• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.108-113
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• 2022

The deep-learning-based measurement method with the through-focus scanning optical microscopy (TSOM) estimated the size of the object using the classification. However, the measurement performance of the method depends on the number of subdivided classes, and it is practically difficult to prepare data at regular intervals for training each class. We propose an approach to measure the size of an object in the TSOM image using the deep-learning regression model instead of using classification. We attempted our proposed method to estimate the top critical dimension (TCD) of through silicon via (TSV) holes with 2461 TSOM images and the results were compared with the existing method. As a result of our experiment, the average measurement error of our method was within 30 nm (1σ) which is 1/13.5 of the sampling distance of the applied microscope. Measurement errors decreased by 31% compared to the classification result. This result proves that the proposed method is more effective and practical than the classification method.