• Title/Summary/Keyword: TFT (thin-film transistor)

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RF Magentron Sputtering deposited by ZnO:Ga thin film characterization for a transparent thin film transistor an application (투명 박막 트랜지스터 응용을 위한 RF Magnetron Sputtering으로 증착된 ZnO:Ga 박막의 특성)

  • Lee, Seok-Jin;Kwon, Soon-Il;Park, Seung-Beum;Jung, Tae-Hwan;Lim, Dong-Gun;Park, Jea-Hwan;Yang, Kea-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.146-147
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    • 2008
  • In this paper we report upon an investigation into the effect of sputter RF power on the electrical properties of Gallium doped zinc oxide (ZnO:Ga) film. Structural, electrical and optical properties of the ZnO:Ga films were investigation in terms of the sputtering power. Working pressure fixed in 5 mtorr and RF powers the variable did with 50~100 W. The result, We were able to without substrate temperature obtain resistivity of $9.3\times10^{-4}{\Omega}cm$ and optical transmittance of 90%.

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Study on the Electrical Characterization of Inverted Staggered Pentacene Thin Film Transistor using Hydrogen Plasma Treatment (수소 플라즈마 처리를 이용한 역스테거드형 펜타센 트랜지스터의 전기적 특성 향상에 대한 연구)

  • 장재원;이주원;김재경;김영철;주병권
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.11
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    • pp.961-968
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    • 2003
  • In order to reach the high electrical quality of organic thin film transistors (OTFTs) such as high mobility and on-off current ratio, it is strongly desirable to study the enhancement of electrical properties in OTFTs. Here, we report the novel method of hydrogen plasma treatment to improve electrical properties in inverted staggered OTFTs based on pentacene as active layer. To certify the effect of this method, we compared the electrical properties of normal device as a reference with those of device using the novel method. In result, the normal device as a reference making no use of this method exhibited a field effect mobility of 0.055 $\textrm{cm}^2$/Vs, on/off current ratio of 10$^3$, threshold voltage of -4.5 V, and subthreshold slope of 7.6 V/dec. While the device using the novel method exhibited a field effect mobility of 0.174 $\textrm{cm}^2$/Vs, on/off current ratio of 10$\^$6/, threshold voltage of -0.5 V, and subthreshold slope of 1.49 V/dec. According to these results, we have found the electrical performances in inverted staggered pentacene TFT owing to this method are remarkably enhanced. So, this method plays a key role in highly improving the electric performance of OTFTs. Moreover, this method is the first time yet reported for any OTFTs.

The nonvolatile memory device of amorphous silicon transistor (비정질실리콘 박막트랜지스터 비휘발성 메모리소자)

  • Hur, Chang-Wu;Park, Choon-Shik
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.6
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    • pp.1123-1127
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    • 2009
  • This paper expands the scope of application of the thin film transistor (TFT) in which it is used as the switching element by making the amorphous silicon TFT with the non-volatile memory device,. It is the thing about the amorphous silicon non-volatile memory device which is suitable to an enlargement and in which this uses the additionally cheap substrate according to the amorphous silicon use. As to, the amorphous silicon TFT non-volatile memory device is comprised of the glass substrates and the gate, which evaporates on the glass substrates and in which it patterns the first insulation layer, in which it charges the gate the floating gate which evaporates on the first insulation layer and in which it patterns and the second insulation layer in which it charges the floating gate, and the active layer, in which it evaporates the amorphous silicon on the second insulation layer the source / drain layer which evaporates the n+ amorphous silicon on the active layer and in which it patterns and the source / drain layer electrode in which it evaporates on the source / drain layer.

Segmentation of Defective Regions based on Logical Discernment and Multiple Windows for Inspection of TFT-LCD Panels (TFT-LCD 패널 검사를 위한 지역적 분별에 기반한 결함 영역 분할 알고리즘)

