepared with resorcinol-formaldehyde resin. However, after heat treatment to $1450^{\circ}C$, the ceramer matrix composites show large improvement in the mechanical properties, i.e. with 7% silicon in the ceramer, the flexural strength is enhanced by 100% and flexural modulus value by 40% as compared to that of pure resorcinol-formaldehyde resin matrix composites.

• 한국세라믹학회지
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• 제20권2호
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• pp.135-146
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• 1983

This study is to investigate the properties of domestic fly ash for utilization as data in regard to fly ash which is by-product of domestic coal powder plants and the possibility of utilization as insulation material of domestic fly ash. Composition refractoriness size distribution density contents of hollow particles and crystalline phase were examined as the properties of domestic fly ash. As to the fired test pieces of fly ash by itself that varied contents of hollow particles with four kinds and of the fly ash-clay-saw dust system linear shrinkage bulk density app. porosity compressive strength thermal conductivity and structures were investigated for the possibility of utilization as an insulation material. The results are as follows : 1. The properties of the fly ash I) The constituent particle of the fly ash is spherical and it contains not a few hollow particles (floats by water 0.30-0.50 floats by $ZnCl_2$ aq.(SpG=1.71) 6.97-16.72%). ii) The chemical compositions of fly ash are $SiO_243.9-54.1%$ , $Al_2O_321.0-30.7%$ Ig loss is 7.4-24.1% and the principal of Ig loss is unburned carbon. iii) Fly ash was not suitable to use for mortar and concrete mixture because Ig. loss value is higher than 5% 2. Utilization as insulation material I) The test pieces of original fly ash floats by water floats by ZnCl2 aq(SpG=1.71) p, p t by ZnCl2 aq.(SpG=1.71) that were fired at 110$0^{\circ}C$ represented 0.11-0.18 kcal/mh$^{\circ}$ C as thermal conductivity value. ii) The test pieces which (76.5-85.5) wt% fly ash-(8.5, 9.5) wt% clay-(5.0-15.0) wt% saw dust system(68.0-72.0) wt% fly ash -(17.0-18.0)wt% clay-(10.0-15.0) wt% saw dust system and 59.5 wt% fly ash-25.5 wt% clay-15.0wt% saw dust system were fired at 110$0^{\circ}C$ the thermal conductivity was less than 0.1Kcal/mh$^{\circ}$ C. iii) In view of thermal conductivity and economic aspect insulation materials which added saw dust as blowing agent and clay as inorganic binder are better than that of fly ash as it is or separated hollow fly ash particles. iv) When the saw dust contents increased in the (59.5-90.0) wt% saw dust system and when amount of clay de-creased and firing temperature decreased under the condition of equal addition of saw dust app. porosity increased but bulk density compressive strength and thermal conductivity decreased.

• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• 한국재료학회지
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• 제15권6호
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• pp.413-418
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• 2005

Perovskite $Pb(Ni_{1/3}Nb_{2/3})O_3-Pb(Zr,Ti)O_3[PNN-PZT]$ ceramics were synthesized by conventional ceramic processing technique. In order to modify piezoelectric properties for sensor application in this system, NiO addition was considered to provide $Ni^{+2}$ as an acceptor, which was known to occupy with B site in the structure. The effect of NiO addition up to $8\;mol\%$ on the following piezoelectric properties as well as sintering properties was investigated. When NiO added more than $1\;mol\%$, average grain size was decreased and second phase was found to form. Moreover, the second phase caused decrease in relative dielectric constant $(\varepsilon_{33}T/\varepsilon0)$, electro-mechanical coupling factor $(k_p)$, and piezoelectric charge constant $(d_{33})$, while increasing mechanical quality factor $(Q_m)$. When $1\;mol\%$ NiO was added, density, dielectric properties and piezoelectric properties were abruptly increased.