• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.10
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• pp.21-26
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• 2003

In this research, the change of coefficient of thermal expansion (CTE) of graphite/epoxy composite laminate under space environment was measured using fiber optic sensors. Two fiber Bragg grating (FBG) sensors have been adopted for the simultaneous measurement of thermal strain and temperature. Low Earth Orbit (LEO) conditions with high vacuum, ultraviolet and thermal cycling environments were simulated in a thermal vacuum chamber. As a pre-test, a FBG temperature sensor was calibrated and a FBG strain sensor was verified through the comparison with the electric strain gauge (ESG) attached on an aluminun specimen at high and low temperature respectively. The change of the CTE in a composite laminate exposed to space environment was measured for intervals of aging cycles in real time. As a whole, there was no abrupt change of the CTE after 1000 aging cycles. After aging, however, the CTE decreased a Little all over the test temperature range. These changes are caused by outgassing, moisture desorption, matrix cracking etc.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1136-1137
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• 2015

The accelerated thermal aging of chlorosulfonated polyethylene (CSPE) was performed for 0 days, 80.82 days, and 161.63 days at $100^{\circ}C$, which is equivalent to 0y, 40y, and 80y of aging, respectively, at $50^{\circ}C$. The volume electrical resistivity of dried CSPE for 570~630 days after seawater and freshwater soaking, are $1.109{\times}10^{14}{\Omega}{\cdot}cm$, $8.546{\times}10^{13}{\Omega}{\cdot}cm$ and $8.466{\times}10^{13}{\Omega}{\cdot}cm$. The applied voltage rising time of 11~12 second and dielectric breakdown time of 9~11 second of the accelerated thermal aged CSPE is shorter than those of 12~13 and 11~13 second of the non-accelerated thermal aged CSPE, respectively. It is shown that oxidation, fragment and crack are formated at hole of dielectric breakdown in CSPE. The apparent density of dried CSPE for 750 days are $1.555g/cm^3$, $1.595g/cm^3$ 및 $1.597g/cm^3$ according to accelerated thermal aging year, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.5
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• pp.226-232
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• 2021

The relationship between precipitation and coefficient of thermal expansion of Al-6%Si-0.4%Mg-0.9%Cu-(Ti) alloy (in wt.%) after various heat treatments were studied by the thermodynamic analyzer (TMA) and differential scanning calorimetry (DSC). Solution heat treatment of the alloy was carried out at 535℃ for 6 h followed by water quenching, and the samples were artificially aged in the air at 180℃ and 220℃ for 5 h. The coefficient of thermal expansion (CTE) curve showed some residual strain and decreased with increasing aging temperature. The CTE curves changed sharply in the temperature range of 200℃ to 400℃, and the corresponding peak shifted for the aged samples due to the change in the precipitation behavior of the secondary phase. These transformation peaks in the aged sample are related to the volume of the precipitation of the Si phase as determined by DSC analysis. The change in CTE is mainly caused by the precipitation of the Si phase in the Al-Si alloy, and the size of the change occurs simultaneously with the size of the precipitate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.05a
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• pp.17-21
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• 1995

Tw types of Pb(Mn$\sub$1/3/Nb$\sub$2/3/)O$_3$+PZT Ceramics had been fabricated by hot-pressing method. One had cause grain and the other had fine grain doe to Cr$_2$O$_3$ addition. These specimen were poled by applying the DC electric field in various steps. The effects of thermal aging on their piezoelectric characteristics and temperature stability of the frequency were investigated.

• Proceedings of the Korean Nuclear Society Conference
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• 1995.05b
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• pp.635-640
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• 1995

Two techniques for the verification of the phase separation in ferrite phase of primary pressure bounary component materials, the primary cause of thermal aging embrittlement, are presented. Data base of room-temperature Charpy V-notch impact energy during reactor service was estimated as a measure of the degree of embrittlement. The serviceable period of CF-3 and CF-8 alloys as the primary pressure boundary components may be acceptably extended for 60 years of lifetime. However, the integrity of CF-8M alloys can be degraded seriously after several years of service in the nuclear reactor.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.184-184
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• 2013

본 연구에서는 금 합금 도금층의 접촉저항에 미치는 첨가 합금원소의 영향을 조사하였다. 또한 표면실장을 위한 솔더링 공정에서 도금층에 가해지는 열이력이 접촉저항 값에 미치는 영향을 조사하기 위해서, $260^{\circ}C$에서 thermal aging을 실시한 후, 접촉저항을 측정하였다. 합금원소의 종류에 따라서 thermal aging후의 접촉저항 값이 변하는 요인을 조사하기 위해서 XPS를 이용하여 표면분석을 실시하였다.

• Korean Journal of Materials Research
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• v.30 no.9
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• pp.474-479
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• 2020

The effect of precipitation and dissolution of Si on the thermal diffusivity in the Al-Si alloy system is reported in this study and solution heat treatment followed by aging treatment is carried out to determine the effects of heat treatment on the thermal characteristics. The solution treatment is performed at 535 ℃ for 4 and 10 h and then the specimens are cooled by rapid quenching. The samples are aged at 300 ℃ for 4 h to precipitate Si solute. The addition of 9 wt% silicon contents makes the thermal diffusivity decrease from 78 to 74 mm/s² in the cases of solid solution treated and quenched samples. After quenching and aging, the Si solute precipitates on the Al matrix and increases the thermal diffusivity compared with that after the quenched state. In particular, the increase of the thermal diffusivity is equal to 10 mm/s² without relation to the Si contents in the Al-Si alloy, which seems to corresponded to solute amount of Si 1 wt% in the Al matrix.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.2
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• pp.162-168
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• 2009

In this study, disk type of thermal barrier coating system for gas turbine blade was isothermally aged in the furnace changing exposure time and temperature. The aging conditions that delamination occurs were determined by the extensive microscopic analyses and bond tests for each aging condition. The delamination map was drawn from the time-temperature matrix form which summarize the delamination conditions. Finally, a method to draw the delamination life diagram of a thermal barrier coating system by using the delamination map was suggested.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1318-1319
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• 2011

In this paper, we analyzed of growth and electrical characteristics of micro-cracks with thermal effect in PV module. The micro-cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because microcracks accelerated aging by thermal cycling test. according to IEC61215. Before every test, we checked output and EL image of PV module.