  • Chung, Gun-Hee;Chung, Chang-Do;Yun, Byung-Ju;Lee, Joon-Jae;Park, Kil-Houm
    • Journal of Korea Multimedia Society
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    • v.15 no.2
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    • pp.204-214
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    • 2012
  • This paper proposes an image segmentation for a vision-based automated defect inspection system on surface image of TFT-LCD(Thin Film Transistor Liquid Crystal Display) panels. TFT-LCD images have non-uniform brightness, which is hard to finding defective regions. Although there are several methods or proposed algorithms, it is difficult to divide the defect with high reliability because of non-uniform properties in the image. Kamel and Zhao disclosed a method which based on logical stage algorithm for segmentation of graphics and character. This method is a one of the local segmentation method that has a advantage. It is that characters and graphics are well segmented in an image which has non-uniform property. As TFT-LCD panel image has a same property, so this paper proposes new algorithm to segment regions of defects based on Kamel and Zhao's algorithm. Our algorithm has an advantage that there are a few ghost objects around the defects. We had experiments to prove performance in real TFT-LCD panel images, and comparing with the FFT(Fast Fourier Transform) method which is used a bandpass filter.

Defect detection based on periodic cell pattern elimination in TFT-LCD cell images (TFT-LCD 셀 영상에서 주기적인 셀 패턴 제거 기반 결함검출)

  • Jung, Yeong-Tak;Lee, Seung-Min;Park, Kil-Houm
    • Journal of Advanced Marine Engineering and Technology
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    • v.41 no.3
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    • pp.251-257
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    • 2017
  • In this paper, an algorithm for detecting defects in thin-film-transistor liquid-crystal display (TFT-LCD) cell images is presented. TFT-LCD cell images typically contain periodic cell patterns that make it difficult to detect defects. We propose an efficient and powerful algorithm for eliminating the cell patterns using magnitude spectrum analysis. The first step was to obtain a spectrum for a cell image using the Fourier transform while eliminating larger coefficients using an adaptive filter. Next, an image without the cell pattern was obtained by using the inverse Fourier transform. Finally, the defect pixels were detected using the STD algorithm. The validity of the proposed method was investigated using real TFT-LCD cell images. The experimental results indicate that the proposed technique is extremely effective for detecting defects in TFT-LCD cell images.

용액 방법을 사용한 TIZO 박막 트랜지스터 제작 및 전기적 특성 조사

  • Seo, Ga;Jeong, Ho-Yong;Lee, Se-Han;Kim, Tae-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.400-400
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    • 2012
  • 산화물 반도체는 넓은 에너지갭을 가지고 높은 이동성과 높은 투명성을 가지기 때문에 초고 속 박막 트랜지스터(Thin film transistor; TFT)에 많이 응용되고 있다. 그러나 ZnO 및 $In_2O_3$ 산화물 반도체를 박막트랜지스터에 사용할 경우 소자가 불안정하여 전기적 성질이 저하되고 문턱전압의 이동이 일어난다. TFT에 사용되는 산화물 반도체로는 GaInZnO, ZrInZnO, HfInZnO 및 GaSnZnO의 전기적 특성에 관한 연구가 많이 되었다. 그러나 titanium-indium-zinc-oxide (TIZO) TFT에 대한 연구는 비교적 적게 수행 되었다. 본 연구에서는 TFTs의 안정성을 향상하기 위하여 TFT의 채널로 사용되는 TiInZnO를 형성하는데 간단한 제조 공정과 낮은 비용의 용액 증착방법을 사용하였다. 졸-겔 전해액은 Titanium (IV) isopropoxide $[Ti(OCH(CH_3)_2)_4]$, 0.1 M Zinc acetate dihydrate $[Zn(CH_3COO)_2{\cdot}2H_2O]$ 그리고 indium nitrate hydrate $[In(NO_3)_3{\cdot}xH_2O]$을 2-methoxyethanol의 용액에 합성하였다. $70^{\circ}C$에서 한 시간 동안 혼합 하였다. Ti의 몰 비율은 10%, 20% 및 40% 로 각각 달리하여 제작하였다. $SiO_2$층 위에 2,500 rpm 속도로 25초 동안 스핀 코팅하여 TFT를 제작하였다. TIZO 박막에 대한 X-선 광전자 스펙트럼 관측 결과는 Ti 몰 비율이 증가함에 따라 Ti 2p1/2피크의 세기가 증가함을 보여주었다. TiZO 박막에 Ti 원자를 첨가하면 $O^{2-}$ 이온이 감소하기 때문에 전하의 농도가 변화하였다. 전하 농도의 변화는 TiZO 채널을 사용하여 제작한 TFT의 문턱전압을 양 방향으로 이동 하였으며 off-전류를 감소하였다. TiZO 채널을 사용하여 제작한 TFT의 드레인 전류-게이트 전압 특성은 on/off비율이 $0.21{\times}107$ 만큼 크며 이것은 TFT 소자로서 우수한 성능을 보여주고 있다.

