• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.962-964
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• 2007

A 14.1-inch reflective type Thin Film Transistor-Electric Phoretic Display was developed at the esolution of 1280 x 900 lines on plastic substrate. All of the processes of TFT were carried out below $100\;^{\circ}C$ on PES plastic films. The process conditions of TFT were optimized for large area TFT-LCD on plastic substrate. At $60^{\circ}C$ high temperature during 160hours, TFT does not delaminate and IV characteristic is also satisfied.

• 전자공학회논문지 IE
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• 제45권1호
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• pp.7-14
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• 2008

본 논문에서는 상용 TFT-LCD 빔 프로젝터를 이용하여 XGA급($1024{\times}768$) 초고해상 공간 광변조기(SLM)를 구현하고 광세기 및 위상변조 특성을 분석하였다. 즉, 상용 빔 프로젝터의 광학 모듈, 프로젝션 램프 및 팬들을 제거한 후 이를 효과적으로 보상할 수 있는 전자회로를 설계 제작 및 추가하여 관련 모듈제거 이전과 동일한 환경을 만들어 줌으로써 XGA급 초고해상 공간 광 변조기를 구현하였다. 구현된 초고해상 TFT-LCD 공간 광 변조기의 특성을 실험한 결과, 그레이 준위에 따른 선형적인 광 세기 및 위상변조 특성을 측정하였고 이를 분석한 결과 현재 상용화되어 있는 고가의 공간 광 변조기와 비교하여 높은 해상도와 위상변조 특성에 대한 우수한 선형성을 확인함으로서 저가의 고해상 공간 광 변조기의 구현은 물론, 이를 통한 광 정보처리 및 3D 디스플레이 시스템 또는 공간 주파수 필터 등의 입력 소자로서의 이용 가능성을 제시하였다.

• 한국진공학회지
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• 제9권3호
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• pp.233-236
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• 2000

TFT-LCD(thin film transistor-liquid crystal display) 패널의 데이터 배선 재료로 사용하기 위하여 AlW(3 wt%)의 Al합금 박막을 dc 마그네트론 스퍼터링 방법으로 유리 기판에 증착하여 열처리전과 열처리 후의 박막 특성을 조사하였다. 또한 TFT-LCD의 식각 공정상에서 발생할 수 있는 chemical attack에 대한 저항성을 확인하기 위하여 순환전압전류법(cyclic voltammetry)을 사용하여 Ag/AgCl 전극에 대한 ITO와 AlW alloy의 전극 전위를 측정하였다. 증착된 박막을 $350^{\circ}C$에서 20분간 열처리하였을 때 AlW 박막은 비저항이 감소하였고 약 $11\;{\mu\Omega}cm$의 다소 높은 비저항 특성을 보였다. 주사전자현미경(SEM)과 원자힘현미경(AFM)으로 표면을 분석한 결과 좋은 힐록방지 특성을 보임을 알 수 있었다. 순환전압전류법을 사용하여 측정한 Ag/AgCl 에 대한 ITO의 전극 전위은 약 -1.8V이었고, AlW alloy의 전위 전극은 W의 wt.%가 3% 이상이었을 때, ITO의 전극 전위보다 작게 나타났다. 따라서 측정된 특성 값을 볼 때 AlW(over 3 wt.%) 박막은 data bus line으로 사용할 수 있는 것으로 나타났다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.85-88
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• 2004

2-inch qVGA (240${\times}$320) TFT-LCD with integrated 6-bit source driver is reported. The pixel density is over than 200ppi and the operation frequency is about 2.8MHz. In order to improve TFT characteristics, TS-SLS (Two-Shot Sequential Lateral Solidification) technology has been employed. A 1:6 demultiplexing scheme has been successfully implemented in the source driver owing to the superb characteristics of the TS-SLS TFTs, which resulted in small driver circuit area.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1165-1167
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• 2007

Delta doping method can separate the threshold voltage control region from the charge transport region in a-Si TFT, whereby the threshold voltage of a TFT could be modified. Threshold voltage could be changed by delta doping, while field effect mobility was estimated to be 80% of that of standard TFT.

• Journal of Information Display
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• 제2권2호
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• pp.27-31
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• 2001

Transistor slicing refers to the use of multiple smaller transistors in implementing a large MOS transistor. What is special about transistor slicing is that it can reduce the effects of device non-uniformity introduced during the fabrication process. The paper presents the idea of transistor slicing and analyzes the benefits of using transistor slicing in the context of Poly-Si TFT-LCD driving.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1781-1784
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• 2007

The increase of repetition rate, the dithering of laser optics, and the extension of pulse duration time are major approaches in improving the picture quality of AMOLEDs fabricated by excimer laser crystallization (ELC). Advanced solid phase crystallization (ASPC) has been developed to improve the uniformity and the process cost. Even though the mobility of ASPC-TFT is lower than that of ELC-TFT, it is high enough to drive AMOLED pixels.

• Journal of Information Display
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• 제1권1호
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• pp.29-31
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• 2000

A 21.6" a-Si:H TFT array for direct conversion X-ray detector with 2480 by 3072 pixels is successfully developed. To obtain X-ray image of satisfactory quality, a novel structure with a storage electrode on BCB is proposed. The structure reduces the parasitic capacitance of data line, which is one of the main sources of signal noise. Also, the structure shows greater resistance to failure than that of the conventional design.

• Journal of Information Display
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• 제10권1호
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• pp.33-36
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• 2009

A new hybrid silicon thin-film transistor (TFT) fabrication process using the DPSS laser crystallization technique was developed in this study to realize low-temperature poly-Si (LTPS) and a-Si:H TFTs on the same substrate as a backplane of the active-matrix liquid crystal flat-panel display (AMLCD). LTPS TFTs were integrated into the peripheral area of the activematrix LCD panel for the gate driver circuit, and a-Si:H TFTs were used as a switching device of the pixel electrode in the active area. The technology was developed based on the current a-Si:H TFT fabrication process in the bottom-gate, back-channel etch-type configuration. The ion-doping and activation processes, which are required in the conventional LTPS technology, were thus not introduced, and the field effect mobility values of $4\sim5cm^2/V{\cdot}s$ and $0.5cm^2/V{\cdot}s$ for the LTPS and a-Si:H TFTs, respectively, were obtained. The application of this technology was demonstrated on the 14.1" WXGA+(1440$\times$900) AMLCD panel, and a smaller area, lower power consumption, higher reliability, and lower photosensitivity were realized in the gate driver circuit that was fabricated in this process compared with the a-Si:H TFT gate driver integration circuit

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.940-943
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• 2005

The characteristics of a-Si:H TFTs with silicon oxide as passivation layer were reported. It was studied that the insulating characteristics and step coverage characteristics of low temperature silicon oxide before applying to a-Si:H TFT fabrications. With the optimum deposition conditions considering electrical and deposition characteristics, low temperature silicon oxide was applied to a-Si:H TFTs. The changes in characteristics of a-Si:H TFTs were analyzed after replacing silicon nitride passivation layer with low temperature silicon oxide layer. This low temperature silicon oxide can be adapted to high resolution a-Si:H TFT LCD panels.