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Recrystallized poly-Si TFTs on metal substrate (금속기판에서 재결정화된 규소 박막 트랜지스터)

  • 이준신
    • Electrical & Electronic Materials
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    • v.9 no.1
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    • pp.30-37
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    • 1996
  • Previously, crystallization of a-Si:H films on glass substrates were limited to anneal temperature below 600.deg. C, over 10 hours to avoid glass shrinkage. Our study indicates that the crystallization is strongly influenced by anneal temperature and weakly affected by anneal duration time. Because of the high temperature process and nonconducting substrate requirements for poly-Si TFTs, the employed substrates were limited to quartz, sapphire, and oxidized Si wafer. We report on poly-Si TFT's using high temperature anneal on a Si:H/Mo structures. The metal Mo substrate was stable enough to allow 1000.deg. C anneal. A novel TFT fabrication was achieved by using part of the Mo substrate as drain and source ohmic contact electrode. The as-grown a-Si:H TFT was compared to anneal treated poly-Si TFT'S. Defect induced trap states of TFT's were examined using the thermally stimulated current (TSC) method. In some case, the poly-Si grain boundaries were passivated by hydrogen. A-SI:H and poly-Si TFT characteristics were investigated using an inverted staggered type TFT. The poly -Si films were achieved by various anneal techniques; isothermal, RTA, and excimer laser anneal. The TFT on as grown a-Si:H exhibited a low field effect mobility, transconductance, and high gate threshold voltage. Some films were annealed at temperatures from 200 to >$1000^{\circ}C$ The TFT on poly-Si showed an improved $I_on$$I_off$ ratio of $10_6$, reduced gate threshold voltage, and increased field effect mobility by three orders. Inverter operation was examined to verify logic circuit application using the poly Si TFTs.

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The Degradation Characteristics Analysis of Poly-Silicon n-TFT the Hydrogenated Process under Low Temperature (저온에서 수소 처리시킨 다결정 실리콘 n-TFT의 열화특성 분석)

  • Song, Jae-Yeol;Lee, Jong-Hyung;Han, Dae-Hyun;Lee, Yong-Jae
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.9
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    • pp.1615-1622
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    • 2008
  • We have fabricated the poly-silicon thin film transistor(TFT) which has the LDD-region with graded spacer. The devices of n-channel poly-si TFT's hydrogenated by $H_2$ and $H_2$/plasma processes were fabricated for the devices reliability. We have biased the devices under the gate voltage stress conditions of maximum leakage current. The parametric characteristics caused by gate voltage stress conditions in hydrogenated devices are investigated by measuring/analyzing the drain current, leakage current, threshold voltage($V_{th}$), sub-threshold slope(S) and transconductance($G_m$) values. As a analyzed results of characteristics parameters, the degradation characteristics in hydrogenated n-channel polysilicon TFT's are mainly caused by the enhancement of dangling bonds at the poly-Si/$SiO_2$ interface and the poly-Si grain boundary due to dissolution of Si-H bonds. The structure of novel proposed poly-Si TFT's are the simplicities of the fabrication process steps and the decrease of leakage current by reduced lateral electric field near the drain region.

Annealed effect on the Optical and Electrical characteristic of a-IGZO thin films transistor.

  • Kim, Jong-U;Choe, Won-Guk;Ju, Byeong-Gwon;Lee, Jeon-Guk
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.53.2-53.2
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    • 2010
  • 지금까지 능동 구동 디스플레이의 TFT backplane에 사용하고 있는 채널 물질로는 수소화된 비정질 실리콘(a-Si:H)과 저온 폴리실리콘(low temperature poly-Si)이 대표적이다. 수소화된 비정질 실리콘은 TFT-LCD 제조에 주로 사용되는 물질로 제조 공정이 비교적 간단하고 안정적이며, 생산 비용이 낮고, 소자 간 특성이 균일하여 대면적 디스플레이 제조에 유리하다. 그러나 a-Si:H TFT의 이동도(mobility)가 1 cm2/Vs이하로 낮아 Full HD 이상의 대화면, 고해상도, 고속 동작을 요구하는 UD(ultra definition)급 디스플레이를 개발하는데 있어 한계 상황에 다다르고 있다. 또한 광 누설 전류(photo leakage current)의 발생을 억제하기 위해서 화소의 개구율(aperture ratio)을 감소시켜야하므로 패널의 투과율이 저하되고, 게이트 전극에 지속적으로 바이어스를 인가 시 TFT의 문턱전압(threshold voltage)이 열화되는 문제점을 가지고 있다. 문제점을 극복하기 위한 대안으로 근래 투명 산화물 반도체(transparent oxide semiconductor)가 많은 관심을 얻고 있다. 투명 산화물 반도체는 3 eV 이상의 높은 밴드갭(band-gap)을 가지고 있어 광 흡수도가 낮아 투명하고, 광 누설 전류의 영향이 작아 화소 설계시 유리하다. 최근 다양한 조성의 산화물 반도체들이 TFT 채널 층으로의 적용을 목적으로 활발하게 연구되고 있으며 ZnO, SnO2, In2O3, IGO(indium-gallium oxide), a-ZTO(amorphous zinc-tin-oxide), a-IZO (amorphous indium-zinc oxide), a-IGZO(amorphous indium-galliumzinc oxide) 등이 그 예이다. 이들은 상온 또는 $200^{\circ}C$ 이하의 낮은 온도에서 PLD(pulsed laser deposition)나 스퍼터링(sputtering)과 같은 물리적 기상 증착법(physical vapor deposition)으로 손쉽게 증착이 가능하다. 특히 이중에서도 a-IGZO는 비정질임에도 불구하고 이동도가 $10\;cm2/V{\cdot}s$ 정도로 a-Si:H에 비해 월등히 높은 이동도를 나타낸다. 이와 같이 a-IGZO는 비정질이 가지는 균일한 특성과 양호한 이동도로 인하여 대화면, 고속, 고화질의 평판 디스플레이용 TFT 제작에 적합하고, 뿐만 아니라 공정 온도가 낮은 장점으로 인해 플렉시블 디스플레이(flexible display)의 backplane 소재로서도 연구되고 있다. 본 실험에서는 rf sputtering을 이용하여 증착한 a-IGZO 박막에 대하여 열처리 조건 변화에 따른 a-IGZO 박막들의 광학적, 전기적 특성변화를 살펴보았고, 이와 더불어 a-IGZO 박막을 TFT에 적용하여 소자의 특성을 분석함으로써, 열처리에 따른 Transfer Curve에서의 우리가 요구하는 Threshold Voltage(Vth)의 변화를 관찰하였다.

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투명 산화물 트랜지스터

  • Park, Sang-Hui;Hwang, Chi-Seon;Jo, Du-Hui;Yu, Min-Gi;Yun, Seong-Min;Jeong, U-Seok;Byeon, Chun-Won;Yang, Sin-Hyeok;Jo, Gyeong-Ik;Gwon, O-Sang;Park, Eun-Suk
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.13.1-13.1
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    • 2009
  • Transparent electronics has attracted many interests, for it can open new applications for consumer electronics, transportation, business, and military. Among them, display backplane, thin film transistor (TFT) array would be the most attractive application. Many researchers have been investigating oxide semiconductors for transparent channel material of TFT since the report for transparent amorphous oxide semiconductor (TAOS) TFT by Hosono group and ZnO TFT by Wager group. Especially, oxide TFTs have been intensively investigated during a couple of years since the first demonstration of ZnO-TFT driving AM-OLED. Many papers regarding the fabrication and performance of oxide TFTs, and active matrix display driven by oxide TFTs have been reported. Now lots of people have confidence in the competitiveness of oxide TFTs for the backplane of AM-Display. Especially, high mobility, uniformity, fairly good stability, and low cost process make oxide TFTs applied even to a large size AM-OLED. Last year, Samsung mobile display, former SID, reported 12" AM-OLED driven by IZGO-TFT and it seems that the remained issue for the mass production is the bias temperature stability. Here, we will introduce the application of oxide TFT and important issue for oxide TFT to be used for the direct printing.

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